CN111584760B - Display panel, preparation method of display panel and display device - Google Patents

Abstract

The present invention relates to the display field, and discloses a display panel, a method for preparing the display panel, and a display device. The display panel includes: an array substrate and an encapsulation layer opposite to the array substrate; a first Encapsulating frame glue and second encapsulating frame glue, and the surface of the array substrate facing the encapsulation layer is provided with a light-emitting structure layer, wherein: the first encapsulating frame glue and the second encapsulating frame glue are located at the edge of the array substrate, and the first encapsulating frame glue and the second encapsulation sealant have a closed ring structure, the first encapsulation sealant and the light-emitting structure layer are located in the space enclosed by the second encapsulation sealant, and the projection of the light-emitting structure layer on the array substrate covers at least the first encapsulation sealant The projection on the array substrate; filling the area surrounded by the first encapsulation frame glue and the second encapsulation frame glue; used for isolating external water and oxygen, and improving the service life of the display panel.

Description

A display panel, a method for manufacturing a display panel, and a display device

technical field

The invention relates to the field of display technology, in particular to a display panel, a method for preparing the display panel, and a display device.

Background technique

Organic light-emitting display devices have the advantages of thinness, active light emission, wide viewing angle, fast response, low energy consumption, excellent low temperature and shock resistance, and can realize flexible display. The material in the light-emitting structure layer of the organic light-emitting device (OLED) in the organic light-emitting display device is usually made of a metal material with relatively active chemical properties. The photoelectric characteristics of the OLED are changed, leading to the failure of the OLED device.

Contents of the invention

The invention discloses a display panel, a preparation method of the display panel and a display device, which are used for isolating external water and oxygen and improving the service life of the display panel.

To achieve the above object, the present invention provides the following technical solutions:

In a first aspect, the present invention provides a display panel, comprising: an array substrate and an encapsulation layer disposed opposite to the array substrate;

A first encapsulation sealant and a second encapsulation sealant are provided between the array substrate and the encapsulation layer, and a light-emitting structure layer is provided on the surface of the array substrate facing the encapsulation layer, wherein:

The first packaging sealant and the second packaging sealant are located at the edge of the array substrate, and both the first packaging sealant and the second packaging sealant have a closed ring structure, and the first The packaging sealant and the light-emitting structure layer are located in the space surrounded by the second packaging sealant, and the projection of the light-emitting structure layer on the array substrate at least covers the first packaging sealant on the array substrate projection on

The area enclosed by the first encapsulation sealant and the second encapsulation sealant is filled with filler.

By setting the first packaging sealant and the second packaging sealant between the array substrate and the packaging layer, the connection between the packaging layer and the array substrate is strengthened, and a good barrier effect is achieved by setting multiple packaging plastic frames. In the array The surface of the substrate facing the encapsulation layer is provided with a light-emitting structure layer, and the first encapsulation sealant and the second encapsulation sealant are located at the edge of the array substrate, where the first encapsulation sealant and the second encapsulation sealant both have a closed ring structure, And the enclosed space is filled with filling glue to support and slow down the penetration of water and oxygen into the light-emitting structure layer; but too much encapsulation frame glue will occupy additional width, increasing the frame width, that is, increasing the encapsulation layer The distance from the edge to or the edge of the light-emitting structure layer, in order to ensure the effect of slowing down the penetration of water and oxygen without increasing the width of the frame, here the projection of the light-emitting structure layer on the array substrate at least covers the first encapsulation sealant on the array substrate projection.

Further, the first encapsulation sealant includes: a first sub-encapsulation sealant disposed on the surface of the array substrate facing the encapsulation layer;

a second sub-encapsulation sealant disposed on the surface of the encapsulation layer facing the array substrate;

The edge of the light-emitting structure layer covers the surface of the first sub-encapsulation sealant facing the second sub-encapsulation sealant.

Further, at least two protrusion structures are provided on the side of the array substrate facing the encapsulation layer, wherein:

One of the raised structures is located in the area surrounded by the first encapsulation sealant;

The other protruding structure is located between the first encapsulation sealant and the second encapsulation sealant.

Further, the light-emitting structure layer includes an organic electroluminescent device layer, and a passivation layer located on the side of the organic electroluminescent device layer facing the encapsulation layer, and the organic electroluminescent device layer includes a cathode, located on the The electroluminescent layer on the side of the cathode away from the array substrate, and the anode on the side of the electroluminescent layer away from the cathode;

The electroluminescent layer and the cathode layer are disconnected at the raised structure.

Further, the raised structure is an inverted trapezoid or a rectangle.

Further, the material of the protrusion structure is one or more of inorganic materials, titanium aluminum alloy and photosensitive resin.

Further, the light-emitting structure layer includes an organic electroluminescent device layer, and a passivation layer located on the side of the organic electroluminescent device layer facing the encapsulation layer;

The passivation layer extends between the first encapsulation sealant and the second encapsulation sealant, and the organic electroluminescent device layer is located in the area surrounded by the first encapsulation sealant.

Further, both the passivation layer and the organic electroluminescent device layer extend between the first encapsulation sealant and the second encapsulation sealant.

Further, the material of the first encapsulation sealant and the second encapsulation sealant is polyimide or acrylic.

In a second aspect, the present invention provides a display device, comprising: the display panel described in any one of the first aspect.

In a third aspect, the present invention provides a method for manufacturing a display panel, comprising: an array substrate and an encapsulation layer disposed opposite to the array substrate;

A first encapsulation sealant and a second encapsulation sealant are formed between the array substrate and the encapsulation layer, and a light-emitting structure layer is formed on the surface of the array substrate facing the encapsulation layer, wherein:

The first packaging sealant and the second packaging sealant are located at the edge of the array substrate, and both the first packaging sealant and the second packaging sealant have a closed ring structure, and the first The packaging sealant and the light-emitting structure layer are located in the space surrounded by the second packaging sealant, and the projection of the light-emitting structure layer on the array substrate at least covers the first packaging sealant on the array substrate projection on

The area enclosed by the first encapsulation sealant and the second encapsulation sealant is filled with filler.

For the technical effects brought by the second aspect and the third aspect, please refer to the corresponding technical effects in the first aspect, which will not be repeated here.

Description of drawings

Fig. 1 is a schematic structural view of the light-emitting structure layer provided by the embodiment of the present invention without passing through the encapsulation sealant;

FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of another display panel provided by an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of another display panel provided by an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of another display panel provided by an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of another display panel provided by an embodiment of the present invention.

Icon: 100-array substrate; 200-encapsulation layer; 300-first package frame glue; 310-first sub-package frame glue; 320-second sub-package frame glue; 400-second package frame glue; 500-luminescent structure layer; 510—organic electroluminescent device layer; 520—passivation layer; 600—filling glue; 700—protruding structure.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Encapsulation sealant, such as the first encapsulation sealant 300 and the second encapsulation sealant 400 in Figure 1, too much will occupy an additional width, increasing the width a of the frame, that is, increasing the edge of the encapsulation layer 200 to or the light-emitting structure layer 500 to the edge, in order to ensure the effect of slowing down the penetration of water and oxygen without increasing the width of the frame, here the projection of the light-emitting structure layer 500 on the array substrate 100 at least covers the first encapsulation sealant 300 on the light-emitting structure layer 500 projection.

As shown in FIG. 2 , in a first aspect, an embodiment of the present invention provides a display panel, including: an array substrate 100 and an encapsulation layer 200 disposed opposite to the array substrate 100 ;

A first encapsulation sealant 300 and a second encapsulation sealant 400 are provided between the array substrate 100 and the encapsulation layer 200, and a light emitting structure layer 500 is provided on the surface of the array substrate 100 facing the encapsulation layer 200, wherein:

The first packaging sealant 300 and the second packaging sealant 400 are located at the edge of the array substrate 100, and both the first packaging sealant 300 and the second packaging sealant 400 have a closed ring structure, the first packaging sealant 300 and the light emitting structure The layer 500 is located in the space surrounded by the second encapsulation sealant 400, and the projection of the light emitting structure layer 500 on the array substrate 100 at least covers the projection of the first encapsulation sealant 300 on the array substrate 100; The area surrounded by the two package sealants 400 is filled with a filler 600 .

It should be noted that by providing the first encapsulation sealant 300 and the second encapsulation sealant 400 between the array substrate 100 and the encapsulation layer 200, the connection between the encapsulation layer 200 and the array substrate 100 is strengthened. The plastic frame achieves a good barrier effect. A light-emitting structure layer 500 is provided on the surface of the array substrate 100 facing the encapsulation layer 200. The first encapsulation sealant 300 and the second encapsulation sealant 400 are located at the edge of the array substrate 100. Here, the first Both the encapsulation frame 300 and the second encapsulation frame 400 have a closed ring structure, and the enclosed space is filled with a filler 600 to support and slow down the penetration of water and oxygen into the light-emitting structure layer 500 .

Specifically, the first encapsulation sealant 300 includes: a first sub-encapsulation sealant 310 disposed on the surface of the array substrate 100 facing the encapsulation layer 200 ;

And, the second sub-encapsulation sealant 320 disposed on the surface of the encapsulation layer 200 facing the array substrate 100;

The edge of the light emitting structure layer 500 covers the surface of the first sub-encapsulation sealant 310 facing the second sub-encapsulation sealant 320 .

By setting the encapsulation sealant up and down, the first encapsulation encapsulation 300 is formed by the first sub-encapsulation encapsulation 310 and the second sub-encapsulation encapsulation 320, so that the light-emitting structure layer 500 can overlap with the first encapsulation encapsulation 300 to form a luminous The effect of the structural layer 500 passing through the frame glue slows down the infiltration of water and oxygen, which not only enhances the barrier effect of the package, but also does not significantly increase the frame.

As shown in FIG. 3 , at least two protruding structures 700 are provided on the side of the array substrate 100 facing the encapsulation layer 200 , wherein: one protruding structure 700 is located in the area surrounded by the first encapsulating sealant 300 ;

Another protruding structure 700 is located between the first encapsulation sealant 300 and the second encapsulation sealant 400 .

There are many options for the above-mentioned raised structure 700:

Mode 1, the protruding structure 700 is an inverted trapezoid.

By arranging a multi-circle protruding structure 700 in the area surrounded by the first encapsulation sealant 300 and outside the area surrounded by the first encapsulation sealant 300, and in addition providing a multi-circle encapsulation sealant between the multi-circle inverted trapezoidal structures, especially In order to sandwich the first sub-encapsulation sealant 310 and the second sub-encapsulation sealant 320 of the light-emitting structure layer 500 from top to bottom, further prevent water and oxygen from passing through the region with the inverted trapezoidal structure.

In the manufacture of the OLED light-emitting structure layer 500, the light-emitting structure layer 500 is located on the side of the second encapsulation sealant 400 facing the array substrate 100, and the shape of the display screen can be ignored, and a regular rectangular opening mask can be used with a simple control process. A film layer with a rectangular pattern is fabricated on the array substrate 100 .

In the edge encapsulation area, when making the OLED light-emitting structure layer 500, the light-emitting structure layer 500 is located on the side of the second encapsulation sealant 400 facing the array substrate 100, and the first encapsulation sealant 300 is set to sandwich the light-emitting structure layer 500 from top to bottom. The first sub-package sealant 310 and the second sub-package sealant 320, because the raised structure 700 is an inverted trapezoid, the OLED light-emitting structure layer 500 is disconnected due to the height difference at the top and bottom of the inverted trapezoidal raised structure. In the area enclosed by the inverted trapezoidal structure, a display area is formed, and the way of water and oxygen penetrating inward along the light emitting structure layer 500 is isolated.

As shown in FIG. 4 , the specific light-emitting structure layer 500 includes an organic electroluminescent device layer 510 and a passivation layer 520 located on the side of the organic electroluminescent device layer 510 facing the encapsulation layer 200 . 510 is provided with a passivation layer 520 to better insulate the penetration of water and oxygen into the organic light-emitting electroluminescent layer 510; the organic electroluminescent device layer 510 includes a cathode, an electroluminescent layer located on the side of the cathode away from the array substrate 100, and a The anode on the side of the electroluminescent layer facing away from the cathode; the electroluminescent layer and the cathode layer are disconnected at the raised structure 700 .

Mode 2, the protruding structure 700 is rectangular.

By arranging a multi-circle protruding structure 700 in the area surrounded by the first encapsulation sealant 300 and outside the area surrounded by the first encapsulation sealant 300, in addition, a multi-circle encapsulation encapsulation sealant is provided between the multi-circle rectangular structures, especially The first sub-encapsulation sealant 310 and the second sub-encapsulation sealant 320 sandwich the light-emitting structure layer 500 from top to bottom, further preventing water and oxygen from passing through the area with the rectangular structure.

In the manufacture of the OLED light-emitting structure layer 500, the light-emitting structure layer is located on the side of the second encapsulation sealant facing the array substrate, and the shape of the display screen can be ignored, and a regular rectangular opening mask is used, and a simple control process can be used on the array substrate 100. Make a film layer with a rectangular pattern on it.

In the edge encapsulation area, when making the OLED light-emitting structure layer 500, the light-emitting structure layer 500 is located on the side of the second encapsulation sealant facing the array substrate 100, and the first encapsulation sealant is provided with a first frame sandwiching the light-emitting structure layer 500 from top to bottom. The sub-package frame glue 310 and the second sub-package frame glue 320, because the raised structure 700 is rectangular, the OLED light-emitting structure layer 500 is disconnected due to the height difference at the top and bottom of the rectangular raised structure, and is surrounded by the rectangular structure. In the forming area, a display area is formed, and the way of water and oxygen penetrating inward along the light emitting structure layer 500 is isolated.

As shown in FIG. 4 , the specific light-emitting structure layer 500 includes an organic electroluminescent device layer 510 and a passivation layer 520 located on the side of the organic electroluminescent device layer 510 facing the encapsulation layer 200 . 510 is provided with a passivation layer 520 to better insulate the penetration of water and oxygen into the organic electroluminescent device layer 510; the organic electroluminescent device layer 510 includes a cathode, an electroluminescent layer located on the side of the cathode away from the array substrate 100, and the anode on the side of the electroluminescent layer away from the cathode; the electroluminescent layer and the cathode layer are disconnected at the raised structure 700 .

Specifically, the material of the protruding structure 700 is inorganic materials such as silicon nitride and silicon oxide, and multi-layer metals such as titanium aluminum alloy, which are formed by wet and dry etching after chemical and physical deposition.

In addition, the material of the inverted trapezoidal structure can also be a photosensitive resin, which is developed and cured by one or more exposures.

As shown in FIG. 5, the array substrate 100 and the encapsulation layer 200 disposed opposite to the array substrate 100; a first encapsulation sealant 300 and a second encapsulation sealant 400 are provided between the array substrate 100 and the encapsulation layer 200, and the array substrate 100 The surface facing the encapsulation layer 200 is provided with a light-emitting structure layer 500. The light-emitting structure layer 500 divides the first encapsulation sealant 300 into a first sub-encapsulation encapsulation 310 and a second sub-encapsulation encapsulation 320. The specific light-emitting structure layer 500 includes an organic electrical The luminescent device layer 510 , and the passivation layer 520 located on the side of the organic electroluminescent device layer 510 facing the encapsulation layer 200 .

The material of the passivation layer 520 is silicon nitride, metal oxide, and is made by chemical or physical deposition process, and the film forming area is consistent with the organic electroluminescence device layer 510 to share a mask.

The passivation layer 520 extends between the first encapsulation sealant 300 and the second encapsulation sealant 400 , and the organic electroluminescent device layer 510 is located in the area surrounded by the first encapsulation sealant 400 .

As shown in FIG. 6, the array substrate 100 and the encapsulation layer 200 disposed opposite to the array substrate 100; a first encapsulation sealant 300 and a second encapsulation sealant 400 are provided between the array substrate 100 and the encapsulation layer 200, and the array substrate 100 The surface facing the encapsulation layer 200 is provided with a light-emitting structure layer 500. The light-emitting structure layer 500 divides the first encapsulation sealant 300 into a first sub-encapsulation encapsulation 310 and a second sub-encapsulation encapsulation 320. The specific light-emitting structure layer 500 includes an organic electrical The luminescent device layer 510 , and the passivation layer 520 located on the side of the organic electroluminescent device layer 510 facing the encapsulation layer 200 .

The projections of the passivation layer 520 and the organic electroluminescent device layer 510 on the array substrate 100 at least cover the projection of the first encapsulation sealant 300 on the array substrate 100 , and the organic electroluminescence device layer 510 is located on the first encapsulation sealant 300 In the enclosed area, and between the first sub-encapsulation sealant 310 and the second sub-encapsulation sealant 320, and the passivation layer 520 covers the organic light-emitting electroluminescent device layer 510 and extends to the first encapsulation sealant 300 and the second sub-encapsulation sealant 320. between the second encapsulation sealants 400 .

In addition, the materials of the first encapsulation frame 300 and the second encapsulation frame 400 are UV-cured or heat-cured, acrylic, and polyimide-based organic materials; they are coated at the corresponding positions by needle coating, printing and other processes. Curing and forming.

The first sub-encapsulation sealant 310 in the above-mentioned first package sealant 300 can also be silicon nitride, silicon oxide, relatively inactive metals, such as molybdenum, titanium, etc., through chemical and physical deposition, in dry or wet The required pattern is formed on the corresponding area of the edge of the array substrate 100 by etching.

The first sub-package frame glue 310 and the second sub-package frame glue 320 may be organic materials such as acrylic added with water-absorbing materials such as calcium oxide, and further slow down the infiltration of water vapor through water absorption.

In a second aspect, a display device provided by an embodiment of the present invention includes: the display panel according to any one of the first aspect.

In a third aspect, a method for manufacturing a display panel provided by an embodiment of the present invention includes: an array substrate 100 and an encapsulation layer 200 disposed opposite to the array substrate 100;

A first encapsulation sealant 300 and a second encapsulation sealant 400 are formed between the array substrate 100 and the encapsulation layer 200, and a light emitting structure layer 500 is formed on the surface of the array substrate 100 facing the encapsulation layer 200, wherein:

The first packaging sealant 300 and the second packaging sealant 400 are located at the edge of the array substrate 100, and both the first packaging sealant 300 and the second packaging sealant 400 have a closed ring structure, the first packaging sealant 300 and the light emitting structure The layer 500 is located in the space surrounded by the second encapsulation sealant 400, and the projection of the light emitting structure layer 500 on the array substrate 100 at least covers the projection of the first encapsulation sealant 300 on the array substrate 100;

The area surrounded by the first encapsulation sealant 300 and the second encapsulation sealant 400 is filled with a filler 600 .

As shown in FIG. 5 and FIG. 6, there are two methods for the preparation process of the display panel as follows:

Method 1: The array substrate 100 is arranged opposite to the encapsulation layer 200 , and the raised structure 700 is formed on the side of the array substrate 100 facing the encapsulation layer 200 , and the first encapsulation sealant 300 is formed between the array substrate 100 and the encapsulation layer 200 . The first sub-encapsulation sealant 310 , and then the organic electroluminescent device layer 510 in the light emitting structure layer 500 is formed on the surface of the array substrate 100 facing the packaging layer 200 , and then the organic electroluminescent device layer 510 facing the packaging layer 200 A passivation layer 520 is formed on one side, and a second sub-package sealant 320 is formed on the side of the passivation layer 520 facing the encapsulation layer 200, so that the bonding of the second sub-package sealant 320 and the encapsulation layer 200 is realized. The edge portion of the substrate 100 is formed with a second encapsulation sealant 400 , and then the area surrounded by the first encapsulation sealant 300 and the second encapsulation sealant 400 is filled with a filler 600 , so that the encapsulation layer 200 and the array substrate 100 are attached to each other. Here, the first sub-encapsulation sealant 310 in the first encapsulation sealant 300 is made between the array substrate 100 and the encapsulation layer 200, and the latter is selected in a process environment of dry air, vacuum or an anhydrous oxygen atmosphere. production of other steps.

Method 2: The array substrate 100 is arranged opposite to the encapsulation layer 200, and the raised structure 700 is formed on the side of the array substrate 100 facing the encapsulation layer 200, and the light-emitting structure layer 500 is first formed between the array substrate 100 and the encapsulation layer 200. electroluminescent device layer 510, and then form the first sub-encapsulation sealant 310 in the first encapsulation sealant 300 on the organic electroluminescent device layer 510, and then form a A passivation layer 520 is formed on the side of the passivation layer 520, and a second sub-package sealant 320 is formed on the side of the passivation layer 520 facing the encapsulation layer 200. 100, the second encapsulation sealant 400 is formed, and then the area surrounded by the first encapsulation sealant 300 and the second encapsulation sealant 400 is filled with a filler 600, so that the encapsulation layer 200 and the array substrate 100 are bonded together. ; Here, the first sub-encapsulation sealant 310 in the first encapsulation sealant 300 is made between the array substrate 100 and the encapsulation layer 200, and it is selected to be produced in a process environment of dry air, vacuum or an anhydrous oxygen atmosphere.

Apparently, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims (10)

1. A display panel, comprising: the array substrate and the packaging layer are arranged opposite to the array substrate;

a first packaging frame adhesive and a second packaging frame adhesive are arranged between the array substrate and the packaging layer, and a light-emitting structure layer is arranged on the surface of the array substrate facing the packaging layer, wherein:

the first packaging frame glue and the second packaging frame glue are positioned at the edge part of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, the first packaging frame glue and the light emitting structure layer are positioned in a space surrounded by the second packaging frame glue, and the projection of the light emitting structure layer on the array substrate at least covers the projection of the first packaging frame glue on the array substrate;

filling glue is filled in an area enclosed by the first packaging frame glue and the second packaging frame glue;

the first sealant includes: the first sub-packaging frame glue is arranged on the surface of one side, facing the packaging layer, of the array substrate;

the second sub-packaging frame glue is arranged on the surface of one side, facing the array substrate, of the packaging layer;

the edge of the light emitting structure layer covers the surface of the first sub-packaging frame glue facing the second sub-packaging frame glue.

2. The display panel of claim 1, wherein a side of the array substrate facing the encapsulation layer is provided with at least two protruding structures, wherein:

the protruding structure is positioned in an area surrounded by the first packaging frame glue;

the other protruding structure is located between the first packaging frame glue and the second packaging frame glue.

3. The display panel according to claim 2, wherein the light emitting structure layer comprises an organic electroluminescent device layer and a passivation layer on a side of the organic electroluminescent device layer facing the encapsulation layer, the organic electroluminescent device layer comprises a cathode, an electroluminescent layer on a side of the cathode facing away from the array substrate, and an anode on a side of the electroluminescent layer facing away from the cathode;

the electroluminescent layer and the cathode layer are disconnected at the raised structures.

4. The display panel according to claim 2 or 3, wherein the convex structure is an inverted trapezoid or a rectangle.

5. The display panel according to claim 2 or 3, wherein the material of the convex structure is one or more of an inorganic material, a titanium-aluminum alloy, and a photosensitive resin.

6. The display panel according to claim 1, wherein the light emitting structure layer comprises an organic electroluminescent device layer and a passivation layer on a side of the organic electroluminescent device layer facing the encapsulation layer;

the passivation layer extends to a position between the first packaging frame glue and the second packaging frame glue, and the organic electroluminescent device layer is located in a region surrounded by the first packaging frame glue.

7. The display panel of claim 6, wherein the projections of the passivation layer and the organic electroluminescent device layer on the array substrate at least cover the projection of the first sealant on the array substrate.

8. The display panel according to claim 1, wherein the first sealant and the second sealant are made of: polyimide or acrylic acid.

9. A display device, comprising: the display panel of any one of claims 1-8.

10. A method for manufacturing a display panel, comprising: the array substrate and the packaging layer are arranged opposite to the array substrate;

a first packaging frame glue and a second packaging frame glue are formed between the array substrate and the packaging layer, and a light emitting structure layer is formed on the surface of the array substrate facing the packaging layer, wherein:

the first packaging frame glue and the second packaging frame glue are positioned at the edge part of the array substrate, the first packaging frame glue and the second packaging frame glue are both provided with a closed annular structure, the first packaging frame glue and the light emitting structure layer are positioned in a space surrounded by the second packaging frame glue, and the projection of the light emitting structure layer on the array substrate at least covers the projection of the first packaging frame glue on the array substrate;

filling glue in a region enclosed by the first packaging frame glue and the second packaging frame glue;

the first sealant includes: the first sub-packaging frame glue is arranged on the surface of one side, facing the packaging layer, of the array substrate;

the second sub-packaging frame glue is arranged on the surface of one side, facing the array substrate, of the packaging layer;

the edge of the light emitting structure layer covers the surface of the first sub-packaging frame glue facing the second sub-packaging frame glue.

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