CN111083315A - Air-escape-free photosensitive assembly, camera module and manufacturing method - Google Patents
Air-escape-free photosensitive assembly, camera module and manufacturing method Download PDFInfo
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- CN111083315A CN111083315A CN201811218348.2A CN201811218348A CN111083315A CN 111083315 A CN111083315 A CN 111083315A CN 201811218348 A CN201811218348 A CN 201811218348A CN 111083315 A CN111083315 A CN 111083315A
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- 238000000034 method Methods 0.000 claims abstract description 53
- 239000012790 adhesive layer Substances 0.000 claims description 70
- 239000010410 layer Substances 0.000 claims description 68
- 239000007789 gas Substances 0.000 claims description 61
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- 230000001070 adhesive effect Effects 0.000 claims description 24
- 239000011358 absorbing material Substances 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000002955 isolation Methods 0.000 claims description 12
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/137—Batch treatment of the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
An air-escape-free photosensitive assembly, a camera module and a manufacturing method. The air hole-free photosensitive assembly comprises a photosensitive unit, a circuit board, a base, a filter element and at least one bonding layer, wherein the bonding layer comprises at least one bonding material and at least one absorption material, the base, the circuit board and the filter element form a closed space through the bonding layer, and when the air hole-free photosensitive assembly is baked, the absorption material of the bonding layer absorbs the internal air of the closed space, so that the difference between the internal air pressure and the external air pressure is within a safe range, and the working procedures are reduced.
Description
Technical Field
The present invention relates to the field of camera modules, and more particularly, to a photosensitive assembly without an air vent, a camera module and a method for manufacturing the same, wherein the base of the photosensitive assembly does not need to be provided with an air vent, thereby reducing the process of sealing the air vent and simplifying the manufacturing process.
Background
Along with the gradual development of the module field technique of making a video recording, the consumer improves the performance-price ratio requirement gradually, and market competition is more and more intense. How to simplify the assembly process of the camera module and save the cost becomes the problem which needs to be solved by the related enterprises of the camera module.
The existing camera module comprises a photosensitive component and an optical component, wherein the optical component is arranged on the photosensitive component to form the camera module. The photosensitive assembly comprises a photosensitive unit, a circuit board, a base and a color filter element. The photosensitive unit is electrically conductively disposed on the circuit board, the base is fixed to the circuit board by means of adhesion or the like, and the color filter element is fixed to the base and located on a photosensitive path of the photosensitive unit.
However, in the actual assembly process, the base has to have at least one air escape hole. Specifically, the photosensitive unit is provided to the circuit board, and the base and the filter component of the color filter element fixed as a single body are provided to the circuit board by an adhesive. The circuit board, the base and the filter element form a space, and the photosensitive assembly is baked by reheating so that the adhesive is cured. The air pressure in the space is increased due to heating, and the air pressure in the space needs to be released through the air escape hole, so that the internal air pressure and the external air pressure are kept balanced. However, in order to prevent dust and the like from entering the space through the escape hole, which affects the photosensitive cell, the escape hole must be sealed later.
In summary, the existence of the air escape hole makes the existing assembly process complicated, increases the cost, and also increases the process fineness requirement.
Disclosure of Invention
An object of the present invention is to provide a photosensitive assembly without air holes, a camera module and a method for manufacturing the same, wherein the base of the photosensitive assembly does not need to be provided with air holes, so that the process of sealing the air holes can be eliminated during assembly, the process of sealing the air holes can be reduced, and the manufacturing process can be simplified.
Another objective of the present invention is to provide a photosensitive assembly, a camera module and a method for manufacturing the same, wherein the adhesive used in the photosensitive assembly has a function of absorbing gas, so as to trigger the absorption of gas, reduce the gas pressure, and keep the balance between the internal and external gas pressures during the assembly process, so that the module does not need to be provided with an escape hole.
Another objective of the present invention is to provide a photosensitive assembly without air escape holes, a camera module and a manufacturing method thereof, wherein an absorption layer is disposed in a sealed space of the photosensitive assembly, and the absorption layer absorbs air after being triggered, so as to reduce air pressure and keep the balance between the internal air pressure and the external air pressure during the assembly process, so that the module does not need to be provided with air escape holes.
Another objective of the present invention is to provide a non-air-escape type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the absorption layer or the adhesive absorbs oxygen in the enclosed space to reduce the air pressure, and the amount of the reduced internal air pressure is suitable for the amount of the increased air pressure generated in the enclosed space during baking.
Another object of the present invention is to provide a non-air-escape type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the photosensitive assembly adopts a method of absorbing air by an absorbing layer or an adhesive to reduce internal air pressure, and has less influence on the structures of the photosensitive assembly and the camera module, and can be improved based on the existing product structure, thereby reducing the improvement cost.
Another objective of the present invention is to provide a non-air-vent type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the method of the present invention is suitable for various camera modules with different structures such as COB, MOC and MOB, and has strong universality.
Another objective of the present invention is to provide a non-air-escape type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the absorption layer is wrapped by an isolation device to prevent the absorption layer from absorbing air before the heating and curing process, which may cause the deformation of the base.
Another object of the present invention is to provide a non-air-escape type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the isolation device is heated to melt, so that the absorption layer is exposed to the air in the closed space, thereby triggering the absorption of the internal gas.
Another objective of the present invention is to provide a non-air-escape type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the gas absorbed by the absorption layer or the adhesive is not limited by oxygen, nitrogen, etc., so that manufacturers can select suitable materials according to the cost or process difficulty.
Another objective of the present invention is to provide a non-air-escape type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the amount of air absorbed in the enclosed space is controlled by controlling the amount of the absorption layer or the adhesive, so as to facilitate control of the balance between the internal pressure and the external pressure.
According to one aspect of the present invention, the present invention further provides a photosensitive device without air vent, comprising:
a light sensing unit;
a circuit board, wherein the light sensing unit is attached to the circuit board in electrical communication;
the base is fixed on the circuit board to encapsulate the photosensitive unit;
a filter element, wherein the filter element is fixed on the top side of the base and corresponds to the photosensitive path of the photosensitive unit; and
and the base, the circuit board and the filter element form a closed space through the adhesive layer, wherein when the air-vent-free photosensitive assembly is baked, the absorption material of the adhesive layer absorbs the internal air in the closed space, so that the difference between the internal air pressure and the external air pressure is within a safe range.
According to an embodiment of the present invention, another adhesive layer is located between the filter element and the base, and fixes the filter element, wherein when the air-hole-free photosensitive assembly is baked, the absorption material of the other adhesive layer absorbs the air inside the air-hole-free photosensitive assembly, so that the difference between the internal air pressure and the external air pressure is within a safe range.
According to an embodiment of the present invention, the adhesive layer is located between the circuit board and the base, and fixes the circuit board, wherein when the air hole-free photosensitive assembly is baked, the absorption material of the adhesive layer absorbs the air inside the air hole-free photosensitive assembly, so that the internal and external air pressures are within a safe range.
According to one embodiment of the invention, the absorbing material is implemented as an oxygen absorbing material.
According to one embodiment of the invention, the absorption material is embodied as a material that triggers absorption of a gas at a preset temperature, current or gas pressure.
According to an embodiment of the present invention, the air hole-free photosensitive assembly further includes an absorption layer, wherein the absorption layer is made of an absorption material and is disposed in the closed space.
According to one embodiment of the invention, the absorbing layer is made of an absorbing material and is placed on the circuit board.
According to an embodiment of the invention, the absorption layer is made of a transparent absorption material and is placed on the bottom surface of the filter element.
According to an embodiment of the present invention, the adhesive layer is disposed between the circuit board and the photosensitive unit, wherein when the air hole-free photosensitive assembly is baked, the absorption material of the adhesive layer absorbs the air inside the air hole-free photosensitive assembly, so that the difference between the internal air pressure and the external air pressure is within a safe range.
According to an embodiment of the present invention, the photosensitive assembly further includes an isolation device, wherein the isolation device covers an outer surface of the absorption layer to isolate gas, and when the photosensitive assembly is baked, the isolation device is melted by heat to expose the absorption layer.
According to another aspect of the present invention, the present invention further provides a photosensitive device without air vent, comprising:
a light sensing unit;
a circuit board, wherein the light sensing unit is attached to the circuit board in electrical communication;
the base is fixed on the circuit board to encapsulate the photosensitive unit;
a filter element, wherein the filter element is fixed on the top surface of the base, wherein the circuit board, the base and the filter element form a closed space; and
and the absorption layer is made of at least one absorption material and is arranged in the closed space, and when the air-hole-free photosensitive assembly is baked, the absorption layer absorbs air in the closed space, so that the internal and external air pressures are within a safe range.
According to another aspect of the present invention, the present invention further provides a camera module, comprising:
the air-escape-free photosensitive assembly is described above; and
and the optical assembly is supported by the air-escape-free photosensitive assembly and corresponds to a photosensitive path of the photosensitive unit.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a void-free photosensitive device, comprising:
(a) electrically attaching a photosensitive unit to a circuit board;
(b) fixing a base on the circuit board through an adhesive layer to encapsulate the photosensitive unit, wherein the adhesive layer comprises at least one adhesive material and at least one absorbing material;
(c) fixing a filter element on the base corresponding to the photosensitive path of the photosensitive unit;
(d) the circuit board, the base and the filter element form a closed space to form a non-air-escape type photosensitive assembly; and
(e) and baking the air-escape-free photosensitive assembly, wherein the bonding layer absorbs the gas in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
According to an embodiment of the present invention, the step (c) further fixes the light filter element to the base through another adhesive layer having a function of absorbing gas.
According to an embodiment of the present invention, the method for manufacturing a photosensitive assembly without air escape further comprises, before the step (d):
(f) at least one absorption layer is arranged on the peripheral wall of the closed space.
According to another aspect of the present invention, there is provided a method for manufacturing a void-free photosensitive device, comprising:
(1) electrically attaching a photosensitive unit to a circuit board;
(2) fixing a base on the circuit board to encapsulate the photosensitive unit, wherein the bonding layer has a gas absorption function;
(3) fixing a filter element on the base corresponding to the photosensitive path of the photosensitive unit;
(4) arranging at least one absorption layer on the inner surface of the base, the circuit board or the bottom surface of the filter element;
(5) the circuit board, the base and the filter element form a closed space to form a non-air-escape type photosensitive assembly; and
(6) and baking the air-hole-free photosensitive assembly to absorb the air in the closed space, so that the difference between the internal air pressure and the external air pressure is kept within a safe range.
According to another aspect of the present invention, the present invention further provides a method for manufacturing a void-free photosensitive device, comprising:
(A) electrically attaching a photosensitive unit to a circuit board;
(B) fixing a light filtering component on the circuit board through a bonding layer to form the air-vent-free photosensitive component, wherein a light filtering path of the light filtering component corresponds to a photosensitive path of the photosensitive unit, the circuit board and the light filtering component form a closed space, the photosensitive unit is positioned in the closed space, and the bonding layer comprises at least one bonding material and at least one absorbing material; and
(C) and baking the air-escape-free photosensitive assembly, wherein the bonding layer absorbs the gas in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
Drawings
Fig. 1 is a schematic structural diagram of a camera module according to a preferred embodiment of the invention.
Fig. 2 is a schematic structural diagram of another camera module according to the above preferred embodiment of the invention.
FIG. 3 is a schematic structural diagram of a photosensitive assembly according to another embodiment of the invention.
FIG. 4 is a schematic structural diagram of a photosensitive assembly according to another embodiment of the invention.
FIG. 5 is a flow chart of a first method of manufacturing a photosensitive assembly according to the present invention.
FIG. 6 is a flow chart of a second method of manufacturing a photosensitive assembly according to the present invention.
FIG. 7 is a flow chart of a third method of manufacturing a photosensitive assembly according to the present invention.
Fig. 8 is a schematic structural diagram of a camera module according to a second embodiment of the present invention.
Fig. 9 is a schematic structural diagram of another photosensitive assembly according to the above second embodiment of the present invention.
Fig. 10 is a schematic structural view of another photosensitive assembly according to the above second embodiment of the present invention.
Fig. 11 is a schematic structural view of another photosensitive assembly according to the above second embodiment of the present invention.
FIG. 12 is a flow chart of a fourth method of manufacturing a photosensitive assembly according to the present invention.
FIG. 13 is a flow chart of a fifth method of manufacturing a photosensitive assembly according to the present invention.
FIG. 14 is a flow chart of a sixth method of manufacturing a photosensitive assembly according to the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
As shown in fig. 1 to 14, the present invention provides a non-air-vent-escape type photosensitive assembly, a camera module and a manufacturing method thereof, wherein the base of the non-air-vent-escape type photosensitive assembly does not need to be provided with air vents, so that the process of sealing the air vents can be eliminated during the manufacturing and assembling process, the process of sealing the air vents can be reduced, and the manufacturing process can be simplified. Meanwhile, the base is manufactured without arranging an air escape hole, so that the manufacturing difficulty of the base is further simplified and the manufacturing cost of the base is reduced.
Specifically, as shown in fig. 1 to 4, a preferred embodiment of the present invention is illustrated. In the preferred embodiment, the adhesive layer 110 of the air-escape-free photosensitive assembly 100 includes at least one adhesive material and at least one absorbent material. The adhesive material is embodied as a material having an adhesive function, such as glue, for example. The adsorbing material can be implemented as metal or metal alloy particles or powder of Zr, Ti, V, titanium, zirconium, tantalum, thorium and the like; hf. High field strength metals such as Nb, Ta, W, Mo, etc., rare earth metals or metal alloy particles or powder; or particles or powders of transition metals or metal alloys such as Fe and Cu.
The air-hole-free photosensitive assembly 100 includes a photosensitive unit 120, a circuit board 130, a base 140 and a filter 150. Specifically, the photosensitive unit 120 is configured to receive image information, and the filter element 150 is configured to filter out infrared light and the like that affect the imaging quality of the photosensitive unit 120. The light sensing unit 120 has a light sensing area for receiving light signals and generating corresponding electrical signals and a non-light sensing area. The photosensitive unit 120 has at least one electrical connector in the non-photosensitive region, and the electrical connector is electrically connected to the circuit board.
The light sensing unit 120 is electrically connected to the circuit board 130, and the base 140 is disposed on the circuit board 130 and has an optical window corresponding to a light sensing path of the light sensing unit 120. The filter element 150 is disposed on the base 140 and located on a photosensitive path of the photosensitive unit 120, covering the light window. The circuit board 130, the base 140 and the filter element 150 form a sealed space 160, and the light sensing unit 120 is disposed in the sealed space 160.
The adhesive layer 110 is located between the circuit board 130 and the base 140, and fixes the base 140 to the circuit board 130. Further, another adhesive layer 110 is disposed between the base 140 and the filter element 150, so that the filter element 150 is fixed to the base 140.
Those skilled in the art will appreciate that the air hole-free type photosensitive assembly 100 may be implemented as a cob (chip on board), mob (molding on board), moc (molding on chip) structure, and the invention is not limited thereto. That is, the adhesive layer 110 having a gas absorption function according to the present invention may be used in any conventional camera module structure, as shown in fig. 1 to 4.
In the COB structure, the chassis 140 is fixed to the circuit board 130 by adhesion or the like. The base 140 surrounds the light sensing unit 120 and the electronic components for packaging. The base 140 has the light window disposed in a light sensing path of the light sensing unit 120. The filter element 150 covers the light window, corresponding to the light sensing path of the light sensing unit 120. At this time, the adhesive layer 110 may be disposed between the wiring board 130 and the base 140, and between the base 140 and the filter element 150. Further, the adhesive layer 110 may be disposed between the photosensitive unit 120 and the circuit board 130, and it is worth saying that when the adhesive layer 110 is disposed between the photosensitive unit 120 and the circuit board 130, the flatness of the photosensitive unit 120 is ensured to meet the requirement.
In the MOC structure, the base 140 is integrally formed on the wiring board 130 through a molding process. Specifically, the base 140 encapsulates the non-photosensitive area of the photosensitive unit 120, and integrally encapsulates the photosensitive unit 120 and the electronic components on the circuit board 32. The base 140 has the light window disposed in a light sensing path of the light sensing unit 120. The filter element 150 covers the light window, corresponding to the light sensing path of the light sensing unit 120. And the adhesive layer 110 may be disposed between the base 140 and the filter element 150.
Alternatively, in the MOB structure, the base 140 is integrally formed on the wiring board 130 through a molding process. However, the base 140 does not encapsulate the light sensing unit 120, and only encapsulates the electronic components and the circuit board 130. In other words, the base 140 may encapsulate the light sensing unit 120 in a non-light sensing region of the light sensing unit 120, or encapsulate electronic components around the light sensing unit 120. At this time, the adhesive layer 110 may be disposed between the base 140 and the filter element 150.
In other embodiments of the present invention, the adhesive layer 110 is disposed between the photosensitive unit 120 and the circuit board 130, such that the photosensitive unit 120 is fixedly attached to the circuit board 130. In this case, the adhesive layer 110 between the photosensitive unit 120 and the circuit board 130 may also function to absorb gas and reduce the pressure of the gas. At this time, in order to prevent the adsorption material of a metallic nature from affecting the operation of the photosensitive unit 120, the adsorption material may be a material of a non-metallic nature.
When the air hole-free photosensitive assembly 100 is baked, the adhesive layer 110 can absorb air in the sealed space 160, so as to prevent the sealed space 160 from being too large in air pressure due to temperature rise, so that the air hole-free photosensitive assembly 100 deforms, and the precision of the camera module is affected.
It is worth mentioning that since the baking temperature is generally controlled at 80 ℃, the air pressure generated in the sealed space 160 may be increased by at least 20%. In this regard, the present invention further controls the amount of the absorption gas by controlling the amount of the adhesive layer 110, thereby maintaining the balance of the internal and external gas pressures. In the present invention, the air is absorbed by not less than 10%, preferably not less than 20%. It should be noted that the baking temperature is not a limitation of the present invention, and those skilled in the art should understand that the temperature set during the assembly process is different for different assembly processes. Secondly, the baking temperature of different types of modules may also be different during the assembly process, for example, the module needs reflow soldering and baking during the assembly process, and the temperature is as high as 50-200 ℃, for example, 100 ℃, 150 ℃.
Since the oxygen content in the air is about 21%, it is preferable in the present invention that the oxygen in the sealed space 160 is absorbed, for example, the absorption material of the adhesive layer 110 reacts with the oxygen in the air to generate an oxide. Or the absorbing material is implemented by other non-metal materials, and can absorb gas in the air, such as oxygen, carbon dioxide or nitrogen, etc.
In some embodiments of the present invention, the absorption material of the adhesive layer 110 is activated by heating, power or a predetermined pressure to absorb the gas in the sealed space 160. For example, a material that requires heating or application of electricity to react with oxygen is selected as the absorbing material. This prevents the absorption material of the adhesive layer 110 from absorbing gas before heat curing, which may cause deformation of the air hole-free photosensitive assembly 100. Preferably, the adhesive layer 110 absorbs and cures during heating.
It can be mentioned that, the viscosity of the adhesive layer 110 is low before baking, and when the internal air pressure is too high, the base 140 and the circuit board 130 adhered by the adhesive layer 110 will move relatively, which affects the module precision, so the problem of too high air pressure needs to be solved. In the prior art, an air escape hole is formed in a base, and during a baking process, air among the base, the circuit board 130 and the filter element 150 overflows through the air escape hole, so that the difference between the internal air pressure and the external air pressure is controlled. However, since the air escape holes may easily cause the photosensitive chip 120 disposed on the circuit board to be contaminated by dust, the air escape holes are also filled after the baking is completed, so as to realize the sealed space. In the invention, the adhesive layer 110 is adopted for fixing, so that when the baking is carried out, the absorption material of the adhesive layer 110 absorbs part of gas in the sealed space 160, and the internal and external gas pressures can be kept in a reasonable range; when the adhesive 110 is cured and the temperature is again lowered to normal temperature, the adhesive strength of the adhesive 110 can ensure that the base 140 and the circuit board 130 move relatively because the adhesive 110 is cured.
In other embodiments of the present invention, after the enclosed space 160 is formed, the adhesive layer 110 gradually absorbs the gas inside the enclosed space 160. At this time, it is preferable that the absorption rate of the adhesive layer 110 is slow to prevent the internal air pressure from being too small, which causes the glue to be sucked into the closed space 160 and deformed. That is, in these embodiments, the absorbent material used in the adhesive layer 110 may be a material that reacts slower than others.
The photosensitive assembly 100 further includes at least one electronic component. The electronic component can be one or a combination of more of a capacitor, a resistor, an inductor, a diode and a triode. The electronic component is attached to the circuit board 130 and electrically connected to the circuit board 130. When the base 23 is formed by a molding process, the electronic components are packaged in the base 140 together with the light sensing unit 120 and the wiring layer 130.
The camera module further includes an optical element 200, wherein the optical element 200 is fixedly supported on the air hole-free photosensitive element 100, and forms the camera module corresponding to the photosensitive path of the photosensitive unit 120 of the air hole-free photosensitive element 100. In some embodiments of the present invention, the camera module is an AF module (auto focus camera module), and correspondingly, the optical assembly 200 includes a driving member 220 and an optical lens 210. The optical lens 210 is disposed on the driving member 220 and located on a light sensing path of the light sensing unit 120. When the optical assembly 200 is disposed on the air-escape-free photosensitive assembly 100, the driving member 220 drives the optical lens 210 to focus. Alternatively, in another embodiment of the present invention, the image capturing module is an FF module (fixed focus image capturing module), correspondingly, the optical assembly 200 includes the optical lens 210, and the optical lens 210 is located on a photosensitive path of the photosensitive unit 120.
Accordingly, the present invention further provides a method for manufacturing a non-air-vent photosensitive device, which is suitable for the non-air-vent photosensitive device 100, and achieves the objects and advantages of the present invention.
Referring to FIG. 5, a first method for manufacturing a non-air-escape type photosensitive device according to the present invention is illustrated.
Step 310: a photosensitive unit 120 is electrically connected to a circuit board 130.
Step 312: a base 140 is fixed to the circuit board 130 by an adhesive layer 110 to encapsulate the light sensing unit 120.
Step 314: a filter element 150 is fixed on the base 140 through another adhesive layer 110, and an air-hole-free photosensitive assembly is formed corresponding to the photosensitive path of the photosensitive unit 120, wherein the circuit board 130, the base 140 and the filter element 150 form a closed space.
Step 316: baking the air-hole-free photosensitive assembly, wherein at least one of the bonding layers 110 comprises at least one bonding material and at least one gas absorption material to absorb the gas in the enclosed space, so that the internal and external gas pressures are kept within a safe range.
The circuit board 130 may be a common PCB board, and the light sensing unit 120 may be electrically connected to the circuit board 130 through a conductive member such as a lead. One end of a lead is electrically connected to the electrical connector of the photosensitive unit 120 through a wire bonding process, and the other end of the lead is electrically connected to the circuit board 130, so that the photosensitive unit 120 and the circuit board 130 are electrically connected. Specifically, the circuit board 130 is disposed on the bottom side of the light sensing unit 120, that is, the light sensing unit 120 is attached to the circuit board 130.
The adhesive layer 110 includes at least one adhesive material and at least one gas absorbing material. That is, the adhesive layer 110 may be made of a mixture of at least one adhesive material and at least one gas-absorbing material. In this case, the adhesive layer has both functions of adhesive fixation and gas absorption.
When the air-escape-free photosensitive assembly is heated and baked, the bonding layer is heated and cured, and meanwhile, the gas absorption material absorbs the gas in the closed space. In particular, when the gas absorbing material is used to absorb gas by being triggered at a predetermined temperature, pressure or power on, a predetermined condition may be implemented in step 316 to trigger the adhesive layer to absorb gas to maintain the difference between the internal and external pressures within a safe range.
Referring to FIG. 6, a second method for manufacturing a non-air-escape type photosensitive device according to the present invention is illustrated.
Step 320: a photosensitive unit 120 is electrically connected to a circuit board 130.
Step 322: a filter element 150 is fixed on the top surface of a base 140 by an adhesive layer 110 to form a filter assembly, wherein the adhesive layer 110 has a gas absorbing function.
Step 324: the filter assembly is fixed to the circuit board 130 by another adhesive layer 110 to form an air-hole-free photosensitive assembly, wherein the filter element 150 corresponds to a photosensitive path of the photosensitive unit 120, and the circuit board 130, the base 140 and the filter element 150 form a closed space.
Step 326: and baking the air-hole-free photosensitive assembly, wherein the bonding layer 110 absorbs the gas in the closed space, so that the internal and external air pressure is kept in a safe range.
Referring to FIG. 7, a third method for manufacturing a photosensitive device without air holes is illustrated.
Step 330: a photosensitive unit 120 is electrically connected to a circuit board 130.
Step 332: a base 140 is molded on the circuit board 130 by a molding process to encapsulate the light sensing unit 120.
Step 334: a filter element 150 is fixed on the top surface of the base 140 by an adhesive layer 110 to form a non-air-vent type photosensitive assembly, wherein the circuit board 130, the base 140 and the filter element 150 form a closed space, and the adhesive layer 110 has a gas absorption function.
Step 336: and baking the air-hole-free photosensitive assembly, wherein the bonding layer 110 absorbs the gas in the closed space, so that the internal and external air pressure is kept in a safe range.
That is, the assembly sequence of the circuit board 130, the base 140 and the filter element 150 does not affect the absorption function of the adhesive layer 110 of the present invention, and the assembly sequence and method can be properly adopted according to the existing equipment or cost. It is understood that the adhesive layer 110 having the function of absorbing gas may be disposed only between the filter element 150 and the base 140, or only between the base 140 and the circuit board 130, and other portions requiring adhesion may be made of a common adhesive.
As shown in fig. 8 to 14, a second embodiment of the present invention is explained. In the second embodiment, the air hole-free photosensitive assembly 100A includes an absorption layer 170A. The absorption layer 170A is made of an absorption material, and may be a metal material or a non-metal material. That is, as in the preferred embodiment, the adsorbent material may be implemented as particles or powder of a metal or metal alloy such as Zr, Ti, V, titanium, zirconium, tantalum, thorium; hf. High field strength metals such as Nb, Ta, W, Mo, etc., rare earth metals or metal alloy particles or powder; or particles or powders of transition metals such as Fe and Cu, or metal alloys, and the like.
Unlike the above-described preferred embodiment, the adhesive layer 110A may be made of only an adhesive material, and its function of absorbing gas is performed by the absorption layer 170A. The absorption layer 170A is provided in the peripheral wall of the closed space 160A. Specifically, the absorption layer 170A may be disposed on an inner surface of the base 140A, or may be disposed on a bottom surface of the color filter 150A (in this case, the absorption layer 170A is made of a transparent material to facilitate light to pass through), or the circuit board 130A.
Similarly, when the air-hole-free photosensitive assembly 100A is baked, the absorption layer 170A can absorb air in the sealed space 160A, so as to prevent the sealed space 160A from being too large in air pressure due to temperature rise, so that the air-hole-free photosensitive assembly 100A deforms, and the precision of the camera module is affected. Preferably, the absorption layer 170A reacts with oxygen in the air to generate an oxide. Of course, the absorption layer 170A may be triggered by heating, power supply or preset air pressure to absorb the gas in the sealed space 160, or gradually absorb the gas after the sealed space 160 is formed.
Further, the absorbent layer 170A is covered with a separator 171A, as shown in fig. 11. The separator 171A covers the outer surface of the absorption layer 170A, and is melted when heated to expose the absorption layer 170A, so that the absorption layer 170A absorbs the gas in the enclosed space 160A during the heating process. In this case, the absorption layer 170A may be a material capable of absorbing gas at normal temperature, for example, a material capable of reacting with oxygen at normal temperature, and the isolation device 171A protects the isolation gas. At this time, it is preferable that the absorption layer 170A is mounted on the circuit board 130A, and correspondingly, the isolation device 171A is also disposed on the circuit board 130A to prevent the isolation device 171A from contaminating the photosensitive unit 120A when melted.
Accordingly, the present invention further provides a method for manufacturing a non-air-vent photosensitive device, which is suitable for the non-air-vent photosensitive device 100A, and achieves the objects and advantages of the present invention. The adhesive layer 110 used in the manufacturing process may be made of a common adhesive material corresponding to the structural features of the air hole-free photosensitive assembly 100A.
Referring to FIG. 12, a fourth method for manufacturing a photosensitive assembly without air holes according to the present invention is illustrated.
Step 340: a photosensitive unit 120A is electrically connected to a circuit board 130A.
Step 342: a base 140A is fixed on the circuit board 130A to encapsulate the light sensing unit 120A.
Step 344: an absorption layer is disposed on the inner surface of the base 140A, the circuit board 130A or the bottom surface of a filter element 150A.
Step 346: the filter element 150A is fixed on the base 140A, and forms an air-hole-free photosensitive assembly corresponding to the photosensitive path of the photosensitive unit 120A, wherein the circuit board 130A, the base 140A and the filter element 150A form a closed space.
Step 348: baking the air-hole-free photosensitive assembly, and absorbing the gas in the closed space by the absorption layer so as to keep the internal and external air pressure within a safe range.
Referring to FIG. 13, a fifth method for manufacturing a non-air-escape type photosensitive device according to the present invention is illustrated.
Step 350: a photosensitive unit 120A is electrically connected to a circuit board 130A.
Step 352: an absorption layer is disposed on an inner surface of a base 140A, the circuit board 130A or a bottom surface of a filter element 150A.
Step 354: a filter element 150A is fixed on the top surface of a base 140A to form a filter assembly.
Step 356: fixing the filter assembly on the circuit board 130A to form a photosensitive assembly without air holes, wherein the filter element 150A corresponds to the photosensitive path of the photosensitive unit 120A, and the circuit board 130A, the base 140A and the filter element 150A form a closed space.
Step 358: baking the air-hole-free photosensitive assembly, and absorbing the gas in the closed space by the absorption layer so as to keep the internal and external air pressure within a safe range.
Referring to FIG. 14, a sixth method for manufacturing a non-air-escape photosensitive assembly according to the present invention is illustrated.
Step 360: a photosensitive unit 120A is electrically connected to a circuit board 130A.
Step 362: a base 140A is molded on the circuit board 130A by a molding process to encapsulate the light sensing unit 120.
Step 364: an absorption layer is disposed on an inner surface of a base 140A, the circuit board 130A or a bottom surface of a filter element 150.
Step 366: fixing a filter element 150A on the top surface of the base 140A to form a photosensitive assembly without air holes, wherein the circuit board 130A, the base 140A and the filter element 150A form a closed space.
Step 368: baking the air-hole-free photosensitive assembly, and absorbing the gas in the closed space by the absorption layer so as to keep the internal and external air pressure within a safe range.
It is worth mentioning that when the absorption layer is fixed on the bottom surface of the filter element 150A, it is a transparent material for light to pass through. Similarly, for the air hole-free photosensitive assembly 100A of the second embodiment, the assembly sequence of the circuit board 130A, the base 140A and the filter element 150A does not affect the absorption function of the absorption layer of the present invention, and an appropriate assembly sequence and method can be adopted according to the existing equipment or cost.
According to the manufacturing method of the air hole-free photosensitive assembly, the air holes do not need to be arranged, and the subsequent process of packaging the air holes does not need to be carried out, so that the baking is carried out when the air pressure difference between the inside and the outside is in a safe range.
It will be appreciated by those skilled in the art that the getter material used in the adhesion layer 110 and the getter layer may be a material capable of directly reacting with other materials in the air, such as a metal material, or a material having a getter function after synthesis, such as a nano getter. The invention is not limited to the kind of absorbent material and the manufacturer may use different suitable materials depending on the cost or equipment etc.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (21)
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| CN201811218348.2A CN111083315B (en) | 2018-10-19 | 2018-10-19 | Air-hole-less photosensitive component, camera module and manufacturing method |
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| CN201811218348.2A CN111083315B (en) | 2018-10-19 | 2018-10-19 | Air-hole-less photosensitive component, camera module and manufacturing method |
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| CN113067968A (en) * | 2021-03-10 | 2021-07-02 | Oppo广东移动通信有限公司 | A shooting component and mobile terminal |
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| CN111083315B (en) | 2023-10-27 |
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