CN111769728A - A highly integrated motor control system - Google Patents
A highly integrated motor control system Download PDFInfo
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- CN111769728A CN111769728A CN202010735530.6A CN202010735530A CN111769728A CN 111769728 A CN111769728 A CN 111769728A CN 202010735530 A CN202010735530 A CN 202010735530A CN 111769728 A CN111769728 A CN 111769728A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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Abstract
Description
技术领域technical field
本发明涉及IGBT领域,具体涉及一种高度集成化电机控制系统。The invention relates to the field of IGBTs, in particular to a highly integrated motor control system.
背景技术Background technique
传统的电机控制系统,结构上体积一般较大,内部松散,通常采用螺栓连接、 线束连接等方式,元器件之间还需要填充导热硅脂,不仅造成体积大重量大,而 且系统热阻一般比较大,可靠性也不是很理想。The traditional motor control system is generally large in structure and loose in the interior. It usually adopts bolt connection, wire harness connection, etc., and thermal grease needs to be filled between components, which not only results in large volume and weight, but also the thermal resistance of the system is generally relatively high. Large, reliability is not ideal.
而且,元器件一般体积很小,一个个的组装,不管是线束连接还是用螺栓固 定,都需要人工操作,生产效率比较低,不适合自动化批量制造。Moreover, the components are generally small in size, and the assembly one by one, whether it is wire harness connection or bolting, requires manual operation, the production efficiency is relatively low, and it is not suitable for automated batch manufacturing.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种高度集成化电机控制系统,采用了不同方式的 直连互焊工艺,相比市面上的方案可靠性和一致性更好,该设计具有结构紧凑、 集成度高、重量轻、平台扩展灵活等技术特点,同时设计上省去了传统的螺栓连 接和线束连接,装配更加简便,适合自动化批量制造,也为更高自动化程度装配 提供了工艺基础。The purpose of the present invention is to provide a highly integrated motor control system, which adopts different methods of direct interconnection welding technology, and has better reliability and consistency than the solutions on the market. The design has the advantages of compact structure, high integration, Light weight, flexible platform expansion and other technical features, at the same time, the traditional bolt connection and wire harness connection are omitted in the design, the assembly is simpler, suitable for automated batch manufacturing, and also provides a technological basis for assembly with a higher degree of automation.
一种高度集成化电机控制系统,包括控制驱动一体化电路板、IGBT模块、 电容、三相输出母排,传感器用屏蔽罩、三相铜排注塑件和IGBT用散热器,所 述IGBT模块焊接在IGBT用散热器上,IGBT模块每相都由上桥和下桥根IGBT管 构成,且根IGBT管水平并排布置,所述IGBT模块的IGBT集电极和IGBT发射极 与电容的电容输出铜排连接,其输出端与三相输出母排连接;A highly integrated motor control system, including a control and drive integrated circuit board, an IGBT module, a capacitor, a three-phase output busbar, a sensor shield, a three-phase copper bar injection molding and an IGBT radiator, the IGBT module is welded On the IGBT radiator, each phase of the IGBT module is composed of upper bridge and lower bridge root IGBT tubes, and the root IGBT tubes are arranged horizontally side by side. The IGBT collector and IGBT emitter of the IGBT module and the capacitor output copper bar of the capacitor connection, and its output end is connected to the three-phase output busbar;
所述电容和三相铜排注塑件分别安装在IGBT用散热器的两侧,所述三相输 出母排下方设有传感器用屏蔽罩,且三相输出母排与三相铜排注塑件一体成型, 所述控制驱动一体化电路板分别通过电路板安装柱和电路板固定支座固定连接 在电容的外壳和三相铜排注塑件上,并盖住三相输出母排。The capacitor and the three-phase copper-bar injection molded parts are respectively installed on both sides of the IGBT radiator, a shielding cover for the sensor is arranged under the three-phase output busbar, and the three-phase output busbar is integrated with the three-phase copper-bar injection molded parts. Forming, the control-drive integrated circuit board is fixedly connected to the casing of the capacitor and the three-phase copper-bar injection molding through the circuit-board mounting post and the circuit-board fixing support, and covers the three-phase output busbar.
优选的,所述所述IGBT模块的上桥的IGBT集电极和下桥的IGBT发射极分 别与电容的电容输出铜排的正负极连接,所述IGBT模块的IGBT门极直接与控 制驱动一体化电路板焊接。Preferably, the IGBT collector of the upper bridge and the IGBT emitter of the lower bridge of the IGBT module are respectively connected to the positive and negative poles of the capacitor output copper bars of the capacitor, and the IGBT gate of the IGBT module is directly integrated with the control and drive circuit board soldering.
优选的,所述IGBT模块由根IGBT管并排布置组成三相全桥。Preferably, the IGBT module consists of IGBT tubes arranged side by side to form a three-phase full bridge.
优选的,所述电容安装在IGBT用散热器左侧的电容安装槽内,所述三相铜 排注塑件安装在IGBT用散热器右侧的注塑件安装板内,所述IGBT用散热器的前 后端各设有一根水管。Preferably, the capacitor is installed in the capacitor installation slot on the left side of the IGBT radiator, the three-phase copper bar injection molded part is installed in the injection part mounting plate on the right side of the IGBT radiator, and the IGBT radiator There is a water pipe at the front and rear.
优选的,所述IGBT模块通过真空焊接工艺直接焊接在IGBT用散热器上的 IGBT焊接凸台上,所述IGBT焊接凸台的后侧设有一个温度传感器设置块。Preferably, the IGBT module is directly welded on the IGBT welding boss on the IGBT heat sink by a vacuum welding process, and a temperature sensor setting block is provided on the rear side of the IGBT welding boss.
优选的,所述驱动一体化电路板上设有屏蔽罩插槽,且其底部还安装有磁 感应芯片和温度传感器支架,所述温度传感器支架位于温度传感器设置块的正上 方。Preferably, the drive integrated circuit board is provided with a shielding cover slot, and a magnetic induction chip and a temperature sensor bracket are also installed at the bottom thereof, and the temperature sensor bracket is located directly above the temperature sensor setting block.
优选的,所述电容的外侧还设有高压直流正输入端子和高压直流负输入端 子,且电容的顶部设有控制板限位孔,所述电容输出铜排上还连接有母线电压采 样引脚,所述母线电压采样引脚还焊接在控制驱动一体化电路板上。Preferably, the outer side of the capacitor is further provided with a high-voltage DC positive input terminal and a high-voltage DC negative input terminal, and the top of the capacitor is provided with a control board limit hole, and the capacitor output copper bar is also connected with a bus voltage sampling pin , the bus voltage sampling pin is also welded on the control-drive integrated circuit board.
优选的,所述三相铜排注塑件的外侧还设有三相铜排出线口。Preferably, the outer side of the three-phase copper bar injection molding is further provided with a three-phase copper outlet.
本发明的优点在于:结构简单,采用了不同方式的直连互焊工艺,相比市面 上的方案可靠性和一致性更好,该设计具有结构紧凑、集成度高、重量轻、平台 扩展灵活等技术特点,同时设计上省去了传统的螺栓连接和线束连接,装配更加 简便,适合自动化批量制造,也为更高自动化程度装配提供了工艺基础。The advantages of the present invention lie in that: the structure is simple, the direct interconnection welding process in different ways is adopted, and the reliability and consistency are better compared with the solutions on the market. The design has the advantages of compact structure, high integration, light weight, and flexible platform expansion. At the same time, the traditional bolt connection and wire harness connection are omitted in the design, the assembly is simpler, it is suitable for automated batch manufacturing, and it also provides a technological basis for higher automation assembly.
附图说明Description of drawings
图1为本发明装置前侧视角的结构爆炸图;Fig. 1 is the structure exploded view of the front side view of the device of the present invention;
图2为本发明装置后侧视角的结构爆炸图;Fig. 2 is the structure exploded view of the rear side view of the device of the present invention;
其中,1、控制驱动一体化电路板,101、屏蔽罩插槽,102、磁感应芯片, 103、温度传感器支架,2、IGBT模块,201、IGBT集电极,202、IGBT发射极, 203、IGBT门极,3、电容,301、高压直流正输入端子,302、高压直流负输入 端子,303、电容输出铜排,304、母线电压采样引脚,305、控制板限位孔,306、 电路板安装柱,4、三相输出母排,5、传感器用屏蔽罩,6、三相铜排注塑件, 601、电路板固定支座,602、三相铜排出线口,7、IGBT用散热器,701、电容 安装槽,702、注塑件安装板,703、水管,8、IGBT焊接凸台,801、温度传感 器设置块。Among them, 1. Control and drive integrated circuit board, 101, Shield cover slot, 102, Magnetic induction chip, 103, Temperature sensor bracket, 2. IGBT module, 201, IGBT collector, 202, IGBT emitter, 203, IGBT gate Pole, 3. Capacitor, 301, HVDC Positive Input Terminal, 302, HVDC Negative Input Terminal, 303, Capacitor Output Copper Bar, 304, Bus Voltage Sampling Pin, 305, Control Board Limit Hole, 306, Circuit Board Mounting Column, 4. Three-phase output busbar, 5. Shielding cover for sensor, 6. Three-phase copper bar injection molding, 601, Circuit board fixing support, 602, Three-phase copper outlet, 7. Heat sink for IGBT, 701. Capacitor mounting slot, 702, injection molding mounting plate, 703, water pipe, 8. IGBT welding boss, 801, temperature sensor setting block.
具体实施方式Detailed ways
为使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下 面结合具体实施方式,进一步阐述本发明。In order to make the technical means, creation features, achievement goals and effects realized by the present invention easy to understand, the present invention will be further described below in conjunction with the specific embodiments.
如图1至图2所示,一种高度集成化电机控制系统,包括控制驱动一体化电路板1、IGBT模块2、电容3、三相输出母排4,传感器用屏蔽罩5、三相铜排注塑件6和IGBT用散热器7,所述IGBT模块2焊接在IGBT用散热器7上,IGBT模块2每相都由上桥和下桥2根IGBT管构成,且2根IGBT管水平并排布置,所述IGBT模块2的IGBT集电极201和IGBT发射极202与电容3的电容输出铜排303连接,其输出端与三相输出母排4连接;As shown in Figures 1 to 2, a highly integrated motor control system includes a control and drive integrated
所述电容3和三相铜排注塑件6分别安装在IGBT用散热器7的两侧,所述三相输出母排4下方设有传感器用屏蔽罩5,且三相输出母排4与三相铜排注塑件6一体成型,所述控制驱动一体化电路板1分别通过电路板安装柱306和电路板固定支座601固定连接在电容3的外壳和三相铜排注塑件6上,并盖住三相输出母排4。The
所述电容3和三相铜排注塑件6分别安装在IGBT用散热器7的两侧,所述 三相输出母排4下方设有传感器用屏蔽罩5,且三相输出母排4与三相铜排注塑 件6一体成型,所述控制驱动一体化电路板1分别通过电路板安装柱306和电路 板固定支座601固定连接在电容3的外壳和三相铜排注塑件6上,并盖住三相输 出母排4。The
所述所述IGBT模块2的上桥的IGBT集电极201和下桥的IGBT发射极202 分别与电容3的电容输出铜排303的正负极连接,所述IGBT模块2的IGBT门 极203直接与控制驱动一体化电路板1焊接。The
所述IGBT模块2由6根IGBT管并排布置组成三相全桥。The
所述电容3安装在IGBT用散热器7左侧的电容安装槽701内,所述三相铜 排注塑件6安装在IGBT用散热器7右侧的注塑件安装板702内,所述IGBT用散 热器7的前后端各设有一根水管703。The
所述IGBT模块2通过真空焊接工艺直接焊接在IGBT散热器7上的IGBT焊 接凸台8上,所述IGBT焊接凸台8的后侧设有一个温度传感器设置块801。焊 接凸台8用与IGBT模块2与IGBT散热器7焊接并且确保与IGBT散热器7保持 有效的电气间隙。The
所述驱动一体化电路板1上设有屏蔽罩插槽101,且其底部还安装有磁感应 芯片102和温度传感器支架103,所述温度传感器支架103位于温度传感器设置 块801的正上方。The drive integrated
所述电容3的外侧还设有高压直流正输入端子301和高压直流负输入端子 302,且电容3的顶部设有控制板限位孔305,所述电容输出铜排303上还连接 有母线电压采样引脚304,所述母线电压采样引脚304还焊接在控制驱动一体化 电路板1上。母线电压采样引脚304用于控制控制驱动一体化电路板1采集母线 电压,与控制驱动一体化电路板1直接焊接。The outer side of the
所述三相铜排注塑件6的外侧还设有三相铜排出线口602。A three-
具体实施方式及原理:Specific implementation and principle:
选用单管封装的大电流IGBT模块2,三相全桥由6个单管组成,同相桥臂 的上下桥2个单管180度互补布置并组成一相桥臂,6个管子并排布置组成三相 全桥,通过真空焊接工艺与散热器直接焊接,既节省空间,又省去了传统的导热 硅脂,降低了系统热阻;Single-tube packaged high-
IGBT散热器7与电容安装槽701、注塑件安装板702一体化设计,IGBT散 热器7内部采用翅片结构设计,以增大有效散热面积,散热器上下面通过摩擦焊 接工艺焊接成型,结构更加紧凑,散热器表面做镀镍处理;The
电容3安装在电容安装槽701内,位于IGBT模块侧边,电容3的电容输出 铜排303与IGBT模块2输入端子采用激光焊接工艺直连,代替常规的螺栓紧固 连接方式,降低主回路电感,同时提高了系统可靠性;The
温度传感器设置块801位于IGBT模块附近的IGBT焊接凸台8上,并位于 IGBT散热器7出水口位置,温度传感器设置块801上设计一个凹槽,温度温度 传感器预先固定在温度传感器支架103上,温度传感器支架103焊接在控制驱动 一体化电路板1上,控制驱动一体化电路板1安装后温度传感器正好处于凹槽内, 凹槽内预埋导热硅胶,起到固定和传热效果;The temperature
控制器的三相输出母排4与三相铜排注塑件6采用一体化注塑工艺,与IGBT 模块2的输出端子采用激光焊接工艺直接焊接,三相输出母排4另外一端直接与 电机三相绕组连接;The three-phase output busbar 4 of the controller and the three-phase copper bus injection molding part 6 adopt an integrated injection molding process, and are directly welded with the output terminal of the
相电流传感器采用磁感应芯片技术,替代传统的HALL传感器技术,磁感应 芯片集成在控制驱动一体化电路板上,传感器用屏蔽罩5与三相输出母排4一体 化注塑,芯片正下方为三相输出母排4,三相输出母排4下方为传感器用屏蔽罩5,三相输出母排4和传感器用屏蔽罩5之间通过注塑材料绝缘,传感器用屏蔽 罩5通过注塑方式固定;The phase current sensor adopts magnetic induction chip technology to replace the traditional HALL sensor technology. The magnetic induction chip is integrated on the control and drive integrated circuit board. The sensor shield 5 is integrated with the three-phase output busbar 4. The three-phase output is directly below the chip. Busbar 4, the three-phase output busbar 4 is below the sensor shielding cover 5, the three-phase output busbar 4 and the sensor shielding cover 5 are insulated by injection molding materials, and the sensor shielding cover 5 is fixed by injection molding;
控制驱动一体化电路板1采用一体化设计,一体化电路板固定在电容3外壳 和三相铜排注塑件6上,驱动焊盘与IGBT模块2的门极引脚之间锡焊连接,同 时与电容3正极引脚直接焊接,用于母线电压采样。The control-drive integrated
基于上述,本发明结构简单,采用了不同方式的直连互焊工艺,相比市面上 的方案可靠性和一致性更好,该设计具有结构紧凑、集成度高、重量轻、平台扩 展灵活等技术特点,同时设计上省去了传统的螺栓连接和线束连接,装配更加简 便,适合自动化批量制造,也为更高自动化程度装配提供了工艺基础。Based on the above, the present invention has a simple structure, adopts different direct-connect interconnection welding processes, and is more reliable and consistent than the solutions on the market. The design has the advantages of compact structure, high integration, light weight, flexible platform expansion, etc. At the same time, the traditional bolt connection and wire harness connection are omitted in the design, the assembly is simpler, it is suitable for automated batch manufacturing, and it also provides a technological basis for higher automation assembly.
由技术常识可知,本发明可以通过其它的不脱离其精神实质或必要特征的 实施方案来实现。因此,上述公开的实施方案,就各方面而言,都只是举例说明, 并不是仅有的。所有在本发明范围内或在等同于本发明的范围内的改变均被本发 明包含。It is known from the technical common sense that the present invention can be realized by other embodiments without departing from its spirit or essential characteristics. Accordingly, the above-disclosed embodiments are, in all respects, illustrative and not exclusive. All changes within the scope of the present invention or within the scope equivalent to the present invention are encompassed by the present invention.
Claims (8)
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Application publication date: 20201013 |