CN112467389B - Electronic equipment - Google Patents

Abstract

The application discloses electronic equipment, and belongs to the technical field of communication. An electronic device includes: the integrated waveguide structure comprises a metal frame, a dielectric antenna and a dielectric integrated waveguide structure, wherein a containing hole is formed in the metal frame, the dielectric antenna is arranged in the containing hole, the dielectric integrated waveguide structure is located on one side of the metal frame, a first gap is formed in the first surface of the dielectric integrated waveguide structure, the first gap is opposite to the dielectric antenna, and the first surface faces the surface of the dielectric antenna. The electronic equipment in the embodiment of the application has better radiation performance.

Description

Electronic equipment

technical field

The present application belongs to the field of electronic technology, and in particular relates to an electronic device.

Background technique

With the development of electronic technology, current electronic devices generally need to be provided with antennas, so that the electronic devices have functions such as communication and network access. In actual use, the inventors have found the following problems in the existing electronic equipment: the radiation performance of the antenna of the current electronic equipment is relatively poor.

Contents of the invention

The purpose of the embodiments of the present application is to provide an electronic device, which can solve the problem of poor radiation performance of the antenna of the current electronic device.

In order to solve the above-mentioned technical problems, the application is implemented as follows:

An embodiment of the present application provides an electronic device, including: a metal frame, a dielectric antenna and a dielectric integrated waveguide structure, the metal frame is provided with an accommodation hole, the dielectric antenna is arranged in the accommodation hole, the The dielectric integrated waveguide structure is located on one side of the metal frame, the first surface of the dielectric integrated waveguide structure is provided with a first slot, the first slot is opposite to the dielectric antenna, and the first surface is the The surface of the dielectric integrated waveguide structure facing the dielectric antenna.

In the embodiment of the present application, the first slot on the dielectric integrated waveguide structure can be used as a slot antenna to generate low-frequency resonance. At the same time, the above-mentioned first slot can also be combined with the dielectric antenna to form a dielectric resonance antenna, that is, the above-mentioned first slot can be used as a The feed source of the antenna causes high-frequency resonance to be generated in the dielectric antenna. In this way, since two resonances can be generated, the radiation performance of the antenna of the electronic device is enhanced.

Description of drawings

FIG. 1 is an exploded view of an electronic device provided by an embodiment of the present application;

FIG. 2 is one of the structural schematic diagrams of an electronic device provided by an embodiment of the present application;

FIG. 3 is the second structural schematic diagram of an electronic device provided by an embodiment of the present application;

FIG. 4 is a third schematic structural diagram of an electronic device provided by an embodiment of the present application;

FIG. 5 is a schematic diagram of the reflection coefficient of an antenna of an electronic device provided by an embodiment of the present application;

FIG. 6 is a diagram of the overall efficiency of an antenna of an electronic device provided by an embodiment of the present application;

FIG. 7 is a radiation pattern diagram of an antenna of an electronic device according to an embodiment of the present application at 60 GHz.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," etc. distinguish Objects are generally of one type, and the number of objects is not limited. For example, there may be one or more first objects. In addition, "and/or" in the specification and claims means at least one of the connected objects, and the character "/" generally means that the related objects are an "or" relationship.

The electronic device provided by the embodiments of the present application will be described in detail below through specific embodiments and application scenarios with reference to the accompanying drawings.

Referring to FIG. 1, as shown in FIG. 1, the embodiment of the present application provides a schematic structural diagram of an electronic device. As shown in FIG. 1, the electronic device includes: a metal frame 10, a dielectric antenna 20 and a dielectric integrated waveguide structure 30, the metal The frame 10 is provided with an accommodating hole 11, the dielectric antenna 20 is disposed in the accommodating hole 11, the dielectric integrated waveguide structure 30 is located on one side of the metal frame 10, and the dielectric integrated waveguide structure 30 A first slit 301 is opened on the first surface, and the first slit 301 is disposed opposite to the dielectric antenna 20 , and the first surface is the surface of the dielectric integrated waveguide structure 30 facing the dielectric antenna 20 .

Among them, the working principle of the embodiment of the present application can be referred to the following expression:

Since the first surface of the dielectric integrated waveguide structure 30 is provided with the first slot 301, like this, the first slot 301 can radiate as a slot antenna, that is, the first slot 301 can produce the first resonance as a slot antenna; 301 is coupled and connected with the dielectric antenna 20, that is, the first slot 301 can be combined with the dielectric antenna 20 to form a dielectric resonant antenna, and the first slot 301 can be used as a feed source of the dielectric resonant antenna, which can excite the second resonance in the dielectric antenna 20, In this way, since two resonances can be generated, the radiation performance of the antenna of the electronic device is enhanced.

It should be noted that the first slot 301 is arranged opposite to the dielectric antenna 20 , which can be understood as: the vertical projection of the first slot 301 on the plane where the dielectric antenna 20 is located coincides with the dielectric antenna 20 .

In addition, referring to FIG. 4 , FIGS. 1-3 in the embodiment of the present application are all enlarged structural views of area A in FIG. 4 .

For example: Referring to Figure 5, Figure N is a schematic diagram of the reflection coefficient of the electronic device provided in the embodiment of the present application. It can be seen from Figure 5 that the antenna of the electronic device provided in the embodiment of the present application can cover 53.7GHz-73GHz, which can meet the requirements of millimeter wave The frequency band requirements of the antenna (generally 57GHz-64GHz); at the same time, see Figure 6, Figure 6 is the total efficiency diagram of the antenna of the electronic device provided by the embodiment of the application, see Figure 7, Figure 7 is the antenna provided by the embodiment of the application Radiation pattern at 60GHz. It can be seen from Figure 6 and Figure 7 that the antenna of the electronic device provided by the embodiment of the present application has an efficiency above -2dB and a maximum gain greater than 4.5dB within the impedance bandwidth, that is, the overall radiation of the antenna of the electronic device provided by the embodiment of the present application Good performance.

Simultaneously, the frequency band corresponding to the first resonance can be the high frequency part in the first frequency band, and the frequency band corresponding to the second resonance can be the low frequency part in the first frequency band. In this way, since the frequency band corresponding to the first resonance corresponds to the second resonance The frequency bands can be close to each other, thereby increasing the radiation bandwidth of the radiation signal of the antenna of the electronic device. It should be noted that the above-mentioned high-band part and low-band part are only relative terms, and specific values are not limited.

In addition, since the dielectric antenna 20 is arranged in the accommodating hole 11, and the accommodating hole 11 is located on the metal frame 10, the first gap 301 on the dielectric antenna 20 and the dielectric integrated waveguide structure 30 can be reduced by other components of the electronic device. The blocking function of the radiation signal, thereby enhancing the radiation performance of the radiation signal of the dielectric antenna 20 and the first slot 301 on the dielectric integrated waveguide structure 30 . The dielectric-integrated waveguide structure 30 is located on one side of the metal frame 10, for example: the dielectric-integrated waveguide structure 30 may be located on the first side of the metal frame 10, and the above-mentioned first side and the screen of the electronic device (also may be called a display screen) The side facing away from the external environment is the same side. Of course, the dielectric integrated waveguide structure 30 may also be located on the second side of the metal frame 10, and the second side may be opposite to the first side.

For example: the dielectric antenna 20 and the dielectric integrated waveguide structure 30 can be used for face or gesture recognition. Compared with the way that the dielectric antenna 20 and the dielectric integrated waveguide structure 30 are arranged under the display screen of the electronic device, this embodiment can reduce the number of display screens. The distortion effect caused by the radiation direction of the radiation signal of the antenna enhances the accuracy and speed of face recognition or gesture recognition, that is, enhances the effect of face recognition and gesture recognition.

In addition, compared with the prior art, the dielectric antenna 20 and the dielectric integrated waveguide structure 30 are arranged in the accommodating hole 11 in this embodiment, so that the size of the antenna in the entire electronic device can be reduced, and at the same time, the The size of the accommodating hole 11 is small, so that the appearance integrity of the metal frame 10 of the entire electronic device is better.

It should be noted that the metal frame 10 can also be used as the radiator of the communication antenna, and the above-mentioned communication antenna can be a non-millimeter wave communication antenna; of course, when the feed source connected to the dielectric integrated waveguide structure 30 is a millimeter wave feed source , then both the slot antenna and the dielectric resonant antenna in this embodiment can be referred to as millimeter wave antennas. In this way, the integrated design of the millimeter-wave antenna and the non-millimeter-wave antenna can be completed on the metal frame 10, that is, the radiator of the non-millimeter-wave antenna is provided with a millimeter-wave antenna, thereby saving the installation space and volume of the antenna in the electronic device; , the aforementioned non-millimeter wave antennas may include cellular (cellular) antennas and non-cellular (no-cellular) antennas.

Wherein, the specific form of the first slit 301 is not limited here, for example: the first slit 301 may be an H-shaped slit, a circular slit, or a rectangular slit.

The shapes of the dielectric antenna 20 and the accommodating hole 11 are not limited here. For example, the dielectric antenna 20 and the accommodating hole 11 may both be rectangular, and of course, may also be circular.

Wherein, the dielectric constant of the dielectric antenna 20 may be greater than 10, for example, the dielectric constant of the dielectric antenna 20 may be within 10-20. In this way, since the dielectric constant of the dielectric antenna 20 is relatively high, the radiation performance of the dielectric antenna 20 can be further enhanced.

As an optional implementation manner, there is a first gap between the dielectric antenna 20 and the inner wall of the accommodating hole 11 . In this way, the insulation effect between the dielectric antenna 20 and the inner wall of the accommodation hole 11 can be further enhanced, and the phenomenon that the dielectric antenna 20 and the inner wall of the accommodation hole 11 radiate to the inner wall of the accommodation hole 11 can be avoided, thereby ensuring that the dielectric The radiation direction of the antenna 20 is mainly concentrated at both ends of the dielectric antenna 20 , thereby enhancing the radiation effect of the dielectric antenna 20 .

As an optional implementation manner, referring to FIGS. 1-3 , the first gap is filled with a second insulating dielectric body 40 . In this way, the insulating effect between the dielectric antenna 20 and the inner wall of the accommodating hole 11 can be further enhanced.

As an optional implementation manner, the second insulating dielectric body 40 is arranged around the dielectric antenna 20 . In this way, the effect of fixing the dielectric antenna 20 can be enhanced, and at the same time, the first gap can be filled with the second insulating dielectric body 40 , so that the effect of waterproof and dustproof can be achieved.

Wherein, the dielectric constant of the second insulating dielectric body 40 may be much smaller than that of the dielectric antenna 20 . And the material of the second insulating medium body 40 may be plastic material or the like.

As an optional implementation, referring to FIGS. 1-2 , the dielectric integrated waveguide structure 30 includes a first metal layer 31 , a substrate 32 and a second metal layer 33 stacked in sequence. The first metal layer 31 faces The dielectric antenna 20 is provided, the first metal layer 31 may constitute at least a part of the first surface, the second metal layer 33 is provided facing away from the dielectric antenna 20, and the first slit 301 is located on the on the first metal layer 31;

The dielectric integrated waveguide structure 30 also includes a plurality of first through holes 311, the first through holes 311 sequentially penetrate through the first metal layer 31, the substrate 32 and the second metal layer 33, each of which The first through hole is filled with a first metal connecting piece.

Wherein, the first metal layer 31 and the second metal layer 33 can be respectively copper layers, and can be respectively fixed on the substrate 32 through a plating process.

Wherein, the above-mentioned plurality of first through holes 311 may be arranged at equal intervals. And the first metal connector can be made of the same material as the first metal layer 31 and the second metal layer 33, of course, the first metal connector can be made of different materials from the first metal layer 31 and the second metal layer 33, and the first The electrical conductivity of the metal conductive connector may be better than that of the first metal layer 31 and the second metal layer 33 .

In this embodiment, the first through hole 311 can constitute a dielectric integrated waveguide (Substrate Integrated Waveguides, SIW) cavity; at the same time, at least one of the first metal layer 31 and the second metal layer 33 can also be grounded through the first through hole 311 can further enhance the grounding performance of the first metal layer 31 and the second metal layer 33 .

It should be noted that the type of the substrate 32 is not limited here. For example, as an optional implementation manner, the substrate 32 may be a printed circuit board, and the printed circuit board may also be a flexible circuit board.

As another optional implementation manner, the substrate 32 is a liquid crystal polymer substrate, and the liquid crystal polymer substrate can also be referred to as an LCP substrate. In this way, when the slot antenna transmits high-frequency signals, the loss is small, and at the same time , can also enhance the stability of the slot antenna radiation signal.

Of course, the distribution manner of the plurality of first through holes 311 in the first metal layer 31 is not limited here, for example: as an optional implementation manner, the plurality of first through holes 311 along the first Edge distribution of the metal layer 31 . In this way, since the first through hole 311 is arranged at the edge position of the first metal layer 31, compared with the way in which the first through hole 311 is arranged at the middle position of the first metal layer 31, the connection between the first metal layer 31 and the second metal layer 31 can be strengthened. The strength of the connection between the metal layers 33 can also enhance the aesthetics and enhance the user experience.

As another optional implementation manner, referring to FIG. 1 , the plurality of first through holes 311 are distributed in a ring shape on the first metal layer 31 , and the first slit 301 is located in the ring shape. In this way, when the SIW cavity emits high-frequency signals, the degree of loss of high-frequency signals and the stability of signal radiation can be further enhanced. At the same time, the radiation performance of the first slot 301 is enhanced because the first slot 301 is located in the ring.

As an optional implementation manner, referring to FIG. 3 , the electronic device includes a feeder 50 , the second metal layer 33 includes a conductive connection part 331 , and the conductive connection part 331 is electrically connected to the feeder 50 . One end of the feeder 50 can be electrically connected to the conductive connection part 331, and the other end can be connected to the feed source, so that the feed to the second metal layer 33 can be realized, and the first slit 301 can be connected through the first through hole 311. Feed, so that the first slot 301 radiates as a slot antenna, and couple and feed the dielectric antenna 20, so that the dielectric antenna 20 radiates.

Wherein, the specific way in which the feed source is fed through the feeder 50 is not limited here, for example: the feeding method can be a way of feeding through the microstrip feeder 50 (that is, the above-mentioned feeder 50 is a microstrip feeder), coaxial feeding At least one of the feeding method and the coplanar waveguide feeding method.

Wherein, the conductive connecting portion 331 may be a linear connecting portion, may also be a rectangular connecting portion, and of course, may also be an arc-shaped connecting portion. The specific manner is not limited here.

Wherein, as an optional implementation manner, referring to FIG. 1 , a second slit 332 is opened on at least one side of the conductive connection portion 331 on the second metal layer 33; or,

A plurality of second through holes are defined on at least one side of the conductive connection portion 331 on the second metal layer 33 .

In this way, the impedance matching of the feeding position (that is, the connection position between the feeder 50 and the conductive connecting part 331 ) can be realized by opening the second slit 332 or the second through hole on at least one side of the conductive connecting part 331 . Therefore, the effect of feeding power to the conductive connection part 331 is better.

It should be noted that the size and number of the second slits 332 , or the size and number of the second through holes can be set according to needs, which are not specifically limited here.

Wherein, as an optional implementation manner, referring to FIG. 3 , the electronic device further includes a radio frequency chip 60, and the substrate is connected to the radio frequency chip 60 through a liquid crystal polymer connection wire. In this way, the radio frequency chip 60 and the liquid crystal polymer connecting wire can be integrated together, thereby reducing the occupied volume and reducing the use cost.

It should be noted that, at this time, the substrate may be a liquid crystal polymer substrate. The substrate can be arranged on the first side (for details, refer to the relevant description of the first side above), and the liquid crystal polymer connection line and the radio frequency chip 60 can be arranged on the side of the display screen away from the external environment.

It should be noted that both the radio frequency chip 60 and the liquid crystal polymer connection line (also referred to as the feeder line 50 ) can be arranged on one side of the display screen 70 of the electronic device.

In addition, components such as a radio frequency transceiver may be disposed on the radio frequency chip 60 .

As an optional implementation, the metal frame 10 is provided with a plurality of accommodating holes 11, and each accommodating hole 11 is provided with the dielectric antenna 20 and the dielectric integrated waveguide structure30. In this way, since the metal frame 10 is provided with a plurality of accommodating holes 11, and each accommodating hole 11 is provided with a dielectric antenna 20 and a dielectric integrated waveguide structure 30, the radiation performance of the electronic device can be enhanced, and different accommodating The dielectric antenna 20 and the dielectric integrated waveguide structure 30 in the hole 11 can realize different functions, thereby increasing the diversity of functions of the electronic device.

Wherein, as an optional implementation manner, the above-mentioned multiple accommodating holes 11 may be distributed in a linear manner; as another optional implementation manner, the above-mentioned multiple accommodating holes 11 may be distributed in an array. In this way, the flexibility and diversity of the distribution manner of the accommodating holes 11 are enhanced, and at the same time, the flexibility and diversity of the distribution manner of the antennas of the electronic equipment can be enhanced, and the radiation effect is further enhanced.

It should be noted that when a plurality of accommodating holes 11 are distributed in an array, and the slot antennas and dielectric resonant antennas in the plurality of accommodating holes 11 are millimeter-wave antennas, there is no need for additional accommodating space on the electronic device to set the millimeter wave antenna. The wave array antenna reduces the volume of the electronic equipment; at the same time, through the array distribution of a plurality of accommodating holes 11, it can also realize broadband and high-gain spatial coverage.

The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementations. The above-mentioned specific implementations are only illustrative and not restrictive. Those of ordinary skill in the art will Under the inspiration of this application, without departing from the purpose of this application and the scope of protection of the claims, many forms can also be made, all of which belong to the protection of this application.

Claims (9)

1. An electronic device, comprising: the dielectric integrated waveguide structure is positioned at one side of the metal frame, a first gap is formed in the first surface of the dielectric integrated waveguide structure, the first gap is arranged opposite to the dielectric antenna, and the first surface is the surface of the dielectric integrated waveguide structure facing the dielectric antenna;

the dielectric integrated waveguide structure comprises a first metal layer, a substrate and a second metal layer which are sequentially stacked, wherein the first metal layer is arranged towards the dielectric antenna, the first metal layer forms at least one part of the first surface, the second metal layer is arranged back to the dielectric antenna, and the first gap is positioned on the first metal layer;

the dielectric integrated waveguide structure further comprises a plurality of first through holes, wherein the first through holes sequentially penetrate through the first metal layer, the substrate and the second metal layer, and each first through hole is filled with a first metal connecting piece;

the first slot is used as a feed source of the dielectric antenna to excite the dielectric antenna to generate second resonance.

2. The electronic device of claim 1, wherein the plurality of first vias are distributed along an edge of the first metal layer.

3. The electronic device of claim 1, wherein the plurality of first vias are distributed in a ring shape on the first metal layer, the first gap being located within the ring shape.

4. The electronic device of claim 1, wherein the electronic device comprises a feed line and the second metal layer comprises a conductive connection electrically connected to the feed line.

5. The electronic device of claim 4, wherein a second gap is formed on the second metal layer and located on at least one side of the conductive connection portion; or,

and a plurality of second through holes are formed in the second metal layer and positioned on at least one side of the conductive connecting part.

6. The electronic device of claim 1, wherein a first gap is provided between the dielectric antenna and an inner wall of the receiving aperture.

7. The electronic device of claim 6, wherein the first gap is filled with a second insulating dielectric body.

8. The electronic device of claim 1, further comprising a radio frequency chip, wherein the substrate is connected to the radio frequency chip by a liquid crystal polymer connection line.

9. The electronic device of claim 1, wherein a plurality of the receiving holes are provided in the metal bezel, and the dielectric antenna is provided in each of the receiving holes.