CN110596720A - distance measuring system - Google Patents
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- 238000005259 measurement Methods 0.000 claims abstract description 43
- 238000003384 imaging method Methods 0.000 claims abstract description 26
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- 238000002366 time-of-flight method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
- G01S17/10—Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
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- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
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Abstract
本发明提供一种距离测量系统,包括:发射模组,用于发射具有第一畸变特征的斑点图案光束;采集模组,包含具有第二畸变特征的成像透镜以及阵列像素单元,用于采集被反射的所述斑点图案光束;处理电路,与所述发射模组以及所述采集模组连接,用于计算所述发射光束与所述反射光束之间的飞行时间;所述第一畸变特征与所述第二畸变特征相互补偿。提供一种距离测量系统,通过在硬件上实现畸变补偿,相对于传统的通过算法实现畸变补偿方案相比,不仅降低了对算法的要求,也可以从源头上解决畸变问题,效果更佳。
The present invention provides a distance measurement system, including: a transmitting module, used to emit a speckle pattern beam with a first distortion feature; a collection module, including an imaging lens with a second distortion feature and an array pixel unit, used to collect the The reflected speckle pattern light beam; a processing circuit connected to the emission module and the acquisition module for calculating the time-of-flight between the emission light beam and the reflection light beam; the first distortion feature and The second distortion features compensate each other. A distance measurement system is provided. By implementing distortion compensation on hardware, compared with the traditional algorithm-based implementation of distortion compensation, it not only reduces the requirements for the algorithm, but also solves the distortion problem from the source, and the effect is better.
Description
技术领域technical field
本发明涉及计算机技术领域,尤其涉及一种距离测量系统。The invention relates to the technical field of computers, in particular to a distance measuring system.
背景技术Background technique
时间飞行(Time of flight,TOF)法通过测量光束在空间中的飞行时间来计算物体的距离,由于其具有精度高、测量范围大等优点被广泛应用于消费电子、无人架驶、AR/VR等领域。Time of flight (TOF) method calculates the distance of objects by measuring the flight time of light beams in space. Due to its advantages of high precision and large measurement range, it is widely used in consumer electronics, unmanned vehicles, AR/ VR and other fields.
基于时间飞行原理的距离测量系统比如时间飞行深度相机、激光雷达等系统往往包含一个光源发射端以及接收端,光源向目标空间发射光束以提供照明,接收端接收由目标反射回的光束,系统再通过计算光束由发射到反射接收所需要的时间来计算物体的距离。在利用时间飞行深度相机、激光雷达等距离测量系统进行距离感测时,环境光干扰会影响到测量的精度,比如当环境光强度较高甚至淹没光源的光束时,特别对于泛光照明,将很难分辨出光源的光束以至于出现较大的测量误差。Distance measurement systems based on time-of-flight principles, such as time-of-flight depth cameras and lidar systems, often include a light source transmitter and a receiver. Calculate the distance of the object by calculating the time required for the light beam to be reflected and received. When using distance measurement systems such as time-of-flight cameras and laser radars for distance sensing, ambient light interference will affect the accuracy of measurement. For example, when the ambient light intensity is high or even floods the beam of the light source, especially for flood lighting, the It is difficult to distinguish the beam of the light source so that a large measurement error occurs.
现有的技术中可以通过增加滤光片等光学方法以及设置减法电路等电子方法(论文CMOS Sensors for Time-Resolved Active Imaging)来进行背景光抑制,然而,这些方法仍然不能从本质上消除或降低环境光干扰引起的测量误差。采用点扫描的方式有利用于提升信噪比,但相较于泛光照明而言,测量分辨率较低。总之,现有技术难以兼顾信噪比、测量精度以及测量分辨率。In the existing technology, background light can be suppressed by adding optical methods such as optical filters and electronic methods such as setting subtraction circuits (the paper CMOS Sensors for Time-Resolved Active Imaging), however, these methods still cannot essentially eliminate or reduce Measurement error caused by ambient light interference. The method of point scanning is beneficial to improve the signal-to-noise ratio, but compared with flood lighting, the measurement resolution is lower. In a word, the existing technology is difficult to balance the signal-to-noise ratio, measurement accuracy and measurement resolution.
发明内容Contents of the invention
本发明为了解决现有的问题,提供一种距离测量系统。In order to solve the existing problems, the present invention provides a distance measurement system.
为了解决上述问题,本发明采用的技术方案如下所述:In order to solve the above problems, the technical solution adopted in the present invention is as follows:
一种距离测量系统,包括:发射模组,用于发射具有第一畸变特征的斑点图案光束;采集模组,包含具有第二畸变特征的成像透镜以及阵列像素单元,用于采集被反射的所述斑点图案光束;处理电路,与所述发射模组以及所述采集模组连接,用于计算所述发射光束与所述反射光束之间的飞行时间;所述第一畸变特征与所述第二畸变特征相互补偿。A distance measurement system, comprising: a transmitting module, used to emit a speckle pattern beam with a first distortion feature; a collection module, including an imaging lens with a second distortion feature and an array pixel unit, used to collect all reflected The speckle pattern light beam; the processing circuit, connected with the emission module and the acquisition module, is used to calculate the time-of-flight between the emission light beam and the reflection light beam; the first distortion feature and the second distortion feature The two distortion features compensate each other.
在本发明的一种实施例中,所述第一畸变特征为桶形畸变特征或枕形畸变特征,所述第二畸变特征为枕形畸变特征或桶形畸变特征。In an embodiment of the present invention, the first distortion feature is a barrel distortion feature or a pincushion distortion feature, and the second distortion feature is a pincushion distortion feature or a barrel distortion feature.
在本发明的又一种实施例中,所述发射模组包括阵列光源、投影透镜及空间光调制器。所述阵列光源上的子光源排列是具有第一畸变特征的二维排列图案;或,所述投影透镜具有第一畸变特征;或,所述空间光调制器的衍射图案具有第一畸变特征;或,所述阵列光源上的子光源排列、所述投影透镜以及所述空间光调制器衍射图案中的至少两种被综合设计以使所述发射模组具有第一畸变特征。In yet another embodiment of the present invention, the emitting module includes an array light source, a projection lens and a spatial light modulator. The sub-light source arrangement on the array light source is a two-dimensional arrangement pattern with a first distortion feature; or, the projection lens has a first distortion feature; or, the diffraction pattern of the spatial light modulator has a first distortion feature; Or, at least two of the sub-light source arrangement on the array light source, the projection lens and the diffraction pattern of the spatial light modulator are designed comprehensively so that the emitting module has the first distortion feature.
在本发明的又一种实施例中,所述发射模组包括阵列光源和投影透镜。所述阵列光源上的子光源排列是具有第一畸变特征的二维排列图案;或,所述投影透镜具有第一畸变特征;或,所述阵列光源上的子光源排列以及所述投影透镜被综合设计以使所述发射模组具有第一畸变特征。In yet another embodiment of the present invention, the emitting module includes an array light source and a projection lens. The sub-light source arrangement on the array light source is a two-dimensional arrangement pattern with a first distortion feature; or, the projection lens has a first distortion feature; or, the sub-light source arrangement on the array light source and the projection lens are Comprehensively designed so that the emission module has the first distortion feature.
本发明还提供一种距离测量系统,包括:发射模组,包含阵列光源以及投影透镜,用于发射斑点图案光束;采集模组,包含成像透镜以及阵列像素单元,用于采集被反射的所述斑点图案光束;处理电路,与所述发射模组以及所述采集模组连接,用于计算所述发射光束与所述反射光束之间的飞行时间;所述阵列光源上的子光源排列是具有第一畸变特征的二维排列图案,所述投影透镜具有第二畸变特征,所述第一畸变特征与所述第二畸变特征相互补偿。所述第一畸变特征为桶形畸变特征或枕形畸变特征,所述第二畸变特征为枕形畸变特征或桶形畸变特征。The present invention also provides a distance measurement system, including: a transmitting module, including an array light source and a projection lens, for emitting a speckle pattern beam; a collection module, including an imaging lens and an array pixel unit, for collecting the reflected Speckle pattern light beam; processing circuit, connected with the emission module and the acquisition module, used to calculate the time-of-flight between the emission light beam and the reflection light beam; the sub-light source arrangement on the array light source has A two-dimensional arrangement pattern of first distortion features, the projection lens has second distortion features, and the first distortion features and the second distortion features compensate each other. The first distortion feature is a barrel distortion feature or a pincushion distortion feature, and the second distortion feature is a pincushion distortion feature or a barrel distortion feature.
本发明又提供一种距离测量系统,包括:发射模组,包含阵列光源、投影透镜以及空间光调制器,用于发射斑点图案光束;采集模组,包含成像透镜以及阵列像素单元,用于采集被反射的所述斑点图案光束;处理电路,与所述发射模组以及所述采集模组连接,用于计算所述发射光束与所述反射光束之间的飞行时间;所述阵列光源上的子光源排列和/或所述空间光调制器的衍射图案是具有第一畸变特征的二维排列图案;所述投影透镜具有第二畸变特征,所述第一畸变特征与所述第二畸变特征相互补偿。所述第一畸变特征为桶形畸变特征或枕形畸变特征,所述第二畸变特征为枕形畸变特征或桶形畸变特征。The present invention further provides a distance measurement system, including: a transmitting module, including an array light source, a projection lens, and a spatial light modulator, for emitting a speckle pattern beam; an acquisition module, including an imaging lens and an array pixel unit, for acquiring The reflected speckle pattern light beam; a processing circuit connected to the emission module and the collection module for calculating the time-of-flight between the emission light beam and the reflection light beam; The sub-light source arrangement and/or the diffraction pattern of the spatial light modulator is a two-dimensional arrangement pattern with a first distortion feature; the projection lens has a second distortion feature, and the first distortion feature and the second distortion feature Compensate each other. The first distortion feature is a barrel distortion feature or a pincushion distortion feature, and the second distortion feature is a pincushion distortion feature or a barrel distortion feature.
本发明的有益效果为:提供一种距离测量系统,通过在硬件上实现畸变补偿,相对于传统的通过算法实现畸变补偿方案相比,不仅降低了对算法的要求,也可以从源头上解决畸变问题,效果更佳。The beneficial effect of the present invention is: to provide a distance measurement system, by realizing the distortion compensation on the hardware, compared with the traditional scheme of realizing the distortion compensation through the algorithm, not only the requirement for the algorithm is reduced, but also the distortion can be solved from the source problem, the effect is better.
附图说明Description of drawings
图1是根据本发明一个实施例的阵列光源距离测量系统示意图。Fig. 1 is a schematic diagram of an array light source distance measurement system according to an embodiment of the present invention.
图2是根据本发明一个实施例的发射模组示意图。Fig. 2 is a schematic diagram of a transmitting module according to an embodiment of the present invention.
图3是根据本发明又一个实施例的发射模组示意图。Fig. 3 is a schematic diagram of a transmitting module according to another embodiment of the present invention.
图4是根据本发明一个实施例的视差对成像影响示意图。Fig. 4 is a schematic diagram of the influence of parallax on imaging according to an embodiment of the present invention.
图5是根据本发明一个实施例的阵列光源示意图。Fig. 5 is a schematic diagram of an array light source according to an embodiment of the present invention.
图6是根据本发明一个实施例的畸变修正原理示意图。Fig. 6 is a schematic diagram of the principle of distortion correction according to an embodiment of the present invention.
其中,10-距离测量系统,11-发射模组,12-采集模组,13-处理电路,20-物体,30-发射光束,40-反射光束,111-阵列光源,112-空间光调制器,121-阵列像素单元,122-成像透镜单元,201-阵列光源,202-投影透镜,203-衍射光学元件,204-光束,205-光束,206-光束,301-阵列光源,302-投影透镜,303-光束,304-光束,305-光束,121-阵列像素单元,401-成像位置,402-成像位置,403-像素,51-阵列光源,511-VCSEL子光源,512-VCSEL子光源,61-第一畸变,62-第二畸变,63-补偿后的效果。Among them, 10-distance measurement system, 11-transmission module, 12-acquisition module, 13-processing circuit, 20-object, 30-emission beam, 40-reflection beam, 111-array light source, 112-spatial light modulator , 121-array pixel unit, 122-imaging lens unit, 201-array light source, 202-projection lens, 203-diffractive optical element, 204-beam, 205-beam, 206-beam, 301-array light source, 302-projection lens , 303-beam, 304-beam, 305-beam, 121-array pixel unit, 401-imaging position, 402-imaging position, 403-pixel, 51-array light source, 511-VCSEL sub-light source, 512-VCSEL sub-light source, 61-the first distortion, 62-the second distortion, 63-the effect after compensation.
具体实施方式Detailed ways
为了使本发明实施例所要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the technical problems, technical solutions and beneficial effects to be solved by the embodiments of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
需要说明的是,当元件被称为“固定于”或“设置于”另一个元件,它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件,它可以是直接连接到另一个元件或间接连接至该另一个元件上。另外,连接即可以是用于固定作用也可以是用于电路连通作用。It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the connection can be used for both fixing and circuit communication.
需要理解的是,术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明实施例和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying Any device or element must have a specific orientation, be constructed and operate in a specific orientation and therefore should not be construed as limiting the invention.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多该特征。在本发明实施例的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.
本发明提供了一种距离测量系统,其具有更强的抗环境光能力以及更高的分辨率。The invention provides a distance measurement system, which has stronger ability to resist ambient light and higher resolution.
图1是根据本发明一个实施例的阵列光源距离测量系统示意图。距离测量系统10包括发射模组11、采集模组12以及处理电路13,其中发射模组11提供发射光束30至目标空间中以照明空间中的物体20,至少部分发射光束30经物体20反射后形成反射光束40,反射光束40的至少部分被采集模组12采集,处理电路13分别与发射模组11以及采集模组12连接,同步发射模组11以及采集模组12的触发信号以计算光束由发射模组11发出并被采集模组12接收所需要的时间,即发射光束30与反射光束40之间的飞行时间t,进一步的,物体上对应点的距离D可由下式计算出:Fig. 1 is a schematic diagram of an array light source distance measurement system according to an embodiment of the present invention. The distance measurement system 10 includes a transmitting module 11, an acquisition module 12 and a processing circuit 13, wherein the transmitting module 11 provides a transmitting beam 30 to the target space to illuminate the object 20 in the space, and at least part of the transmitting beam 30 is reflected by the object 20 A reflected light beam 40 is formed, at least part of the reflected light beam 40 is collected by the collection module 12, and the processing circuit 13 is respectively connected with the emission module 11 and the collection module 12, and the trigger signals of the emission module 11 and the collection module 12 are synchronized to calculate the light beam The time required to be sent by the emission module 11 and received by the acquisition module 12, that is, the flight time t between the emission beam 30 and the reflection beam 40, further, the distance D of the corresponding point on the object can be calculated by the following formula:
D=c·t/2 (1)D=c·t/2 (1)
其中,c为光速。where c is the speed of light.
发射模组11包括阵列光源111、空间光调制器112。阵列光源111可以是发光二极管(LED)、边发射激光器(EEL)、垂直腔面发射激光器(VCSEL)等光源组成的阵列,优选地,阵列光源111是在单块半导体基底上生成多个VCSEL光源以形成的VCSEL阵列光源芯片,阵列光源111所发射的光束可以是可见光、红外光、紫外光等。阵列光源111在处理电路13的控制下向外发射光束,比如在一个实施例中,阵列光源111在处理电路13的控制下以一定的频率发射脉冲光束,可以用于直接时间飞行法(Direct TOF)测量中,频率根据测量距离进行设定,比如可以设置成1MHz~100MHz,测量距离在几米至几百米;在一个实施例中,光源111在处理电路13的控制下其发射的光束振幅被调制以发射方波光束、正弦波光束等连续波光束,可以用于间接飞行时间法(Indirect TOF)测量中。可以理解的是,可以是处理电路13中的一部分或者独立于处理电路13存在的子电路来控制光源111发射相关的光束,比如脉冲信号发生器。The emission module 11 includes an array light source 111 and a spatial light modulator 112 . The array light source 111 can be an array composed of light emitting diodes (LEDs), edge emitting lasers (EEL), vertical cavity surface emitting lasers (VCSEL) and other light sources. Preferably, the array light source 111 is formed by generating multiple VCSEL light sources on a single semiconductor substrate. With the formed VCSEL array light source chip, the light beam emitted by the array light source 111 may be visible light, infrared light, ultraviolet light, and the like. The array light source 111 emits a light beam outward under the control of the processing circuit 13. For example, in one embodiment, the array light source 111 emits a pulsed light beam at a certain frequency under the control of the processing circuit 13, which can be used in the direct time-of-flight method (Direct TOF ) measurement, the frequency is set according to the measurement distance, for example, it can be set to 1MHz to 100MHz, and the measurement distance is several meters to hundreds of meters; in one embodiment, the amplitude of the light beam emitted by the light source 111 is controlled by the processing circuit 13. Modulated to emit continuous wave beams such as square wave beams and sine wave beams, which can be used in indirect time-of-flight (Indirect TOF) measurements. It can be understood that it may be a part of the processing circuit 13 or a sub-circuit independent of the processing circuit 13 to control the light source 111 to emit relevant light beams, such as a pulse signal generator.
空间光调制器112接收来自光源111的载波光束,并将载波光束进行空间调制,即将载波光束在空间中的分布进行调制以形成强度分布不均匀的非泛光载波光束向外发射。与传统的泛光光束相比,由于非泛光光束的强度分布不均匀,在光源功率相同的情况下,强度分布较高的区域将具有对环境光更高的抗干扰性能;另外,在投射视场角相同的情况下,由于强度分布的不均匀性,即要达到相同的环境光抗干扰性能,泛光照明需要更高的功耗。在一些实施例中,空间光调制器112还用于将接收到的载波光束进行扩束,以扩大视场角。The spatial light modulator 112 receives the carrier light beam from the light source 111 and performs spatial modulation on the carrier light beam, that is, modulates the distribution of the carrier light beam in space to form a non-flood carrier light beam with uneven intensity distribution and emit it outward. Compared with the traditional flood beam, due to the non-uniform intensity distribution of the non-flood beam, in the case of the same light source power, the area with higher intensity distribution will have higher anti-interference performance to ambient light; in addition, when projecting In the case of the same field of view, due to the inhomogeneity of the intensity distribution, that is, to achieve the same anti-interference performance of ambient light, flood lighting requires higher power consumption. In some embodiments, the spatial light modulator 112 is also used to expand the received carrier beam to expand the field of view.
处理电路13可以是独立的专用电路,比如专用SOC芯片、FPGA芯片、ASIC芯片等等,也可以包含通用处理器,比如当该深度相机被集成到如手机、电视、电脑等智能终端中去,终端中的处理器可以作为该处理电路13的至少一部分。The processing circuit 13 can be an independent dedicated circuit, such as a dedicated SOC chip, FPGA chip, ASIC chip, etc., or can include a general-purpose processor, such as when the depth camera is integrated into smart terminals such as mobile phones, TVs, and computers. A processor in the terminal may serve as at least a part of the processing circuit 13 .
采集模组12包括阵列像素单元121、成像透镜单元122,成像透镜单元122接收并将由物体反射回的至少部分非泛光载波光束引导到至少部分所述阵列像素单元121上。在一个实施例中,阵列像素单元121可以是电荷耦合元件(CCD)、互补金属氧化物半导体(CMOS)、雪崩二极管(AD)、单光子雪崩二极管(SPAD)等组成的阵列像素单元,阵列像素单元121的阵列大小代表着该深度相机的分辨率,比如320x240等。一般地,与阵列像素单元121连接的还包括由信号放大器、时数转换器(TDC)、模数转换器(ADC)等器件中的一种或多种组成的读出电路(图中未示出)。The acquisition module 12 includes an array pixel unit 121 and an imaging lens unit 122 . The imaging lens unit 122 receives and guides at least part of the non-flood carrier beam reflected back by the object onto at least part of the array pixel unit 121 . In one embodiment, the array pixel unit 121 may be an array pixel unit composed of a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), an avalanche diode (AD), a single photon avalanche diode (SPAD), etc., and the array pixel The array size of the unit 121 represents the resolution of the depth camera, such as 320x240 and so on. Generally, a readout circuit (not shown in the figure) composed of one or more of devices such as a signal amplifier, a time-to-digital converter (TDC), and an analog-to-digital converter (ADC) is also connected to the array pixel unit 121. out).
在一些实施例中,距离测量系统10还可以包括彩色相机、红外相机、IMU等器件,与这些器件的组合可以实现更加丰富的功能,比如3D纹理建模、红外人脸识别、SLAM等功能。In some embodiments, the distance measurement system 10 may also include a color camera, an infrared camera, an IMU and other devices, and the combination of these devices can realize more abundant functions, such as 3D texture modeling, infrared face recognition, SLAM and other functions.
图2是根据本发明一个实施例的发射模组示意图。发射模组11包括阵列光源201、投影透镜202以及衍射光学元件(DOE)203,阵列光源201在处理电路13的功率时间调制下发射脉冲、方波或正弦波调制的光束,光束经投影透镜202的准直或聚焦后入射到DOE203,DOE203对入射的光束进行空间调制,即衍射。在一个实施例中,DOE203对入射的光束进行分束,并向目标空间中发射出多个光束204、205以及206,比如几万条光束,每条光束在物体20的表面形成一个斑点。在一个实施例中,DOE203将通过对入射光束的衍射形成规则排列(指各个斑点的角偏移均匀分布,规则排列入射到3D物体表面,排列会被重构)的斑点图案。在一个实施例中,DOE203将通过对入射光束的衍射形成散斑图案,即斑点图案中斑点的排列具备一定的随机性。Fig. 2 is a schematic diagram of a transmitting module according to an embodiment of the present invention. The emission module 11 includes an array light source 201, a projection lens 202, and a diffractive optical element (DOE) 203. The array light source 201 emits a pulse, square wave or sine wave modulated light beam under the power time modulation of the processing circuit 13, and the light beam passes through the projection lens 202. After being collimated or focused, it enters the DOE203, and the DOE203 performs spatial modulation on the incident beam, that is, diffraction. In one embodiment, the DOE 203 splits the incident light beam and emits a plurality of light beams 204 , 205 and 206 into the target space, such as tens of thousands of light beams, and each light beam forms a spot on the surface of the object 20 . In one embodiment, the DOE203 will form a speckle pattern in a regular arrangement (meaning that the angular offset of each spot is evenly distributed, and the regular arrangement is incident on the surface of a 3D object, and the arrangement will be reconstructed) by diffracting the incident light beam. In one embodiment, the DOE203 will form a speckle pattern by diffracting the incident light beam, that is, the arrangement of the spots in the speckle pattern has a certain degree of randomness.
在一些实施例中,DOE203也可以被掩膜板替代,掩膜板上包含将入射光束调制成非泛光光束的二维图案,从而可以通过掩膜板将入射光束经空间调制形成二维编码图案载波光束。In some embodiments, the DOE203 can also be replaced by a mask, which contains a two-dimensional pattern that modulates the incident beam into a non-flooded beam, so that the incident beam can be spatially modulated through the mask to form a two-dimensional code Pattern carrier beam.
图3是根据本发明又一个实施例的发射模组示意图。发射模组11包含阵列光源301以及投影透镜302,投影透镜302可以根据需要设计成单片或多片形式,阵列光源301发出光束经投影透镜302后向目标空间发射光束303、304、305,最终形成与阵列光源301上光源排列图案一致的投影图案,即斑点图案。处理电路13对阵列光源301进行时序功率调制以发射脉冲、方波或正弦波调制的光束。在一个实施例中,阵列光源301为VCSEL阵列光源。Fig. 3 is a schematic diagram of a transmitting module according to another embodiment of the present invention. The emission module 11 includes an array light source 301 and a projection lens 302. The projection lens 302 can be designed in a single-chip or multi-chip form as required. The light beam emitted by the array light source 301 passes through the projection lens 302 and then emits light beams 303, 304, and 305 to the target space, and finally A projection pattern consistent with the light source arrangement pattern on the array light source 301 , that is, a speckle pattern, is formed. The processing circuit 13 performs sequential power modulation on the array light source 301 to emit pulse, square wave or sine wave modulated light beams. In one embodiment, the array light source 301 is a VCSEL array light source.
图4是根据本发明又一实施例的视差对成像影响示意图。图4仅示例性示出部分阵列像素单元121,包含4行(R1,R2,R3,R4)以及8列(C1,C2,C3,C4,C5,C6,C7,C8)的共32个像素403。由目标反射回的光束通过成像透镜122将会成像在阵列像素单元121上,在本实施例中,假定单个光束将成像在2x2=4个左右的像素上,可以将该2x2=4个像素称为宏像素,单个宏像素对应单个光束形成的光斑。需要理解的是,这里的“成像”即可以指利用普通光子积分功能的CCD或CMOS图像传感器对入射光信号进行积分,也可以指利用SPAD图像传感器对入射光信号进行计数。Fig. 4 is a schematic diagram of the influence of parallax on imaging according to another embodiment of the present invention. Fig. 4 only exemplarily shows a part of the array pixel unit 121, including a total of 32 pixels in 4 rows (R1, R2, R3, R4) and 8 columns (C1, C2, C3, C4, C5, C6, C7, C8) 403. The light beam reflected by the target will be imaged on the array pixel unit 121 through the imaging lens 122. In this embodiment, assuming that a single light beam will be imaged on about 2x2=4 pixels, the 2x2=4 pixels can be called is a macro pixel, and a single macro pixel corresponds to a spot formed by a single beam. It should be understood that the "imaging" here can refer to the integration of incident light signals by a CCD or CMOS image sensor with a common photon integration function, or it can refer to the counting of incident light signals by a SPAD image sensor.
在本申请中,如图1所示,距离成像系统10中发射模组11与采集模组12离轴设置,二者之间存在一定的视差,因此当发射模组11向目标20发射光束30时,当目标20的距离变化时,视差将会导致光束在阵列像素单元121上的成像位置发生偏离。取任一光束为例进行说明,若距离成像系统的测量范围是[D1,D2],当目标20位于D1位置处,光束对应的成像位置是401;当目标位于D2位置处,光束对应的成像位置是402,考虑到成像倍数的问题,光斑的大小也会有微小的改变。因此,在进行实际测量时,往往需要预先根据测量范围确定好光斑的偏离范围,以指导处理器后期所执行的距离分析和计算。In the present application, as shown in FIG. 1 , the transmitter module 11 and the collection module 12 in the range imaging system 10 are arranged off-axis, and there is a certain parallax between the two, so when the transmitter module 11 emits a light beam 30 to the target 20 , when the distance of the target 20 changes, the parallax will cause the imaging position of the light beam on the array pixel unit 121 to deviate. Take any light beam as an example for illustration. If the measurement range of the distance imaging system is [D1, D2], when the target 20 is at the position D1, the imaging position corresponding to the beam is 401; when the target is at the position D2, the imaging position corresponding to the beam is The position is 402, considering the problem of imaging magnification, the size of the spot will also change slightly. Therefore, when performing actual measurement, it is often necessary to determine the deviation range of the light spot in advance according to the measurement range, so as to guide the distance analysis and calculation performed by the processor later.
图5是根据本发明一个实施例的阵列光源示意图。其中阵列光源51包含半导体基底以及设置在基底上的多个VCSEL子光源511以及512。无论对于图2还是图3所示的发射模组11,阵列光源51中子光源的排列密度都决定了最终发射模组11所投射出的光束30的图案密度,从而进一步影响深度计算的分辨率。然而,由于制造工艺、单个子光源的直径、多子光源相互影响等因素,导致两个子光源511不可能无限靠近,比如在当前两个光源511的间隔最小可以达到um级。Fig. 5 is a schematic diagram of an array light source according to an embodiment of the present invention. The array light source 51 includes a semiconductor substrate and a plurality of VCSEL sub-light sources 511 and 512 disposed on the substrate. Regardless of the emission module 11 shown in FIG. 2 or FIG. 3 , the arrangement density of the sub-light sources in the array light source 51 determines the pattern density of the beam 30 projected by the final emission module 11, thereby further affecting the resolution of depth calculation. . However, due to factors such as the manufacturing process, the diameter of a single sub-light source, and the mutual influence of multiple sub-light sources, it is impossible for the two sub-light sources 511 to be infinitely close together.
为了进一步增加分辨率,在本实施例中,阵列光源51被设置成交叉规则排列的阵列光源,即由多个第一子光源511组成的第一子光源阵列以及由多个第二子光源512组成的第二子光源阵列进行穿叉形成,图中为示区别将第一子光源511与第二子光源512画成两种不同的形式,并不是对两个子光源的实际属性进行任何限制。假定当前两个光源在制造时最小物理间隔为D,则通过相互穿叉之后最近两个光源沿横向、纵向的距离分别为x,y,且x<D,y<D,即交叉排列的横向、纵向间隔更小。由该阵列光源所形成的投射光束进一步被用于深度计算时,所形成的深度图像的分辨率均得到了提升,即与横、纵向间距均是D的规则阵列光源相比,穿叉设置的阵列光源可以在横向以及纵向上提升了分辨率。In order to further increase the resolution, in this embodiment, the array light source 51 is arranged as an array light source arranged in a regular crossing pattern, that is, a first sub-light source array composed of a plurality of first sub-light sources 511 and a plurality of second sub-light sources 512 The formed second sub-light source array is formed by intersecting. In the figure, the first sub-light source 511 and the second sub-light source 512 are drawn in two different forms for the sake of distinction, not to limit the actual properties of the two sub-light sources. Assuming that the minimum physical distance between the current two light sources during manufacture is D, the distances between the nearest two light sources along the horizontal and vertical directions are x, y respectively after crossing each other, and x<D, y<D, that is, the cross-arranged horizontal , The vertical interval is smaller. When the projected light beam formed by the array light source is further used for depth calculation, the resolution of the formed depth image has been improved, that is, compared with the regular array light source with both horizontal and vertical spacings D, the cross-set The array light source can improve the resolution horizontally and vertically.
在一个实施例中,第一子光源阵列以及第二子光源阵列可以被独立控制,以在不同的应用中进行独立开启或全部开启。In one embodiment, the first sub-light source array and the second sub-light source array can be independently controlled to be turned on independently or all of them in different applications.
除了由于制造物理尺寸限制影响分辨率之外,视差导致成像效果也在一定程度上影响分辨率。如图4所示,在发射模组11与采集模组12之间的基线、距离测量系统10的测量范围确定之后,由视差所引起的光斑偏离值的区间也就确定了,为了避免相邻两个光斑被误识别,比如假定光斑偏离区间横向8个像素值,若横向两个像素之间的间隔对应在阵列像素单元121上的间隔小于8个像素,就会引起误识别,即在同一个区间上会存在至少两个光斑,由此会导致测量误差。为了避免引起误识别,相邻子光源在横向间隔上就有了最小限制(由视差、测量范围等确定)。通过图5所示的交叉光源设置则可以在横向上提升分辨率,此外由于横向上进行了交错设置,在制造工艺极限的前提下纵向分辨率也得到了提升。In addition to affecting the resolution due to the limitation of manufacturing physical size, the imaging effect caused by parallax also affects the resolution to a certain extent. As shown in Figure 4, after the baseline between the emission module 11 and the collection module 12 and the measurement range of the distance measurement system 10 are determined, the interval of the deviation value of the facula caused by the parallax is also determined, in order to avoid adjacent Two light spots are misidentified. For example, assuming that the light spots deviate from the horizontal interval of 8 pixel values, if the interval between two horizontal pixels corresponds to the interval on the array pixel unit 121 is less than 8 pixels, it will cause misidentification. There will be at least two light spots on an interval, which will cause measurement errors. In order to avoid misidentification, there is a minimum limit (determined by parallax, measurement range, etc.) on the lateral interval between adjacent sub-light sources. The horizontal resolution can be improved through the cross light source setting shown in Figure 5. In addition, due to the staggered horizontal setting, the vertical resolution is also improved under the premise of the limit of the manufacturing process.
图6是根据本发明一个实施例的畸变修正原理示意图。在上述各实施例中,均没有考虑系统畸变影响,在实际的距离测量系统中,由投影透镜和/或成像透镜均会带来畸变,例如桶形畸变、枕形畸变。对于结构光技术而言,畸变可以增加结构光图像的不相关度,因此往往是被允许的,然而对于时间飞行距离测量而言,特别对于本申请中的离轴系统而言,较大的畸变是不被允许的。如图4所示,若存在较大的畸变,光斑因视差的偏离将不再是沿横向,也存在纵向上的偏离,当纵向偏离过大时,比如超出了宏像素对应的行区间,将会导致测量有较大的误差。为了降低畸变,本实施例中提供了一种畸变补偿的原理,即通过在距离测量系统中,设计两种相反的畸变特征以达到补偿的目的,即第一(正向)畸变61以及第二(负向)畸变62,补偿后的效果如63所示,比如若将桶形畸变称为正向畸变,枕形畸变则是负向畸变。Fig. 6 is a schematic diagram of the principle of distortion correction according to an embodiment of the present invention. In the above embodiments, the influence of system distortion is not considered. In an actual distance measurement system, distortions, such as barrel distortion and pincushion distortion, will be brought about by the projection lens and/or imaging lens. For structured light technology, distortion can increase the irrelevance of structured light images, so it is often allowed, but for time-of-flight distance measurement, especially for the off-axis system in this application, larger distortion is not allowed. As shown in Figure 4, if there is a large distortion, the deviation of the light spot due to parallax will no longer be along the horizontal direction, and there will also be a vertical deviation. When the vertical deviation is too large, such as exceeding the row interval corresponding to the macro pixel, the It will lead to a large error in the measurement. In order to reduce distortion, this embodiment provides a principle of distortion compensation, that is, by designing two opposite distortion features in the distance measurement system to achieve the purpose of compensation, that is, the first (positive) distortion 61 and the second (Negative) distortion 62, the effect after compensation is shown in 63, for example, if barrel distortion is called positive distortion, pincushion distortion is negative distortion.
在一个实施例中,发射模组11中的阵列光源和/或DOE与投影透镜被分别设计成正、负向畸变以达到降低投影图案的畸变程度。比如对于图2、图3所示实施例中,若投影透镜202是桶(枕)形畸变,则一种方式可以将阵列光源201上的子光源排列设计成枕(桶)形畸变的二维排列图案,另一种方式可以将DOE203的衍射图案设计成枕(桶)形畸变的二维衍射图案。当然也可以通过同时对阵列光源201上的子光源排列以及DOE203的衍射图案进行同时设计以补偿由投影透镜引起的畸变效果。可以理解的是,此处光源调制解调器是DOE,也可以为其他的具备相同或相似功能的器件,如下的实施例中类似。In one embodiment, the array light source and/or DOE and projection lens in the emitting module 11 are respectively designed to be positively and negatively distorted so as to reduce the degree of distortion of the projected pattern. For example, in the embodiment shown in FIG. 2 and FIG. 3 , if the projection lens 202 has a barrel (pillow) distortion, then one way may be to design the arrangement of the sub-light sources on the array light source 201 as a two-dimensional pillow (barrel) distortion. Arrangement pattern, another way can design the diffraction pattern of DOE203 as a pillow (barrel) distortion two-dimensional diffraction pattern. Of course, it is also possible to simultaneously design the sub-light source arrangement on the array light source 201 and the diffraction pattern of the DOE 203 to compensate for the distortion effect caused by the projection lens. It can be understood that the light source modem here is a DOE, and may also be other devices with the same or similar functions, as in the following embodiments.
在一个实施例中,发射模组11与采集模组12被分别设计成正、负向畸变特征以达到降低投影图案的畸变程度。若采集模组12中的成像透镜122是桶(枕)形畸变,则将发射模组11发射出的斑点图案设计成具有枕(桶)形畸变特征的斑点图案,同样可以通过多种方式实现枕(桶)形畸变斑点图案的设计。对于图2所示的发射模组实施例而言:一是直接将阵列光源201上的子光源排列设计成具有枕(桶)形畸变特征的二维排列图案;二是将投影透镜设计成枕(桶)形畸变透镜;三是将DOE的衍射图案设计成枕(桶)形畸变二维衍射图案(对于发射模组有DOE的情形而言);四是将阵列光源排列图案、投影透镜、DOE衍射图案中的至少两种进行综合设计以投射出枕(桶)形畸变的斑点图案。对于图3所示的发射模组实施例而言:一是直接将阵列光源301上的子光源排列设计成具有枕(桶)形畸变特征的二维排列图案;二是将投影透镜设计成枕(桶)形畸变透镜;三是将阵列光源排列图案、投影透镜进行综合设计以投射出枕(桶)形畸变的斑点图案。In one embodiment, the emitting module 11 and the collecting module 12 are respectively designed to have positive and negative distortion characteristics to reduce the degree of distortion of the projected pattern. If the imaging lens 122 in the collection module 12 has a barrel (pillow) shape distortion, then the speckle pattern emitted by the emission module 11 is designed to be a speckle pattern with a pillow (barrel) shape distortion feature, which can also be realized in a variety of ways. Design of pillow (barrel) distorted speckled pattern. For the embodiment of the emission module shown in Figure 2: one is to directly design the arrangement of the sub-light sources on the array light source 201 as a two-dimensional arrangement pattern with a pillow (barrel) distortion feature; the other is to design the projection lens as a pillow (barrel)-shaped distortion lens; the third is to design the diffraction pattern of the DOE into a pillow (barrel)-shaped distortion two-dimensional diffraction pattern (for the case where the emission module has a DOE); the fourth is to arrange the pattern of the array light source, projection lens, At least two of the DOE diffraction patterns are designed in combination to project a pincushion (barrel) distorted spot pattern. For the embodiment of the emission module shown in Figure 3: one is to directly design the arrangement of the sub-light sources on the array light source 301 as a two-dimensional arrangement pattern with a pillow (barrel) distortion feature; the other is to design the projection lens as a pillow (barrel)-shaped distortion lens; the third is to comprehensively design the arrangement pattern of the array light source and the projection lens to project a pillow (barrel)-shaped distorted spot pattern.
图6所示的畸变修正方案通过在硬件上实现畸变补偿,相对于传统的通过算法实现畸变补偿方案相比,不仅降低了对算法的要求,也可以从源头上解决畸变问题,效果更佳。The distortion correction scheme shown in Figure 6 achieves distortion compensation on the hardware. Compared with the traditional algorithm-based distortion compensation scheme, it not only reduces the requirements for the algorithm, but also solves the distortion problem from the source, and the effect is better.
可以理解的是,当将本发明的距离测距系统嵌入装置或硬件中时会作出相应的结构或部件变化以适应需求,其本质仍然采用本发明的距离测距系统,所以应当视为本发明的保护范围。It can be understood that when the distance ranging system of the present invention is embedded in a device or hardware, corresponding structural or component changes will be made to meet the requirements, and its essence still adopts the distance ranging system of the present invention, so it should be regarded as scope of protection.
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的技术人员来说,在不脱离本发明构思的前提下,还可以做出若干等同替代或明显变型,而且性能或用途相同,都应当视为属于本发明的保护范围。The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be assumed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art to which the present invention belongs, without departing from the concept of the present invention, several equivalent substitutions or obvious modifications can be made, and the same performance or use should be considered as belonging to the protection scope of the present invention.
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