CN111081146A - Method for preparing a display substrate, display substrate and display device - Google Patents
Method for preparing a display substrate, display substrate and display device Download PDFInfo
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- CN111081146A CN111081146A CN201911315416.1A CN201911315416A CN111081146A CN 111081146 A CN111081146 A CN 111081146A CN 201911315416 A CN201911315416 A CN 201911315416A CN 111081146 A CN111081146 A CN 111081146A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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Abstract
本申请提供了一种显示基板的制备方法、显示基板及显示装置，其中显示基板包括绑定区域，绑定区域的显示基板包括：柔性衬底；层叠设置在柔性衬底一侧的无机层和金属层，无机层靠近柔性衬底设置；以及设置在柔性衬底背离无机层一侧的支撑膜层；其中，绑定区域包括多个弯折区域和非弯折区域，弯折区域的无机层厚度小于非弯折区域的无机层厚度。由于无机层的韧性较差，通过减薄弯折区域的无机层厚度，可以提高弯折区域的柔韧性，避免在弯折的过程中设置在无机层上的金属层发生断裂，减少金属层断路不良。
The present application provides a method for preparing a display substrate, a display substrate and a display device, wherein the display substrate includes a binding area, and the display substrate in the binding area includes: a flexible substrate; an inorganic layer stacked on one side of the flexible substrate; The metal layer, the inorganic layer is arranged close to the flexible substrate; and the supporting film layer is arranged on the side of the flexible substrate away from the inorganic layer; wherein, the binding area includes a plurality of bending areas and non-bending areas, and the inorganic layer in the bending area The thickness is less than the thickness of the inorganic layer in the non-bending region. Due to the poor toughness of the inorganic layer, by reducing the thickness of the inorganic layer in the bending area, the flexibility of the bending area can be improved, so as to prevent the metal layer arranged on the inorganic layer from breaking during the bending process, and reduce the open circuit of the metal layer. bad.
Description
Technical Field
The invention relates to the technical field of display, in particular to a preparation method of a display substrate, the display substrate and a display device.
Background
A substrate of an Organic Light Emitting Display panel (OLED) may be made of a flexible material, so that the OLED is often applied in the field of flexible Display, for example, the flexible OLED may be used for a curved mobile phone screen or a wearable device, and fig. 1 shows schematic diagrams of several curved mobile phone screens.
When the flexible OLED is used for a curved screen, a metal layer on a substrate is easily broken (crack) in a bending area in the bending process, and the OLED is abnormal in display and even cannot be lightened.
Disclosure of Invention
The invention provides a preparation method of a display substrate, the display substrate and a display device, which are used for avoiding the problem of abnormal display caused by fracture of a metal layer in a bending area.
In order to solve the above problems, the present invention discloses a display substrate, which includes a bonding region, the display substrate of the bonding region including:
a flexible substrate;
an inorganic layer and a metal layer which are arranged on one side of the flexible substrate in a laminated mode, wherein the inorganic layer is arranged close to the flexible substrate;
and a support film layer disposed on a side of the flexible substrate facing away from the inorganic layer;
the binding region comprises a plurality of bending regions and non-bending regions, and the thickness of the inorganic layer of each bending region is smaller than that of the inorganic layer of each non-bending region.
In an alternative implementation, the support film layer is broken at the fold region.
In an alternative implementation, an orthographic projection of the support film layer on the flexible substrate covers the non-bending region.
In an alternative implementation, the thickness of the inorganic layer in the bending region is zero.
In an alternative implementation, the bending radius of curvature of the bending region is less than or equal to 1 mm.
In an optional implementation manner, a chip on film is disposed at an edge of the bonding area, the chip on film is located at a side of the metal layer away from the support film layer, a driving circuit is disposed at a side of the chip on film away from the metal layer, and the chip on film is used for connecting the metal layer with the driving circuit;
when the binding region is in a bent state, one side of the chip on film, which is far away from the driving circuit, is adhered to the support film layer.
In order to solve the above problem, the present invention further discloses a display device including the display substrate according to any one of the embodiments.
In order to solve the above problem, the present invention further discloses a method for manufacturing a display substrate, where the display substrate includes a bonding region, and the method for manufacturing the bonding region includes:
providing a flexible substrate;
sequentially forming an inorganic layer and a metal layer on one side of the flexible substrate;
forming a support film layer on one side of the flexible substrate, which is far away from the inorganic layer;
the binding region comprises a plurality of bending regions and non-bending regions, and the thickness of the inorganic layer of each bending region is smaller than that of the inorganic layer of each non-bending region.
In an alternative implementation, the step of forming an inorganic layer on one side of the flexible substrate includes:
forming an inorganic material layer on one side of the flexible substrate;
and etching the inorganic material layer in the bending area to obtain the inorganic layer.
In an alternative implementation, the step of forming a support film layer on a side of the flexible substrate facing away from the inorganic layer includes:
forming a support film material on the side of the flexible substrate away from the inorganic layer;
removing the support film material of the bending region to obtain the support film layer, wherein the orthographic projection of the support film layer on the flexible substrate covers the non-bending region; or,
forming a plurality of supporting film materials on one side of the flexible substrate, which is far away from the inorganic layer, to obtain the supporting film layer, wherein the orthographic projection of the supporting film layer on the flexible substrate covers the non-bending area.
Compared with the prior art, the invention has the following advantages:
the technical scheme of the application provides a preparation method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a binding region, and the display substrate of the binding region comprises: a flexible substrate; an inorganic layer and a metal layer which are arranged on one side of the flexible substrate in a laminated mode, wherein the inorganic layer is arranged close to the flexible substrate; the support film layer is arranged on one side, away from the inorganic layer, of the flexible substrate; the binding region comprises a plurality of bending regions and non-bending regions, and the thickness of the inorganic layer of each bending region is smaller than that of the inorganic layer of each non-bending region. Because the toughness of the inorganic layer is poor, the flexibility of the bending area can be improved by thinning the thickness of the inorganic layer in the bending area, the metal layer arranged on the inorganic layer is prevented from being broken in the bending process, and the poor open circuit of the metal layer is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 shows a schematic diagram of several curved cell phone screens;
FIG. 2 is a schematic cross-sectional view illustrating a bonding region of a display substrate according to an embodiment of the present disclosure;
FIG. 3 is a schematic cross-sectional view illustrating a specific layer structure of a bonding region of a display substrate according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram illustrating a planar structure of a display panel bonding area according to an embodiment of the present application;
fig. 5 is a flowchart illustrating a method for manufacturing a display substrate according to an embodiment of the present disclosure.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The inventor analyzes the curved screen which shows abnormity, and finds that the reason that the metal layer in the bending area is easy to break is that the inorganic layer in the bending area is too thick and is not easy to bend.
In order to solve the above problem, an embodiment of the present application provides a display substrate, where the display substrate includes a bonding area, and fig. 2 is a schematic cross-sectional structure diagram of the bonding area of the display substrate provided in this embodiment; fig. 3 is a schematic cross-sectional structure diagram illustrating a specific layer structure of a bonding region of a display substrate provided in this embodiment; fig. 4 is a schematic plan view illustrating a display panel provided in this embodiment; the display substrate of the binding region may include:
a flexible substrate 21;
an inorganic layer 22 and a metal layer 23 which are stacked on one side of the flexible substrate 21, the inorganic layer 22 being disposed adjacent to the flexible substrate 21;
and a support film layer 24 disposed on a side of the flexible substrate 21 facing away from the inorganic layer 22;
the bonding region includes a plurality of bending regions (bending areas) and non-bending regions, and the thickness of the inorganic layer 22 in the bending regions is smaller than that of the inorganic layer 22 in the non-bending regions. The non-bent regions are disposed between the bent regions.
The material of the flexible substrate 21 may be a flexible material such as Polyimide (PI).
The material of the inorganic layer 22 may include, for example, an inorganic material such as silicon nitride, silicon oxide, etc., and the inorganic layer 22 may be formed during a process of manufacturing a thin film transistor in a display region of the display substrate.
The material of the metal layer 23 may be, for example, the same metal material as the gate line or the data line in the thin film transistor.
The support film layer 24, i.e., the back film BF, may be made of, for example, PET, and supports the flexible substrate 21.
The display panel provided by the embodiment has the advantages that the toughness of the inorganic layer 22 is poor, the flexibility of the bending region can be improved by reducing the thickness of the inorganic layer 22 in the bending region, the metal layer 23 arranged on the inorganic layer 22 is prevented from being broken in the bending process, and the poor open circuit of the metal layer 23 is reduced.
The thickness of the inorganic layer 22 in the bending region may be zero, or in order to protect the flexible substrate 21, the inorganic layer 22 in the bending region may be a thin layer, and the thickness is smaller than that of the inorganic layer 22 in the non-bending region.
To further enhance the flexibility of the fold region, the supportive support membrane layer 24 may be broken at the fold region.
In addition, in order to provide sufficient supporting force to the non-bending region, the orthographic projection of the support film layer 24 on the flexible substrate 21 can cover the non-bending region.
In a specific implementation, the support film layers 24 may be separately disposed in each non-bending region, and the width of the space between adjacent support film layers 24 is less than or equal to the width of the bending region in the corresponding direction, so that the stress is prevented from being transmitted to the inorganic layer in the non-bending region.
The bend radius of curvature of the bend region can be less than or equal to 1 mm. That is, a region where the bending curvature radius is less than or equal to 1mm may be defined as a bending region in which the thickness of the inorganic layer 22 needs to be reduced and the support film layer 24 is discontinuous. It should be noted that the curvature radius may be adjusted according to the actual structure of the display panel, and the specific value is not limited in this embodiment.
In a specific implementation, referring to fig. 1, a chip on film 25 is disposed at an edge of the bonding region, the chip on film 25 is located at a side of the metal layer 23 away from the support film layer 24, a driving circuit 26 is disposed at a side of the chip on film 25 away from the metal layer 23, and the chip on film 25 is used for connecting the metal layer 23 with the driving circuit 26; when the bonding area is in the folded state, the side of the flip-chip film 25 facing away from the driving circuit 26 is adhered to the support film 24.
The Chip on film 25 may be a Flexible Printed Circuit (FPC), and the driving circuit may be an Integrated Circuit (IC) Chip.
When the bonding area is in the folded state, the side of the flip-chip 25 facing away from the driving circuit 26 can be attached to the supporting film 24 by double-sided adhesive.
The pad binding matching design provided by the embodiment of the application is characterized in that the thickness of an inorganic layer in a bending area is reduced, a segmented supporting film layer technology is further adopted, the pad binding matching design is suitable for all curved screens (such as a single-side curved screen, two-side curved screens, three-side curved screens, four-side curved screens and the like) with smaller radius of curvature or larger bending angle, and the technical scheme provided by the embodiment can realize 90-degree bending.
Another embodiment of the present application further provides a display device, which may include the display substrate according to any one of the embodiments.
The display device in this embodiment may be: any product or component with a display function, such as a display panel, electronic paper, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator and the like.
Another embodiment of the present application further provides a method for manufacturing a display substrate, where the display substrate includes a bonding region, and referring to fig. 5, the method for manufacturing the bonding region includes:
step 501: a flexible substrate is provided.
Step 502: an inorganic layer and a metal layer are sequentially formed on one side of a flexible substrate.
In a specific implementation, an inorganic material layer may be first formed on one side of a flexible substrate; and etching the inorganic material layer in the bending area to obtain the inorganic layer. And forming a metal layer on the side of the inorganic layer, which is far away from the flexible substrate.
Step 503: and forming a support film layer on one side of the flexible substrate, which is far away from the inorganic layer, wherein the binding region comprises a plurality of bending regions and non-bending regions, and the thickness of the inorganic layer in each bending region is smaller than that in each non-bending region.
In one implementation, a support film material may be first formed on a side of the flexible substrate facing away from the inorganic layer; and then removing the support film material in the bending area to obtain a support film layer, wherein the orthographic projection of the support film layer on the flexible substrate covers the non-bending area. Wherein, the support film material in the bending area can be removed by adopting a laser cutting method.
In another implementation, a plurality of supporting film materials may be formed on a side of the flexible substrate facing away from the inorganic layer, resulting in a supporting film layer, and an orthographic projection of the supporting film layer on the flexible substrate covers the non-bending region.
The material of the flexible substrate 21 may be a flexible material such as polyimide (P1).
The material of the inorganic layer 22 may include, for example, an inorganic material such as silicon nitride or silicon oxide.
The material of the metal layer 23 may be, for example, the same metal material as the gate line or the data line in the thin film transistor.
The support film layer 24, i.e. the back film BF, may be made of PET, for example, and supports the flexible substrate.
The display panel obtained by the preparation method provided by the embodiment has the advantages that the toughness of the inorganic layer 22 is poor, and the flexibility of the bending region can be improved by reducing the thickness of the inorganic layer 22 in the bending region, so that the metal layer 23 arranged on the inorganic layer 22 is prevented from being broken in the bending process, and the poor open circuit of the metal layer 23 is reduced.
In specific implementation, a thin film transistor TFT, an OLED structure, and an encapsulation layer structure may be sequentially prepared on a flexible substrate (such as a PI substrate), and an inorganic layer and a metal layer of a binding region are formed in the process of preparing the thin film transistor TFT; and then attaching a support film layer BF to the back surface of the flexible substrate, then completing the attachment of a polarizer, a touch screen, an FPC (flexible printed circuit) and an IC (integrated circuit), and finally bending the flexible substrate after being attached with the glass CG to obtain the display substrate.
By adopting the preparation method provided by the embodiment, the display panel provided by any one of the above embodiments can be prepared.
The embodiment of the application provides a preparation method of a display substrate, the display substrate and a display device, wherein the display substrate comprises a binding region, and the display substrate of the binding region comprises: a flexible substrate; an inorganic layer and a metal layer which are arranged on one side of the flexible substrate in a laminated mode, wherein the inorganic layer is arranged close to the flexible substrate; the support film layer is arranged on one side, away from the inorganic layer, of the flexible substrate; the binding region comprises a plurality of bending regions and non-bending regions, and the thickness of the inorganic layer of each bending region is smaller than that of the inorganic layer of each non-bending region. Because the inorganic layer is harder, the flexibility of the bending region can be improved by thinning the thickness of the inorganic layer in the bending region, the metal layer arranged on the inorganic layer is prevented from being broken in the bending process, and the bad open circuit of the metal layer is reduced.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the statement "comprises a" or "comprising" a defined element does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above detailed description is provided for the manufacturing method of the display substrate, the display substrate and the display device, and the principle and the implementation of the present invention are explained in this document by applying specific examples, and the description of the above examples is only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A display substrate, comprising a bonded region, the display substrate of the bonded region comprising:
a flexible substrate;
an inorganic layer and a metal layer which are arranged on one side of the flexible substrate in a laminated mode, wherein the inorganic layer is arranged close to the flexible substrate;
and a support film layer disposed on a side of the flexible substrate facing away from the inorganic layer;
the binding region comprises a plurality of bending regions and non-bending regions, and the thickness of the inorganic layer of each bending region is smaller than that of the inorganic layer of each non-bending region.
2. The display substrate of claim 1, wherein the support film layer is broken at the bending region.
3. The display substrate of claim 2, wherein an orthographic projection of the support film layer on the flexible substrate covers the non-bending region.
4. The display substrate of claim 1, wherein the inorganic layer thickness of the bending region is zero.
5. The display substrate of claim 1, wherein the bend region has a bend radius of curvature of less than or equal to 1 mm.
6. The display substrate according to claim 1, wherein a flip-chip film is disposed at an edge of the bonding area, the flip-chip film is located at a side of the metal layer away from the support film layer, a driving circuit is disposed at a side of the flip-chip film away from the metal layer, and the flip-chip film is used for connecting the metal layer with the driving circuit;
when the binding region is in a bent state, one side of the chip on film, which is far away from the driving circuit, is adhered to the support film layer.
7. A display device comprising the display substrate according to any one of claims 1 to 6.
8. A method for preparing a display substrate, wherein the display substrate comprises a binding region, and the method for preparing the binding region comprises the following steps:
providing a flexible substrate;
sequentially forming an inorganic layer and a metal layer on one side of the flexible substrate;
forming a support film layer on one side of the flexible substrate, which is far away from the inorganic layer;
the binding region comprises a plurality of bending regions and non-bending regions, and the thickness of the inorganic layer of each bending region is smaller than that of the inorganic layer of each non-bending region.
9. The method according to claim 8, wherein the step of forming an inorganic layer on one side of the flexible substrate comprises:
forming an inorganic material layer on one side of the flexible substrate;
and etching the inorganic material layer in the bending area to obtain the inorganic layer.
10. The method according to claim 8, wherein the step of forming a support film layer on a side of the flexible substrate facing away from the inorganic layer comprises:
forming a support film material on the side of the flexible substrate away from the inorganic layer;
removing the support film material of the bending region to obtain the support film layer, wherein the orthographic projection of the support film layer on the flexible substrate covers the non-bending region; or,
forming a plurality of supporting film materials on one side of the flexible substrate, which is far away from the inorganic layer, to obtain the supporting film layer, wherein the orthographic projection of the supporting film layer on the flexible substrate covers the non-bending area.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911315416.1A CN111081146A (en) | 2019-12-18 | 2019-12-18 | Method for preparing a display substrate, display substrate and display device |
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| CN201911315416.1A CN111081146A (en) | 2019-12-18 | 2019-12-18 | Method for preparing a display substrate, display substrate and display device |
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