CN111211251B

CN111211251B - Method for peeling off mother protective film and method for manufacturing organic light emitting display device using the same

Info

Publication number: CN111211251B
Application number: CN201911146759.XA
Authority: CN
Inventors: 郑智元; 金荣志; 嚴艺苏; 李荣勳
Original assignee: Samsung Display Co Ltd
Current assignee: Samsung Display Co Ltd
Priority date: 2018-11-22
Filing date: 2019-11-21
Publication date: 2024-06-11
Anticipated expiration: 2039-11-21
Also published as: TWI863943B; EP3657565B1; CN111211251A; KR20200060654A; EP3657565A1; US11201317B2; US20200168848A1; TW202036957A; KR102552270B1

Abstract

The present application relates to a method for peeling a mother protective film from a mother display panel and a method for manufacturing an organic light-emitting display device. The method for peeling a mother protective film from a mother display panel includes: stacking a mother protective film on a mother display panel, the mother display panel including a plurality of display units and a peripheral area located in an outer portion of the display unit, the plurality of display units each including a display area; forming a target area and a dummy area on the mother protective film by forming a cutting line having a closed loop shape corresponding to the display unit and an additional cutting line located in a first direction near the cutting line, wherein the cutting line surrounds the target area; arranging a fixing member on the mother protective film in the target area surrounded by the cutting line; and physically peeling the dummy area from the mother display panel.

Description

Method of peeling mother protective film and method of manufacturing organic light emitting display device using the same

Cross Reference to Related Applications

The present application claims priority and equity from korean patent application No. 10-2018-0145651 filed on 11/22 of 2018, which is incorporated herein by reference for all purposes as if fully set forth herein.

Technical Field

Exemplary embodiments of the present invention generally relate to a method of peeling a mother protective film and a method of manufacturing an organic light emitting display device using the same, whereby process efficiency may be improved and costs may be reduced.

Background

The organic light emitting display apparatus includes a substrate, an organic light emitting device on the substrate, and a package member packaging the organic light emitting device. Unlike when an encapsulation member formed of glass is used, when an encapsulation member having a thin film structure including an organic layer and an inorganic layer is used, a protective film may be temporarily or permanently disposed on the encapsulation member to protect the thin encapsulation member and to protect the organic light emitting device from external impurities.

The organic light emitting display device is manufactured by simultaneously manufacturing a plurality of display units on a mother substrate and then dicing the mother substrate to separate the plurality of display units and performing a subsequent process such as a module attaching operation on each of the display units. The dicing process is performed by forming dicing lines in a peripheral area outside the display area of the display unit. Dicing is performed using a wheel when combining a glass lower substrate with a glass upper substrate. When combining the flexible lower substrate with the thin film encapsulation member, dicing may be performed using a laser. However, when the protective film is attached on the combination of the glass lower substrate and the thin film packaging member, it is difficult to perform the dicing operation.

The above information disclosed in the background section is only for the understanding of the background of the inventive concept and, therefore, it may contain information that does not form the prior art.

Disclosure of Invention

Methods according to exemplary implementations of the present invention include a method of peeling a mother protective film and a method of manufacturing an organic light emitting display device, which have increased process efficiency and reduced costs.

Additional features of the inventive concepts will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the inventive concepts.

According to one or more embodiments of the present invention, a method of peeling a mother protective film from a mother display panel includes: laminating a mother protective film on a mother display panel, the mother display panel including a plurality of display units each including a display region and a peripheral region located in an outer portion of the display unit; forming a target region and a dummy region on the mother protective film by forming a cut line having a closed-loop shape corresponding to the display unit and an additional cut line located in a first direction in the vicinity of the cut line, wherein the cut line surrounds the target region; disposing a fixing member on the mother protective film in a target area surrounded by the cutting line; and physically peeling the dummy area from the mother display panel.

The depths of the cutting lines and the additional cutting lines may be smaller than the thickness of the mother protective film.

The cut lines and the additional cut lines may be formed using a laser beam.

The laser beam may comprise a CO ₂ laser.

The cut lines and the additional cut lines may be formed using a cutter.

The cut line and the additional cut line may be formed using an ultrasonic cutter including a vibrator and a blade.

The fixing member may include a fixing plate and a supporting portion vertically connected to the fixing plate.

A buffer member may be further disposed between the fixing plate and the female protective film.

The fixing member may include a magnetic material.

The disposing of the fixing member may include: a table having magnetic properties is disposed on a lower surface of the mother display panel.

The fixation member may be arranged in a dot shape within the target area.

The fixation member may be disposed within the target area in a closed loop shape.

Physically stripping the dummy region may include: an external force is applied along the additional cutting line in a first direction.

The additional cut lines may be connected to the cut lines.

At least one end of the additional cutting line may be formed within the cutting line.

The additional cut lines may be spaced apart from the cut lines.

The target region having a closed loop shape may have a smaller area than the display unit.

The mother protective film may include an adhesive layer attached to the mother display panel and a base substrate disposed on the adhesive layer.

The method of peeling the mother protective film may further include: before physically peeling the dummy region and after disposing the fixing member, the dummy region is irradiated with Ultraviolet (UV) light to reduce an adhesive force of a portion of the adhesive layer corresponding to the dummy region.

The method of peeling the mother protective film may further include: after physically stripping the dummy region: removing the fixation member from the target area; and irradiating the target region with UV light to increase the adhesive force of a portion of the adhesive layer corresponding to the target region.

Illuminating the target region may include: disposing a mask having an opening corresponding to the target region on the mother protective film; and irradiating the target area with UV light.

According to one or more embodiments of the present invention, a method of manufacturing an organic light emitting display device includes: forming a mother display panel on a mother substrate, the mother display panel including a display unit and a peripheral region disposed in an outer portion of the display unit, wherein the display unit includes a plurality of organic light emitting devices and a package member that packages the plurality of organic light emitting devices; laminating a mother protective film on the mother display panel; forming a target region and a dummy region on the mother protective film by forming a cut line having a closed-loop shape corresponding to the display unit and an additional cut line located in a first direction in the vicinity of the cut line, wherein the cut line surrounds the target region; disposing a fixing member on the mother protective film in a target area surrounded by the cutting line; physically peeling the dummy area from the mother display panel; removing the fixing member, and then dividing the mother display panel into a plurality of display units by dicing the mother display panel; and processing edges of the plurality of display elements.

The master substrate may be diced using a wheel cutting device.

The mother substrate may be diced by applying a force to the wheel cutting device in a direction from the mother protective film to the mother substrate.

Processing the edges of the display unit may include: at least one corner portion of the display unit is rounded.

Processing the edges of the display unit may include: the edges of the display element are polished.

The encapsulation member may include at least one organic layer and at least one inorganic layer.

The method may further comprise: before laminating the mother protective film, a touch layer is formed on the encapsulation member.

The mother protective film may further include a polarizing function.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the principles of the invention.

Fig. 1 is a flowchart of a method of manufacturing an organic light emitting display device according to a first exemplary embodiment.

Fig. 2A, 2B, 2C, 2D, 2E, and 2F are plan views illustrating a method of manufacturing an organic light emitting display device according to a first exemplary embodiment.

Fig. 3 is a schematic cross-sectional view of region a of fig. 2B.

Fig. 4 is a schematic cross-sectional view of region B of fig. 2C.

Fig. 5 is a schematic cross-sectional view of a state in which the buffer member is disposed between the fixing member and the female protective film.

Fig. 6A, 6B, 6C, 6D, 6E, 6F, and 6G are schematic plan views illustrating a method of manufacturing an organic light emitting display device according to a comparative example.

Fig. 7 is a schematic plan view illustrating a method of manufacturing an organic light emitting display device according to a second exemplary embodiment.

Fig. 8A and 8B are plan views showing various modified examples of the magnet member.

Fig. 9 and 10 are plan views showing modified examples of the cutting line and the first additional cutting line.

Fig. 11A, 11B, and 11C are schematic plan views illustrating a method of manufacturing an organic light emitting display device according to a third exemplary embodiment.

Fig. 12A, 12B, and 12C are schematic plan views illustrating a method of manufacturing an organic light emitting display device according to a fourth exemplary embodiment.

Detailed Description

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are words of interchangeability that are non-limiting examples of devices or methods employing one or more of the inventive concepts disclosed herein. It is apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the various exemplary embodiments. In addition, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, the specific shapes, configurations, and characteristics of the exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

Unless specified otherwise, the exemplary embodiments shown should be understood as providing exemplary features of varying detail of certain ways in which the inventive concept may be practiced. Thus, unless otherwise specified, features, components, modules, layers, films, panels, regions, and/or aspects of the various embodiments, etc. (hereinafter referred to individually or collectively as "elements") may be otherwise combined, separated, interchanged, and/or rearranged without departing from the inventive concepts.

The use of cross-hatching and/or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless specified, the presence or absence of cross-hatching or shading does not convey or represent any preference or requirement for a particular material, material property, dimension, proportion, commonality between illustrated elements, and/or any other characteristic, attribute, property, or the like of an element. Furthermore, in the drawings, the size and relative sizes of elements may be exaggerated for clarity and/or description. While the exemplary embodiments may be practiced differently, the specific process sequence may be performed differently than as described. For example, two consecutively described processes may be performed substantially simultaneously or in reverse order from that described. In addition, like reference numerals denote like elements.

When an element such as a layer is referred to as being "on," "connected to" or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. To this extent, the term "connected" can mean physically, electrically, and/or fluidically connected, with or without intervening elements present. In addition, the X-axis, Y-axis, and Z-axis are not limited to three axes of a rectangular coordinate system, such as the X-axis, the Y-axis, and the Z-axis, and can be construed in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y and Z" and "at least one selected from the group consisting of X, Y and Z" may be interpreted as any combination of two or more of X only, Y only, Z only, or X, Y and Z, such as XYZ, XYY, YZ and ZZ, for example. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Although the terms "first," "second," etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Accordingly, a first element discussed below could be termed a second element without departing from the teachings of the present disclosure.

Spatially relative terms such as "below," "beneath," "lower," "upper," "above," "high," "side" (e.g., as in "sidewall") and the like may be used herein for descriptive purposes and thereby describing the relationship of one element to another element(s) as illustrated in the figures. In addition to the orientations depicted in the figures, spatially relative terms are intended to encompass different orientations of the device in use, operation, and/or manufacture. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" may encompass both an orientation of above and below. Additionally, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "comprises," "comprising," "includes," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It should also be noted that as used herein, the terms "substantially," "about," and other similar terms are used as approximation terms and not as degree terms, and as such, are used to allow for an inherent deviation of measured, calculated, and/or provided values as would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference to cross-sectional and/or exploded views, which are schematic illustrations of idealized exemplary embodiments and/or intermediate structures. As such, variations in the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Accordingly, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result, for example, from manufacturing. In this way, the regions illustrated in the figures may be schematic in nature and the shapes of the regions may not reflect the actual shape of the regions of the device and are, therefore, not necessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Fig. 1 is a flowchart of a method of manufacturing an organic light emitting display device according to a first exemplary embodiment. Fig. 2A, 2B, 2C, 2D, 2E, and 2F are plan views illustrating a method of manufacturing an organic light emitting display device according to the embodiment of fig. 1. Specifically, fig. 2A is a plan view showing the mother display panel 100 and the mother protective film 50 stacked on each other; fig. 2B is a plan view showing the mother protective film 50 on which the cutting lines CL1 and the first additional cutting lines CL2 are formed; fig. 2C is a plan view showing an operation in which the fixing member 60 is arranged on the mother protective film 50 in the region formed by the cutting line CL 1; fig. 2D is a plan view illustrating a dicing operation; fig. 2E is a plan view illustrating an operation of rounding a corner portion of the display unit CE-0; and fig. 2F is a plan view showing an operation of polishing the edge of the display unit CE. Fig. 3 is a schematic cross-sectional view of region a of fig. 2B, and fig. 4 is a schematic cross-sectional view of region B of fig. 2C. The mother protective film 50 refers to a protective film in a mother state. Fig. 5 is a schematic cross-sectional view of a state in which the buffer member is disposed between the fixing member and the female protective film.

Referring to fig. 1, a method of manufacturing an organic light emitting display device according to an exemplary embodiment may include: an operation (S1) of laminating a mother protective film on a mother display panel (wherein the mother display panel includes a plurality of display units each having a display area and a peripheral area located in an outer portion of the display unit); an operation (S2) of forming a cutting line having a closed-loop shape corresponding to the display unit and an additional cutting line located in the vicinity of the cutting line on the mother protective film; an operation (S3) of placing a fixing member on the mother protective film in a region formed by the dicing lines; an operation (S4) of physically peeling the additional cut line from the mother display panel to peel off a dummy region other than the target region located within the region formed by the cut line; and an operation (S5) of removing the fixing member and dicing the mother display panel to separate the mother display panel into a plurality of display units; and an operation of processing an edge of the display unit (S6).

Referring to fig. 2A, a mother protective film 50 is laminated on the mother display panel 100.

The mother display panel 100 includes a plurality of display units CE and a peripheral area PA located in an outer portion of the display units CE.

The display unit CE is a minimum unit that can be separately divided and allocated as a display device after the dicing process, and may include a display area DA (see fig. 3) and a non-display area NDA (see fig. 3) including a PAD unit PAD.

The display area DA is an area where an image is displayed, and a plurality of pixels including an organic light emitting device (30, see fig. 3) may be arranged in the display area DA. Each pixel may include at least two thin film transistors and at least one capacitor.

The non-display area NDA is an area where no image is displayed, and a circuit unit may be disposed in the non-display area NDA, wherein an electric signal is applied to the display area DA, the wiring, the PAD unit PAD, and the like via the circuit unit. As an example, nine display units CE are shown in fig. 2A, and the mother display panel 100 may further include more display units CE.

The peripheral area PA is an area removed after the dicing operation. The wiring or pads for verifying the performance of the display unit CE may be disposed in a portion of the peripheral area PA, and a functional layer may not be formed in another portion of the peripheral area PA, and only the mother substrate 10 may be disposed or some insulating layers may be further disposed on the mother substrate 10.

The mother substrate 10 may include a glass material. The mother substrate 10 formed of a glass material is harder than the substrate formed of a plastic material, and thus, the display unit CE may be formed on the mother substrate 10 formed of a glass material without a support substrate, thereby simplifying the process of attaching and detaching the support substrate.

The mother protective film 50 is attached on the display unit CE to protect the display unit CE. The mother protective film 50 may include an adhesive layer 51 (see fig. 3) and a base film 52 (see fig. 3).

The base film 52 may include a plastic film supporting the adhesive layer 51, and may include, for example, polyethylene terephthalate (PET).

The adhesive layer 51 may include an adhesive material. The dummy region RA (see fig. 2B) of the mother protective film 50 other than the target region TA (see fig. 2B) may be removed before the dicing operation, and the target region TA may be removed after the completion of the display unit CE.

Referring to fig. 2B, a cutting line CL1 and a first additional cutting line CL2 are formed on the mother protective film 50.

The cutting lines CL1 have a closed loop shape smaller than the area of the display unit CE in the region corresponding to the display unit CE, and the first additional cutting lines CL2 extend in the first direction X and are connected between the adjacent cutting lines CL1, and an end portion of each of the first additional cutting lines CL2 may extend to each end portion of the mother protective film 50.

The mother protective film 50 includes a target area TA having a closed loop shape located in the area formed by the cutting line CL1 and a dummy area RA located outside the target area TA.

Referring to fig. 3 showing the area a of fig. 2B, the target area TA located within the area formed by the cut line CL1 may include a portion of the non-display area NDA and the display area DA.

The thin film transistor TFT, the capacitor, and various wirings may be disposed on the mother substrate 10 of the display area DA. An organic light emitting device 30 electrically connected to at least one thin film transistor TFT may be disposed on the mother substrate 10.

The organic light emitting device 30 may include a first electrode 31, an intermediate layer 32 including an organic light emitting layer, and a second electrode 33.

The first electrode 31 and the second electrode 33 may include a reflective layer formed of Mg, al, pt, pd, au, ni, nd, ir, cr or a compound thereof, or a transparent conductive oxide layer on or under the reflective layer. Alternatively, the first electrode 31 and the second electrode 33 may include a thin film including silver (Ag) or an Ag alloy or a transparent conductive oxide layer formed on the thin film. The first electrode 31 and the second electrode 33 may be formed as a reflective electrode or a transmissive electrode according to the type and thickness of the conductive material.

The pixel defining layer 34 covering the end portion of the first electrode 31 may prevent or suppress concentration of an electric field at the end portion of the first electrode 31 and define a light emitting region.

The intermediate layer 32 may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the organic light emitting layer.

The organic light emitting device 30 has a thin film encapsulation member 40 disposed thereon. The thin film encapsulation member 40 may include a first inorganic layer 41, an organic layer 42, and a second inorganic layer 43. The organic layer 42 may include a polymer-based material such as polymethyl methacrylate (PMMA), polycarbonate (PC), polystyrene (PS), acrylic, epoxy, polyimide, or polyethylene. The first and second inorganic layers 41 and 43 may include aluminum nitride (AlN), aluminum oxide (Al ₂O₃), titanium nitride (TiN), titanium oxide (TiO ₂), silicon oxynitride (SiON), silicon nitride (SiN _x), silicon oxide (SiO _x), and the like.

In the display area DA, a mother protective film 50 including an adhesive layer 51 and a base film 52 is disposed on the film package member 40. The mother protective film 50 is attached as a single unit to the dummy area RA located outside the target area TA at all times on the area of the non-display area NDA.

Although the mother protective film 50 attached on the thin film encapsulation member 40 is shown in fig. 3, a touch sensing layer may be further disposed on the thin film encapsulation member 40, and the mother protective film 50 may be attached on the touch sensing layer.

According to another embodiment, instead of the structure in which the film encapsulation member 40 and the touch sensing layer are independent from each other, the touch sensing layer may be formed between the films of the film encapsulation member 40, and the mother protective film 50 may be attached to the outermost film of the film encapsulation member 40.

According to another embodiment, a polarizing film may be further included on the thin film encapsulation member 40, and the mother protective film 50 may be attached on the polarizing film.

According to another embodiment, the mother protective film 50 may be attached to the thin film encapsulation member 40 including both the touch sensing layer and the polarizing film thereon.

In other words, the mother protective film 50 is attached to the mother display panel 100 after all components required for each display unit CE are formed before the dicing operation.

Although fig. 3 illustrates the mother protective film 50 directly attached on the mother substrate 10 in the non-display region NDA, the present disclosure is not limited thereto. Some insulating layers may also be disposed between the mother substrate 10 and the mother protective film 50.

In the above-described mother protective film 50, the cutting lines CL1 and the first additional cutting lines CL2 may be formed using a laser beam. For example, the laser beam may be a CO ₂ laser or a Yttrium Aluminum Garnet (YAG) laser. As in the present embodiment, when the mother protective film 50 includes a nonmetallic organic compound material, CO ₂ laser light may be used.

Here, the mother protective film 50 is cut such that the light beam does not reach the mother substrate 10 by adjusting the laser beam intensity and/or the laser irradiation time (hereinafter, this may be referred to as half-cutting). In detail, the cutting depth D1 of the cutting line CL1 and the first additional cutting line CL2 is set to be smaller than the total thickness D2 of the mother protective film 50, so that the base film 52 of the mother protective film 50 is completely cut, but the adhesive layer 51 is only partially cut in the thickness direction.

When the base film 52 is not completely cut, it is difficult to peel off the mother protective film 50, and therefore, cutting is performed at least up to the thickness of the base film 52. However, since the intensity of the emitted laser beam has the process distribution (process distribution) within a certain range, when the laser beam intensity is very large, the cutting depth may exceed the thickness of the adhesive layer 51 and may be greater than the thickness D2 of the mother protective film 50. In this case, the mother substrate 10 may be damaged, or when some insulating layers are located on the mother substrate 10, the insulating layers may be damaged, and the organic light emitting device 30 may be deteriorated. Therefore, the dicing may be performed by adjusting the intensity and/or irradiation time of the laser beam so that the adhesive layer 51 is only partially diced in the thickness direction.

According to another embodiment, the cutting line CL1 and the first additional cutting line CL2 may be formed using an ultrasonic cutter. The ultrasonic cutter cuts the mother protective film 50 by resonating the vibrator and the blade using a force generated in the piezoelectric element to generate micro-vibrations of about 20kHz to about 40kHz in a width of about 10 to about 70 micrometers (μm) in the third direction Z. In this case, by adjusting the amplitude and/or vibration of the ultrasonic cutter, half-cutting is also performed on the mother protective film 50 so that the adhesive layer 51 is partially left so that the ultrasonic waves do not reach the mother substrate 10.

The dicing performed using the laser beam requires a device that collects gaseous byproducts of the base film 52 and the adhesive layer 51 generated due to heating and discharges the gaseous byproducts, and such byproducts are not generated when using the ultrasonic cutter.

According to another embodiment, the cutting line CL1 and the first additional cutting line CL2 may be formed on the mother protective film 50 by using a conventional cutter such as a cutter. In this case, by adjusting the cutting depth of the cutter, half-cutting can also be performed on the mother protective film 50 so that the adhesive layer 51 is partially left so that the blade does not reach the mother substrate 10.

Referring to fig. 2C, after the fixing member 60 is disposed on the mother protective film 50 in the region formed by the cutting line CL1, a peeling operation is performed. In other words, after the target area TA is fixed by disposing the fixing member 60 on the target area TA of the mother protective film 50, the force F is applied to the first additional cutting line CL2 in the first direction X, thereby peeling the dummy area RA except for the target area TA along the cutting line CL 1.

Referring to fig. 4 showing the region B of fig. 2C, the fixing member 60 may include a fixing plate 61 and a supporting portion 62, wherein the fixing plate 61 completely covers the target region TA of the female protective film 50, and the supporting portion 62 provides a vertical pressing force to the fixing plate 61 and is connected to a controller that adjusts the height and pressing force of the fixing plate 61.

Referring to fig. 5, a buffer member 63 may also be disposed between the fixing plate 61 and the mother protective film 50 to minimize defects occurring when the mother protective film 50 is punched by the pressing pressure of the fixing plate 61. The buffer member 63 may be formed using various elastic materials.

As shown in fig. 2C, when the target area TA of the mother protective film 50 is fixed by using the fixing member 60, the first additional cutting line CL2 relatively close to the force F is peeled off first when the force F is applied in the first direction X, and then, the cutting line CL1 formed along the target area TA is also peeled off by the continuously applied force F. The cutting line CL1 and the first additional cutting line CL2 are half-cut, and thus, the adhesive layer 51 may be torn in a portion where the adhesive layer 51 is not completely cut.

Although the direction of force F is shown two-dimensionally on the XY plane, force F may be applied as a three-dimensional vector. For example, the force F may have a component in the third direction Z. When the force F is applied just after forming only the cutting line CL1 and the first additional cutting line CL2 without mounting the fixing member 60, during the peeling operation, a portion that is not parallel to the first direction X (which is a component on the plane of the force F) but intersects the first direction X (i.e., a portion of the cutting line CL1 extending in the second direction Y) is partially left, and accordingly, the target area TA near the cutting line CL1 may be lifted. However, according to the present embodiment, before the force F is applied, the fixing member 60 is arranged on the target area TA near the cutting line CL1 in the second direction Y intersecting the force F on the plane, and downward pressure is applied to the mother protective film 50, and therefore, the dummy area RA can be peeled cleanly without lifting the target area TA.

Meanwhile, although fig. 2C illustrates an operation of peeling the dummy region RA at a time by simultaneously applying a plurality of forces F to the dummy region RA, the present disclosure is not limited thereto. In other words, the force F may be applied to each dummy region RA a plurality of times.

Referring to fig. 2D, after the dummy region RA of the mother protective film 50 is peeled off due to the operation of fig. 2C, the mother substrate 10 is diced while the target region TA is maintained.

Dicing lines SL are formed along edges of the plurality of display units CE in the first direction X and the second direction Y.

Dicing operations may be performed using laser beams or wheel cutting devices. The laser beam may be a CO ₂ laser or a Yttrium Aluminum Garnet (YAG) laser. Alternatively, the scribe line SL may be formed by applying a force from the mother protective film 50 toward the mother substrate 10 using a wheel cutting device. In other words, the process can be simplified by performing a dicing operation on the upper surface of the mother substrate 10 without inverting the mother substrate 10.

Referring to fig. 2E, an operation of rounding corner portions E1, E2, E3, and E4 of the display unit CE-0 separated due to the dicing operation is illustrated. By rounding the corner portions E1, E2, E3, and E4, the device strength can be enhanced.

Referring to fig. 2F, an operation of polishing the edge of the display unit CE is illustrated. Since the edge of the display unit CE diced using the wheel cutting device has a rough surface, defects may be caused in the subsequent module process. Therefore, by polishing the edges of the display cells CE, the defect rate of the display cells CE can be reduced.

After the operation shown in fig. 2F, a cleaning operation may be additionally performed, and when a subsequent operation such as combining the external connection terminal to the PAD unit PAD is completed while the protective film is attached to the target area TA, the protective film attached to the target area TA may be finally removed. Alternatively, when the protective film is a functional film or according to other requirements, the protective film attached to the target area TA may not be removed but remain.

As described above, according to the method of peeling the mother protective film 50 and the method of manufacturing the organic light emitting display device according to the present disclosure, when the mother protective film 50 is peeled after the target area TA is fixed by pressing the target area TA using the fixing member 60, the lifting of the target area TA of the mother protective film 50 due to the partial remaining of the adhesive layer caused by half cutting can be prevented or suppressed. Further, the protective film is not attached to each of the individual display units, but the protective film in the mother state is used and attached, and thus, the process can be simplified. Further, even when the protective film is attached to the mother display panel of the combination of the glass substrate and the thin film encapsulation member, the dicing operation can be performed only by using the wheel cutting device, and thus, the process can be simplified.

Fig. 6A, 6B, 6C, 6D, 6E, 6F, and 6G are schematic plan views illustrating a method of manufacturing an organic light emitting display device according to a comparative example. A method of manufacturing an organic light emitting display device according to a comparative example will be described with reference to fig. 6A, 6B, 6C, 6D, 6E, 6F, and 6G. The method of fig. 6A, 6B, 6C, 6D, 6E, 6F, and 6G will be described focusing on differences from the method of manufacturing the organic light emitting display device according to the first exemplary embodiment.

Referring to fig. 6A, a mother protective film 50 is laminated on the mother display panel 100.

The mother display panel 100 includes a plurality of display units CE and a peripheral area PA located in an outer portion of the display units CE, and the mother substrate 10 may include a glass material. The mother protective film 50 is attached to an upper portion of the display unit CE to protect the display unit CE.

Referring to fig. 6B, the dicing lines CL1, the first additional dicing lines CL2, the second additional dicing lines CL3, and the third additional dicing lines CL4 are formed on the mother protective film 50.

As described in the above first exemplary embodiment, the cutting line CL1 has a closed loop shape smaller than the area of each display unit CE in the region corresponding to each display unit CE.

The first additional cutting lines CL2 extend in the second direction Y (see fig. 6C) but are not connected between adjacent cutting lines CL1, and the ends of the first additional cutting lines CL2 are connected to the second additional cutting lines CL3. The second and third additional cutting lines CL3 and CL4 surround each display unit CE, and are cut into a lattice shape.

The cutting line CL1, the first additional cutting line CL2, the second additional cutting line CL3, and the third additional cutting line CL4 may be formed using a CO ₂ laser beam. Here, the mother protective film 50 is cut such that the light beam does not reach the mother substrate 10 by adjusting the laser beam intensity and/or the laser irradiation time.

Referring to fig. 6C, a first dicing operation is performed on the mother substrate 10 while the mother protective film 50 is entirely attached.

Meanwhile, before the first dicing operation, an operation of etching the mother substrate 10 to a smaller thickness may be additionally performed. Here, an acid-resistant film may be further attached on the mother protective film 50.

A plurality of scribe lines SL1 are formed along edges of the plurality of display units CE in the first direction X and the second direction Y. In the first dicing operation, a laser beam may be used. Furthermore, a wheel cutting device may be used in the first dicing operation.

In the comparative example, the mother protective film 50 of the dummy region RA is not removed, and thus, no force may be applied from the mother protective film 50 toward the mother substrate 10. In other words, after the mother substrate 10 is flipped, the first dicing operation is performed on the lower surface of the mother substrate 10. Unlike the first exemplary embodiment described above, the operation of inverting the mother substrate 10 is additionally performed.

After the first dicing operation, the mother display panel 100 is divided into a plurality of cells, each including the display cell CE-1.

Referring to fig. 6D, an operation of separating the dummy region RA of the mother protective film 50-1 from the display unit CE-1 separated due to the first dicing operation is illustrated.

By applying the force F3 in both directions with respect to the first additional cutting line CL2, the dummy area RA of the mother protective film 50-1 is peeled off. Since the peeling operation is performed in a state where the display units CE-1 are in a separated state, the peeling operation is repeated the same number of times as the number of the display units CE-1. Further, by inverting the divided display unit CE-1 again upside down, a peeling operation is performed on the upper surface of the mother protective film 50-1.

Referring to fig. 6E, after the dummy area RA is peeled off and the target area TA is attached, a second dicing operation is performed to remove the edge of the display unit CE-1, wherein in the second dicing operation, a second dicing line SL2 is formed.

Referring to fig. 6F, corner portions E1, E2, E3, and E4 of the display unit CE-0 formed due to the second dicing operation are rounded, thereby forming a display unit CE-0 having rounded corner portions E1, E2, E3, and E4.

Referring to fig. 6G, the display unit CE is formed by polishing the edge of the display unit CE-0 of fig. 6F.

Unlike the comparative example, in the present exemplary embodiment, instead of removing the dummy region of the protective film for each individual display unit, the dummy region in the mother state may be removed at a time, thus improving process efficiency. In addition, the number of times the mother substrate is turned upside down can be reduced, and thus, the process efficiency can be increased.

Fig. 7 is a schematic plan view illustrating a method of manufacturing an organic light emitting display device according to a second exemplary embodiment. A method of manufacturing an organic light emitting display device according to a second exemplary embodiment will be described with reference to fig. 7. Fig. 8A and 8B are plan views showing various modified examples of the magnet member.

Referring to fig. 7, a mother protective film 50 is laminated on a mother substrate 10 on which a plurality of display units CE are formed. The cut lines CL1 and the first additional cut lines CL2 are formed on the mother protective film 50 so as to distinguish the target area TA and the dummy area RA from each other.

Unlike the first exemplary embodiment shown in fig. 2A, 2B, 2C, 2D, 2E, and 2F in which the fixing member 60 (see fig. 2C) covers substantially the entire area of the target area TA, in the second exemplary embodiment, the magnet 70 formed of a magnetic material is included as a fixing member and is disposed only in a portion of the target area TA. Instead, a table 80 having magnetic properties is disposed on the lower surface of the mother substrate 10.

The table 80 having magnetic properties need not be a magnet. When the magnet 70 serving as the fixing member is a permanent magnet, the table 80 may be a paramagnetic material exhibiting magnetic properties only in the presence of a magnetic field. Alternatively, when the table 80 is a permanent magnet, the magnet 70 serving as a fixing member may be a paramagnetic material having a magnetic property temporarily.

After the magnet 70 and the table 80 having magnetic properties are disposed on and under the target area TA, respectively, and the adhesive force between the mother protective film 50 and the mother substrate 10 is maintained by magnetic force, the force F is applied to peel off the dummy area RA of the mother protective film 50.

As described above, in the present embodiment, unlike the previous embodiment in which the fixing member 60 covers the entire target area TA, the magnet 70 is only partially disposed, and thus, defects of the display area due to punching of the load of the fixing member 60 can be prevented or suppressed.

Meanwhile, the magnet 70 used in the present embodiment may be a dot magnet 71 arranged in a dot shape in a corner portion inside the target area TA as shown in fig. 8A, or may be a magnet 72 arranged in a closed loop along an edge of the display unit inside the target area TA as shown in fig. 8B.

Fig. 9 and 10 are plan views showing modified examples of the cutting line and the first additional cutting line. Hereinafter, various examples of the cut lines and the additional cut lines formed on the mother protective film 50 of the present embodiment will be described with reference to fig. 9 and 10.

Referring to fig. 9, both ends of the first additional cutting line CL2 connected between the cutting lines CL1 are formed inside the cutting lines CL 1. In other words, by overlapping the cutting line CL1 and the first additional cutting line CL2, the peeling operation can be easily performed.

Referring to fig. 10, the first additional cutting line CL2 may be spaced apart from the cutting line CL 1. The first end of the first additional cut line CL2 may be spaced apart from the cut line CL1 by a first width W _a and the second end of the first additional cut line CL2 may be spaced apart from the cut line CL1 by a second width W _b. Along the first width W _a and the second width W _b, a portion of the adhesive layer 51 (see fig. 3) may remain. However, in this case as well, peeling can be performed neatly without lifting up the target area TA of the mother protective film 50 due to the pressure applied on the target area TA via the fixing member 60 (see fig. 2C).

Fig. 11A, 11B, and 11C are schematic plan views illustrating a method of manufacturing an organic light emitting display device according to a third exemplary embodiment. Hereinafter, a method of manufacturing an organic light emitting display device according to a third exemplary embodiment will be described with reference to fig. 11A, 11B, and 11C. The method of fig. 11A, 11B, and 11C will be described by focusing on the differences of the third exemplary embodiment from the first exemplary embodiment shown in fig. 2A, 2B, 2C, 2D, 2E, and 2F.

The third exemplary embodiment shown in fig. 11A is substantially the same as the first exemplary embodiment shown in fig. 2B. That is, after the mother display panel 100 (see fig. 2A) and the mother protective film 50 are laminated, the cutting line CL1 and the first additional cutting line CL2 are formed in the mother protective film 50. Here, the adhesive layer 51 (see fig. 3) of the mother protective film 50 has a relatively high adhesive force.

Referring to fig. 11B, after the fixing member 60 is disposed on the mother protective film 50 in the region formed by the cutting line CL1, the region of the mother protective film 50 other than the target region TA (i.e., the dummy region RA) is irradiated with Ultraviolet (UV) rays to reduce the adhesive force of the adhesive layer 51 of the mother protective film 50.

Here, UV irradiation may be performed by disposing a mask having an opening corresponding to the target area TA on the mother protective film 50, or the mask may be omitted, and the fixing member 60 may be used as a mask.

Referring to fig. 11C, while the target area TA of the mother protective film 50 is fixed using the fixing member 60, a force F is applied to the first additional cutting line CL2 in the first direction X, thereby peeling the dummy area RA along the cutting line CL1 except for the target area TA. The embodiment of fig. 11C differs from that of fig. 2C in that: UV is also irradiated to the dummy area RA of the mother protective film 50.

By using the mother protective film 50 but irradiating only the dummy region RA with UV, the adhesive force of the dummy region RA can be reduced, thereby facilitating the peeling operation. In addition, in the target area TA, the adhesive force of the mother protective film 50 is strong, and thus, the present embodiment can be applied to an operation requiring strong adhesive force, for example, when the mother protective film 50 is attached to a polarizing film.

Fig. 12A, 12B, and 12C are schematic plan views illustrating a method of manufacturing an organic light emitting display device according to a fourth exemplary embodiment. Hereinafter, a method of manufacturing an organic light emitting display device according to a fourth embodiment will be described with reference to fig. 12A, 12B, and 12C. The method of fig. 12A, 12B, and 12C will be described by focusing on the differences from the third exemplary embodiment shown in fig. 11A, 11B, and 11C.

Fig. 12A is the same as fig. 11A except for the adhesive force of the mother protective film 50. In other words, after the mother display panel 100 (see fig. 2A) and the mother protective film 50 are laminated, the cutting line CL1 and the first additional cutting line CL2 are formed in the mother protective film 50. Here, an adhesive layer 51 (see fig. 3) having a relatively small adhesive force is used as the mother protective film 50.

Referring to fig. 12B, while the target area TA of the mother protective film 50 is fixed using the fixing member 60, a force F is applied to the first additional cutting line CL2 in the first direction X, thereby peeling the dummy area RA along the cutting line CL1 except for the target area TA.

Referring to fig. 12C, after removing the dummy region RA of the mother protective film 50 and while maintaining the target region TA, only the target region TA of the mother protective film 50 is irradiated with UV by using a mask, thereby enhancing the adhesive force of the adhesive layer 51.

The UV irradiation may be performed by disposing a mask having an opening corresponding to the target area TA on the mother protective film 50.

When the adhesive layer 51 having a relatively small adhesive force is used as compared with the third exemplary embodiment, the fourth exemplary embodiment is different in that: the adhesive force of the adhesive layer 51 is enhanced by irradiating UV to the target area TA after the peeling operation. However, also in the fourth exemplary embodiment, the adhesive force of the mother protective film 50 is strong in the target area TA, and thus, the present embodiment can be applied to an operation requiring strong adhesive force, for example, when the mother protective film 50 is attached to the polarizing film.

According to the fourth exemplary embodiment, the mother protective film 50 is peeled off while the target area TA is fixed by using the fixing member 60, and thus, lifting of the target area TA of the mother protective film 50 due to the adhesive layer 51 remaining by half cutting can be prevented or suppressed.

In addition, the protective film is not individually attached to each of the display units CE, but is attached using the protective film in the parent state, and thus, the process can be simplified.

In addition, even when the protective film is attached to the mother display panel 100 including the combination of the glass substrate and the thin film encapsulation member, the dicing operation may be performed using only the wheel cutting device, and thus, the process may be simplified.

In addition, the operation can be simplified by performing a dicing operation on the upper surface of the mother substrate 10 without inverting the mother substrate 10.

Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the present inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as would be apparent to one of ordinary skill in the art.

Claims

1. A method of peeling a mother protective film from a mother display panel, the method comprising:

Laminating the mother protective film on the mother display panel, the mother display panel including a plurality of display units each including a display region and a peripheral region located in an outer portion of the display unit;

forming a target region and a dummy region on the mother protective film by forming a cut line having a closed-loop shape corresponding to the display unit and an additional cut line located in a first direction in the vicinity of the cut line, wherein the cut line surrounds the target region;

Disposing a fixing member on the mother protective film in the target area surrounded by the cutting line; and

The dummy area is physically stripped from the mother display panel.

2. The method of claim 1, wherein the depth of the cut lines and the additional cut lines is less than the thickness of the parent protective film.

3. The method of claim 1, wherein the cut line and the additional cut line are formed using a laser beam.

4. A method according to claim 3, wherein the laser beam comprises a CO ₂ laser.

5. The method of claim 1, wherein the cut line and the additional cut line are formed using a cutter.

6. The method of claim 1, wherein the cut line and the additional cut line are formed using an ultrasonic cutter comprising a vibrator and a blade.

7. The method of claim 1, wherein the fixing member comprises a fixing plate and a supporting portion vertically connected to the fixing plate.

8. The method of claim 7, wherein a buffer member is further disposed between the fixing plate and the female protective film.

9. The method of claim 1, wherein the fixation member comprises a magnetic material.

10. The method of claim 9, wherein disposing the securing member comprises: a table having magnetic properties is disposed on a lower surface of the mother display panel.

11. The method of claim 9, wherein the fixation member is disposed within the target region in a dot shape.

12. The method of claim 9, wherein the fixation member is disposed within the target region in a closed loop shape.

13. The method of claim 1, wherein physically stripping the dummy region comprises: an external force is applied along the additional cutting line in the first direction.

14. The method of claim 1, wherein the additional cut line is connected to the cut line.

15. The method of claim 14, wherein at least one end of the additional cut line is formed within the cut line.

16. The method of claim 1, wherein the additional cut line is spaced apart from the cut line.

17. The method of claim 1, wherein the target region having a closed loop shape has a smaller area than the display unit.

18. The method of claim 1, wherein the mother protective film comprises an adhesive layer attached to the mother display panel and a base substrate disposed on the adhesive layer.

19. The method of claim 18, further comprising: the dummy region is irradiated with ultraviolet light to reduce an adhesive force of a portion of the adhesive layer corresponding to the dummy region before physically peeling the dummy region and after disposing the fixing member.

20. The method of claim 18, further comprising, after physically stripping the dummy region:

Removing the fixation member from the target area; and

The target region is irradiated with ultraviolet light to increase the adhesive force of a portion of the adhesive layer corresponding to the target region.

21. The method of claim 20, illuminating the target region comprising:

disposing a mask having an opening corresponding to the target region on the mother protective film; and

Irradiating the target area with the ultraviolet light.

22. A method of manufacturing an organic light emitting display device, the method comprising:

Forming a mother display panel on a mother substrate, the mother display panel comprising:

a display unit including a plurality of organic light emitting devices and a package member that packages the plurality of organic light emitting devices; and

A peripheral region disposed in an outer portion of the display unit;

laminating a mother protective film on the mother display panel;

disposing a fixing member on the mother protective film in the target area surrounded by the cutting line;

physically peeling the dummy area from the mother display panel;

Removing the fixing member, and then dividing the mother display panel into a plurality of display units by dicing the mother display panel; and

Processing edges of the plurality of display elements.

23. The method of claim 22, wherein the master substrate is diced using a wheel cutting device.

24. The method of claim 23, wherein the master substrate is diced by applying a force to the wheel cutting device in a direction from the master protective film to the master substrate.

25. The method of claim 22, wherein processing edges of the display unit comprises: at least one corner portion of the display unit is rounded.

26. The method of claim 22, wherein processing edges of the display unit comprises: the edge of the display element is polished.

27. The method of claim 22, wherein the encapsulation member comprises at least one organic layer and at least one inorganic layer.

28. The method of claim 22, further comprising: a touch layer is formed on the encapsulation member before the mother protective film is laminated.

29. The method of claim 22, wherein the parent protective film further comprises a polarizing function.