CN108230928A - Virtual LED display module and 2 times of frequency displaying methods based on the I-shaped LED chip of three colors - Google Patents

Abstract

The invention relates to a virtual LED display module based on a three-color I-shaped LED chip and a double frequency display method. The virtual LED display module includes: a three-color LED chip set composed of three-color I-shaped LED chips and a single-color LED chip; each three-color I-shaped LED chip includes 5 LED light-emitting units; in the three-color LED chip set, A plurality of three-color I-shaped LED chips are arranged in an m×n array, and a single-color LED chip is arranged in the middle of adjacent three-color I-shaped LED chips in the m×n array along the first direction; The LED light-emitting units are arranged to form multiple triangles, and the distance between any adjacent LED light-emitting units along the first direction is equal. The present invention adopts an I-shaped LED chip with three colors of RGB, which is prepared based on three colors of luminescent materials based on GaN materials, and realizes virtual pixel display through double scanning, thereby improving image display clarity.

Description

Virtual LED display module and double frequency display based on three-color I-shaped LED chip method

technical field

The invention relates to the display field of LED display screens, in particular to a virtual LED display module based on a three-color I-shaped LED chip and a double frequency display method.

Background technique

As a digital image display medium, the LED display can display the image information of the video image source in real time. There are two key factors that affect the display effect of the LED display: one is the resolution of the LED display; the other is the display color and gray level of the display. Indoor LED displays generally adopt small-pitch LED displays with high physical resolution, and the LED dot pitch is below P2.5, mainly including P2.5, P2.0, P1.8, P1.5 and other specifications. At present, the display color and grayscale standards of LED display screens can meet the requirements, while indoor LED display screens have always had higher requirements for resolution, hoping to achieve higher display resolution.

There are two ways to increase the display resolution: one is to increase the physical resolution, and the other is to realize a high virtual resolution through sub-pixel sharing for virtual display. At present, the immaturity of high-density electronic assembly technology of LED tubes in China, the physical size of LED tubes and electronic components packaging, the complexity of circuits, and the high cost have hindered the improvement of the physical resolution of display screens. As for the sub-pixel virtual display, although relevant studies have shown that the number of pixels can be increased by 4 times through virtual display, or even a higher frequency doubling effect, but with the increase in the number of frequency doubling, it will bring blurred or dragged images. tail phenomenon. Therefore, in order to further improve the resolution of the indoor small-pitch display, relying solely on virtual display cannot achieve the desired effect.

Therefore, finding a display unit with a simple structure and low cost, which can more effectively increase the display resolution, has been a research hotspot in the industry at present.

Contents of the invention

Therefore, in order to solve the technical defects and deficiencies existing in the prior art, the present invention proposes a virtual LED display module based on three-color I-shaped LED chips and a 2-fold frequency display method.

Specifically, a virtual LED display module based on a three-color I-shaped LED chip proposed by an embodiment of the present invention includes: a three-color LED chip group composed of a three-color I-shaped LED chip and a single-color LED chip; each The three-color I-shaped LED chip includes 5 LED light-emitting units; in the three-color LED chip group, multiple three-color I-shaped LED chips are arranged in an m×n array, and the single-color LED chips are arranged in an m×n array along the first In the middle of adjacent three-color I-shaped LED chips in the direction; in the three-color LED chip group, multiple LED light-emitting units are arranged to form multiple triangles, and the distance between any adjacent LED light-emitting units along the first direction is equal.

In one embodiment of the present invention, the virtual LED display module further includes a virtual display control circuit for controlling the virtual LED display module to perform virtual display.

In one embodiment of the present invention, the virtual display control circuit is a double frequency scanning circuit.

In one embodiment of the present invention, the three-color I-shaped LED chip is an RGB three-color integrated LED chip prepared based on GaN material.

In one embodiment of the present invention, the three-color I-shaped LED chip includes 2 LED units of the first primary color, 2 LED units of the second primary color and 1 LED unit of the third primary color.

In one embodiment of the present invention, the three-color I-shaped LED chip includes 2 red LED units, 2 green LED units and 1 blue LED unit.

In one embodiment of the present invention, the three-color I-shaped LED chip further includes: a first common electrode disposed on the first end of the three-color I-shaped bar-shaped LED chip; three second electrodes respectively disposed on the three The second end of the LED lighting unit.

Another embodiment of the present invention provides a virtual LED double-frequency display method based on a three-color I-shaped LED chip, which is used to drive a virtual LED display module for virtual display. The virtual LED 2 multiplier display method includes:

Define 2 kinds of scanning coordinates, including the first coordinate and the second coordinate;

Divide each input frame image into 2 timing scan periods, including the first scan period and the second scan period;

Generate display data corresponding to each scan cycle according to the image pixel data of each frame of image;

Receive the display data, and drive the virtual LED display module according to two types of scanning coordinates and scanning cycle.

In one embodiment of the present invention, the two scan coordinates include:

The first coordinate, starting from the upper left corner of the virtual LED display module, takes every three rows as a cycle. Every 2 sub-pixels in the first row and 1 sub-pixel in the second row and its nearest neighbor constitute a virtual display pixel. Every 2 sub-pixels of a row and the second row and its nearest neighbor 1 sub-pixel constitute a virtual display pixel; the first sub-pixel and the last sub-pixel of the third row each constitute a third of a virtual display pixel; each sub-pixel Pixels are only used once;

The second coordinate starts from the upper left corner of the virtual LED display module, with every three lines as a period, the first sub-pixel and the last sub-pixel in the third line each constitute a third of a virtual display pixel; the remaining sub-pixels are determined by Every 2 sub-pixels in the first row and 1 sub-pixel in the second row and its nearest neighbor constitute a virtual display pixel, and every 2 sub-pixels in the third row and 1 sub-pixel in the second row and its closest neighbor constitute a virtual display pixel ; Each subpixel is used only once.

In one embodiment of the present invention, the step of generating display data corresponding to each scanning cycle according to the image pixel data of each frame image includes:

generating first display data corresponding to the first scanning period according to the first coordinates and the image pixel data of each frame of image;

The second display data corresponding to the second scanning period is generated according to the second coordinates and the image pixel data of each frame of image.

The virtual LED display module based on the three-color I-shaped LED chip provided by the embodiment of the present invention adopts an RGB three-color I-shaped integrated LED chip prepared by GaN materials with four colors of light-emitting materials. The thickness of the layer enables a plurality of the three-color I-shaped LED chips to be regularly arranged, spliced and assembled into a three-color LED chip group, forming a small-pitch three-color I-shaped light-emitting unit matrix array with equal spacing and uniform arrangement of all primary color light-emitting units, which improves the physical resolution. At the same time, the virtual LED display module adopts the method of sub-pixel sharing, and uses the virtual display control circuit to scan it twice to realize virtual pixel display, and the visual density is increased to about 2 times, which further significantly improves the display resolution, making The clarity of image display has been significantly improved, effectively improving the display effect.

Other aspects and features of the present invention will become apparent from the following detailed description with reference to the accompanying drawings. It should be understood, however, that the drawings are designed for purposes of illustration only and not as a limitation of the scope of the invention since reference should be made to the appended claims. It should also be understood that, unless otherwise indicated, the drawings are not necessarily drawn to scale and are merely intended to conceptually illustrate the structures and processes described herein.

Description of drawings

The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

Fig. 1 is a schematic structural diagram of a virtual LED display module based on a three-color I-shaped LED chip provided by an embodiment of the present invention;

FIG. 2 is a schematic structural view of a three-color I-shaped LED chip provided by an embodiment of the present invention;

3 is a schematic structural view of a three-color I-shaped LED chip provided by another embodiment of the present invention;

4 is a flowchart of a method for preparing a three-color I-shaped LED chip provided by an embodiment of the present invention;

Fig. 5 is a flow chart of a virtual LED 2-fold frequency display method based on a three-color I-shaped LED chip provided by an embodiment of the present invention;

Fig. 6 is a first coordinate schematic diagram of the virtual display pixel distribution of the virtual LED display module based on the three-color I-shaped LED chip provided by the embodiment of the present invention;

Fig. 7 is a second coordinate schematic diagram of the virtual display pixel distribution of the virtual LED display module based on the three-color I-shaped LED chip provided by the embodiment of the present invention;

FIG. 8 is a schematic diagram of virtual display pixel distribution of a virtual LED display module based on a three-color I-shaped LED chip provided by an embodiment of the present invention.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

Embodiment one

Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of a virtual LED display module based on a three-color I-shaped LED chip provided by an embodiment of the present invention.

The virtual LED display module 10 includes: a three-color LED chip group 11 composed of several three-color I-shaped LED chips 12 and a single-color LED chip 13; each three-color I-shaped LED chip 12 includes 5 LED light-emitting units, Specifically, two first primary color LED light emitting units, two second primary color LED light emitting units, and one third primary color LED light emitting unit; the several three-color I-shaped LED chips 12 are arranged in an m×n array, and the lateral distance is D2, the longitudinal spacing is D1. The single-color LED chips 13 are arranged in the middle of the adjacent three-color I-shaped LED chips along the lateral direction. The LED light-emitting units in the three-color LED chipset 11 are arranged to form a plurality of triangles, and each triangle forms a display pixel, such as P11 and P12. And the spacing between any adjacent LED light emitting units along the lateral direction is equal.

In one embodiment of the present invention, each three-color I-shaped LED chip 12 includes 2 red LED units, 2 green LED units and 1 blue LED unit; the single-color LED chip 13 is a blue LED chip.

In another embodiment of the present invention, each three-color I-shaped LED chip 12 includes 2 red LED units, 1 green LED unit and 2 blue LED units; the single-color LED chip 13 is a green LED chip.

In yet another embodiment of the present invention, each three-color I-shaped LED chip 12 includes 1 red LED unit, 2 green LED units and 2 blue LED units; the single-color LED chip 13 is a red LED chip.

The virtual LED display module 10 also includes a virtual display control circuit 14 for controlling the LED display module to perform virtual display. The virtual display control circuit 14 has a storage chip and a driver chip, the storage chip is used to store the received display data, and the driver chip generates a corresponding driving current after receiving the display data to drive the virtual LED display module to display images or video data . In one embodiment of the present invention, the minimum display unit P of the regular array composed of all LED light-emitting units of the virtual LED display module 10 includes three LED light-emitting units R, G, and B of different primary colors. These three LED light-emitting units Forming a triangle, each LED light-emitting unit serves as a sub-pixel of the virtual LED display module 10 . The virtual display control circuit 13 adopts a 2-times frequency scanning circuit to perform 2-times frequency scanning on the LED display module, so that each LED sub-pixel is shared twice, and an array is generated around the actual sub-pixels of the virtual LED display module. The regularly arranged double number of virtual pixels makes the display resolution significantly improved, and the image display is clearer.

In addition, it is worth mentioning that, in the virtual LED display module 10 of the embodiment of the present invention, several three-color I-shaped LED chips 12 can be placed horizontally and arranged regularly in the manner shown in FIG. The font-shaped LED chips are arranged vertically. In this case, the single-color LED chips 13 are arranged in the middle of vertically adjacent three-color I-shaped LED chips, and the distance between any adjacent vertically adjacent LED light-emitting units is equal. In this way, a high-resolution virtual display with twice the frequency can also be realized.

Referring to FIG. 2 , FIG. 2 is a schematic structural diagram of a three-color I-shaped LED chip provided by an embodiment of the present invention. The three-color I-shaped LED chip 12 is an RGB three-color integrated LED chip prepared based on GaN material and three colors of luminescent materials. As shown in Figure 2, the three-color I-shaped LED chip 12 includes five LED light emitting units, specifically two first primary color LED light emitting units, two second primary color LED light emitting units, and one third primary color LED light emitting unit. . Among them, one LED light-emitting unit of the first primary color and one light-emitting unit of the second primary color are arranged separately on the left and right sides of the upper part of the word "工", and the other one LED light-emitting unit of the first primary color and another LED light-emitting unit of the second primary color Separately arranged on the left and right sides of the lower part of the character "工", and the last third primary color LED light-emitting unit is distributed in the middle of the character "工". The same end of the upper part and the lower part of the word "工" can be LED light-emitting units of the same primary color, and can also be LED light-emitting units of different primary colors.

In one embodiment of the present invention, each three-color I-shaped LED chip 12 includes two red LED units as the first red LED unit 21 and the second red LED unit 24, and two green LED units as the second red LED unit. A green LED unit 22, a second green LED unit 25, and a blue LED unit 23, wherein the first red LED unit and the first green LED unit are separately arranged at the left end and the right end of the upper part of the word "工"; The second red LED unit and the second green LED unit are separately arranged at the left end and the right end of the lower part of the "工" character, or arranged separately at the right and left ends of the lower part of the "工" character; one blue LED light-emitting unit is arranged In the middle of the word "工".

In another embodiment of the present invention, each three-color I-shaped LED chip 12 includes 2 red LED units, 1 green LED unit and 2 blue LED units, wherein 1 red LED unit and 1 The blue LED units are arranged separately at the left and right ends of the upper part of the character "工", and the other red LED unit and the other blue LED unit are arranged separately at the left and right ends of the lower part of the "工" character, or separately arranged at the The right and left ends of the lower part of the character "工"; the last green LED light-emitting unit is arranged in the middle of the character "工".

In yet another embodiment of the present invention, each three-color I-shaped LED chip 12 includes 1 red LED unit, 2 green LED units and 2 blue LED units, wherein 1 green LED unit and 1 The blue LED units are arranged separately at the left and right ends of the upper part of the character "工", and the other green LED unit and the other blue LED unit are arranged separately at the left and right ends of the lower part of the "工" character, or separately arranged at the The right and left ends of the lower part of the character "工"; the last red LED light-emitting unit is arranged in the middle of the character "工".

Isolation material is filled around each LED light-emitting unit, and an isolation layer is formed between two adjacent LED light-emitting units, including a first red LED isolation layer 213, a first green LED isolation layer 223, and a blue LED isolation layer 233. , the second red LED isolation layer 243 , the second green LED isolation layer 253 . 1 and 2, when the three-color I-shaped LED chip 12 of the embodiment of the present invention is prepared, the thickness of the isolation layer is considered. When the three-color LED chip group 11 of the LED display module 10 is used, it is necessary to ensure that the spacing between any adjacent LED light-emitting units along the lateral direction is equal. Therefore, when determining the thickness of the isolation layer, in order to compensate for the gaps D ₁ and D ₂ that exist between two adjacent three-color I-shaped LED chips 12 when splicing and assembling a plurality of three-color I-shaped LED chips 12, the thickness Can't be too small. Specifically, for example, the thicknesses of the isolation layers on the edges of each three-color I-shaped LED chip 12 are d ₁ , d ₂ , d ₃ , d ₄ , d ₅ , and d ₆ , and inside the three-color I-shaped LED chip 12, the left and right The thickness of the isolation layer between two adjacent LED light emitting units is d ₇ to d ₈ . Generally, (D ₁ +d ₁ +d ₄ )<d ₇ =d ₈ , (D ₂ +d ₅ +d ₆ )=d ₇ =d ₈ should be satisfied. Under the conditions, try to minimize the values of the distances D ₁ and D ₂ between adjacent chips, and the values of d ₁ , d ₂ , d ₃ , d ₄ , d ₅ , d ₆ , d ₇ and d ₈ Also try to take a smaller value so as to minimize the distance between two adjacent LED light-emitting units, thereby maximizing the physical resolution of the virtual LED display module.

In another embodiment of the present invention, the thicknesses of the isolation layers on the upper, lower, left and right edges of each three-color I-shaped LED chip 12 are equal, that is, d ₁ =d ₂ =d ₃ =d ₄ = d ₅ =d ₆ , inside the three-color I-shaped LED chip 12 , the thickness of the isolation layer between the upper and lower adjacent and left and right adjacent LED light-emitting units is also equal, that is, d ₇ =d ₈ . When a plurality of three-color I-shaped LED chips 12 are assembled into a three-color LED chip group 11 , the distance between two adjacent three-color I-shaped LED chips 12 is D ₁ <D ₂ .

The three-color I-shaped LED chip 12 also includes N-type electrodes and P-type electrodes. In one embodiment of the present invention, each LED light-emitting unit is provided with a pair of N-type electrodes and P-type electrodes respectively, the N-type electrodes are arranged at the N-type end of each LED light-emitting unit, and the P-type electrodes are arranged at each LED light-emitting unit. The P-type end of the light-emitting unit. Specifically, for example, the first red LED light-emitting unit 21 is provided with an N-type electrode 211 and a P-type electrode 212, the first green LED light-emitting unit 22 is provided with an N-type electrode 221 and a P-type electrode 222, and the blue LED light-emitting unit 23 is provided with There are N-type electrodes 241 and P-type electrodes 242, the second red LED light emitting unit 24 is provided with N-type electrodes 241 and P-type electrodes 242, and the second green LED light-emitting unit 25 is provided with N-type electrodes 251 and P-type electrodes 252 .

Referring to FIG. 3 , FIG. 3 is a schematic structural diagram of a three-color I-shaped LED chip provided by another embodiment of the present invention. In order to make the structure of the three-color I-shaped LED chip 30 simpler, multiple N-type electrodes of all LED light-emitting units are set as a common N-type electrode, which is arranged on the N-type end of the three-color I-shaped LED chip 30. Each P-type electrode is independently arranged on the P-type end of each LED light-emitting unit, or a plurality of P-type electrodes of all LED light-emitting units are set as a common P-type electrode, which is arranged on the P-side of the three-color I-shaped LED chip 30. A plurality of N-type electrodes are independently arranged on the N-type end of each LED light-emitting unit.

Specifically, in one embodiment of the present invention, the three-color I-shaped LED chip 30 includes five LED light emitting units: a first red LED light emitting unit 31, a first green LED light emitting unit 32, a blue LED light emitting unit 33, The second red LED light emitting unit 34 and the second green LED light emitting unit 35 . The first red LED light-emitting unit 31 is provided with an N-type electrode 311, the first green LED light-emitting unit 32 is provided with an N-type electrode 321, the blue LED light-emitting unit 33 is provided with an N-type electrode 331, and the second red LED light-emitting unit 34 An N-type electrode 341 is provided, the second green LED light emitting unit 35 is provided with an N-type electrode 351 , and a common P-type electrode 36 is provided at the P-type end of the three-color I-shaped LED chip 30 .

To sum up the above embodiments, the virtual LED display module based on the three-color I-shaped LED chip provided by the above-mentioned embodiment of the present invention adopts an integrated RGBY three-color I-shaped LED chip prepared based on GaN materials with four colors of light-emitting materials. By rationally setting the thickness of the isolation layer in each area, a plurality of the three-color I-shaped LED chips are regularly arranged, spliced and assembled into a three-color LED chip group, and a small-pitch three-color I-shaped light emission with all primary color light-emitting units arranged at equal intervals is formed. Cell matrix array, increased physical resolution. At the same time, the virtual LED display module uses a virtual display control circuit to scan it 4 times to realize virtual pixel display, which further significantly improves the display resolution.

Embodiment two

The three-color I-shaped LED chip of the embodiment of the present invention is an RGB three-color integrated I-shaped LED chip prepared based on a GaN material and using a total of three colors of light-emitting materials. The three-color I-shaped LED chip structurally includes 5 LED light-emitting units, which are 2 red-light LED light-emitting units, 2 green-light LED light-emitting units, and 1 blue-light LED light-emitting unit, and also includes N-type electrodes and P-type electrodes. . The surroundings of the five LED light-emitting units are all filled with isolation substances, forming an isolation layer between two adjacent LED light-emitting units.

Referring to FIG. 4 , FIG. 4 is a flowchart of a method for preparing a three-color I-shaped LED chip provided by an embodiment of the present invention. Specifically, the preparation method of the three-color I-shaped LED chip is as follows:

401. Select a substrate.

In one embodiment of the present invention, sapphire material or SiC material is selected as the substrate.

402. Prepare a blue LED light emitting structure on the substrate to obtain a monochromatic light emitting structure.

The material of the blue LED light emitting structure includes GaN material. Specifically, the first GaN buffer layer, the first GaN stable layer, the first n-type GaN layer, the first InGaN/GaN multi-quantum well active layer, the first p-type AlGaN barrier layer, the first p-type GaN layer. Wherein, the first InGaN/GaN multi-quantum well active layer includes multiple GaN barrier layers and multiple InGaN quantum well layers, and the GaN barrier layers and InGaN quantum well layers are arranged alternately.

403. Etching a red light wick groove on the monochromatic light emitting structure, preparing a red light LED light emitting structure in the red light wick groove, to obtain a two-color light emitting structure.

In one embodiment of the present invention, the PECVD process is used to deposit the first _SiO2 layer on the first p-type GaN layer, and the wet etching process is used to etch the first rectangular window at a specific position on the first _SiO2 layer, Then use the dry etching process to continuously etch the window area to form the first groove, remove the first _SiO2 layer, and deposit on the upper surface of the first p-type GaN layer, the upper surface of the substrate and the sidewall of the first groove The second _SiO2 layer, using a dry etching process to etch the second SiO2 layer on the upper surface of the first p-type GaN layer and the upper surface of the substrate to form a first _SiO2 isolation layer _on the sidewall of the first groove , used to isolate the blue light-emitting structure and the red light-emitting structure, thus forming a red light wick groove.

Prepare the second GaN buffer layer, the second n-type GaAs buffer layer, the second n-type GaAs stable layer, the second GalnP/AlGaInP multi-quantum well active layer, the second p-type AlGaInP barrier layer, a second p-type GaAs contact layer. Wherein, the second GalnP/AlGaInP multi-quantum well active layer includes multiple GalnP barrier layers and multiple AlGaInP barrier layers, and the GalnP barrier layers and AlGaInP barrier layers are arranged alternately.

In one embodiment of the present invention, wet etching process is used to etch two first rectangular windows to form two first grooves and two red light wick grooves, and finally two red light LED light emitting structures are prepared.

404. Etching and forming green light wick grooves on the two-color light emitting structure, preparing a green LED light emitting structure in the green light wick groove, to obtain a first three-color light emitting structure.

In one embodiment of the present invention, a third SiO2 layer is deposited on the first p-type GaN layer by using a PECVD process _; a second rectangular window is etched at a specific position on the third _SiO2 layer by a wet etching process; Then use the dry etching process to continuously etch the window area to form the second groove and then remove the third _SiO2 layer; deposit on the upper surface of the first p-type GaN layer, the upper surface of the substrate and the sidewall of the second groove The fourth _SiO2 layer; using a dry etching process to etch the fourth _SiO2 layer on the upper surface of the first p-type GaN layer and the upper surface of the substrate to form a second _SiO2 isolation layer on the sidewall of the second groove , used to isolate the red light emitting structure, the blue light emitting structure and the green light emitting structure, so far the green light wick groove is formed.

The third GaN buffer layer, the third GaN stable layer, the third n-type GaN layer, the third InGaN/GaN multi-quantum well active layer, the third p-type AlGaN barrier layer, the third p type GaN layer. Wherein, the third p-type AlGaN barrier layer includes multiple GaN barrier layers and multiple InGaN quantum well layers, and the GaN barrier layers and InGaN quantum well layers are arranged alternately.

In one embodiment of the present invention, the wet etching process is used to etch two second rectangular windows to form two second grooves and two green wick grooves, and finally two green LED light emitting structures are prepared.

In one embodiment of the present invention, the first four-color light-emitting structure prepared through steps 401-404 includes two red light-emitting structures, two green light-emitting structures, one blue light-emitting structure, and two red light-emitting structures. structure and two green light emitting structures are distributed around one blue light emitting structure. The order of step 403, step 404, and step 405 can be exchanged arbitrarily.

405. Prepare a light-shielding material on the upper surface of the first three-color light-emitting structure, form a light-emitting window with a specified layout and size, and obtain a second three-color light-emitting structure;

In an embodiment of the present invention, in the prepared second four-color light-emitting structure, the light-emitting windows of the two red light-emitting structures, two green light-emitting structures and one blue light-emitting structure are equal in size, and the two red light-emitting structures and The two green light emitting structures are symmetrically arranged up and down and left and right around one blue light emitting structure.

406. Etching the second three-color light-emitting structure, removing redundant parts at the edge, to obtain a third three-color light-emitting structure with a specific shape;

In one embodiment of the present invention, the prepared third four-color light-emitting structure is an "I"-shaped structure.

407. Prepare an N-type electrode at the N-type end of the third three-color light-emitting structure, and prepare a P-type electrode at the P-type end to obtain a three-color I-shaped LED chip.

In one embodiment of the present invention, an N-type electrode and a P-type electrode are respectively prepared at the N-type end and the P-type end of each light-emitting unit.

In another embodiment of the present invention, a common N-type electrode is prepared at the N-type end of the third three-color light-emitting structure, and a P-type electrode is prepared at the P-type end of each light-emitting unit.

In yet another embodiment of the present invention, a common P-type electrode is prepared at the P-type end of the third three-color light-emitting structure, and an N-type electrode is prepared at the N-type end of each light-emitting unit.

In the preparation method of the embodiment of the present invention, when etching wick grooves of other primary colors on each light-emitting structure, the position of the groove determines the distribution of the light-emitting units of each primary color in the finally prepared three-color I-shaped LED chip, and the size of the groove The size of each primary color luminous unit is determined, and the distance between adjacent grooves determines the dot pitch of each primary color luminous unit. Therefore, by setting different parameter values, various three-color I-shaped LED chips with different specifications can be prepared, such as 2R2GB I-shaped, 2RG2B I-shaped, and R2G2B I-shaped LED chips.

In summary, according to the preparation method of the embodiment of the present invention, a three-color integrated I-shaped LED chip can be prepared, and the chip can generate light of various colors in the form of a single chip, which greatly reduces the amount of phosphor powder used; in addition , the chip is integrated and highly integrated, which greatly reduces the production cost; and the chip also has the advantage of flexible adjustment of color temperature.

Embodiment Three

Referring to FIG. 5 , FIG. 5 is a flow chart of a virtual LED 2-fold frequency display method based on a three-color I-shaped LED chip provided by an embodiment of the present invention. The virtual LED display method includes the following steps:

501. Define two types of scan coordinates.

As shown in Figure 1, the virtual LED display module of the embodiment of the present invention includes 69 primary color light-emitting units, that is, 69 sub-pixels, and every 3 sub-pixels constitute a display pixel, and can constitute a maximum of 23 display pixels.

Referring to FIG. 6, FIG. 6 is a first coordinate schematic diagram of the virtual display pixel distribution of the virtual LED display module based on the three-color I-shaped LED chip provided by the embodiment of the present invention. Starting from the upper left corner of the virtual LED display module, with every three rows as a cycle, every 2 sub-pixels in the first row and 1 sub-pixel in the second row and its nearest neighbor constitute a virtual display pixel, and every 2 sub-pixels in the third row sub-pixels and the second row and its nearest adjacent sub-pixel constitute a virtual display pixel; the first sub-pixel and the last sub-pixel of the third row each constitute a third of a virtual display pixel; each sub-pixel is only used once .

Referring to FIG. 7 , FIG. 7 is a second coordinate schematic diagram of the virtual display pixel distribution of the virtual LED display module based on the three-color I-shaped LED chip provided by the embodiment of the present invention. Starting from the upper left corner of the virtual LED display module, with every three lines as a cycle, the first sub-pixel and the last sub-pixel of the third line each constitute a third of a virtual display pixel; the remaining sub-pixels are formed by the first line Every 2 sub-pixels and the 1st adjacent sub-pixel in the second row form a virtual display pixel, and every 2 sub-pixels in the 3rd row and the 1st adjacent sub-pixel in the second row constitute a virtual display pixel; each sub-pixel Pixels are only used once.

Referring to FIG. 8 , FIG. 8 is a schematic diagram of virtual display pixel distribution of a virtual LED display module based on three-color I-shaped LED chips provided by an embodiment of the present invention. Each LED light-emitting unit is shared twice, and the four adjacent LED light-emitting units can form two virtual display pixels. In this way, the number of virtual display pixels generated by the 69 primary color light-emitting units is 42, which is about twice the number of actual display pixels.

502. Divide each frame of the input image into two sequential scanning periods, and the two scanning periods include equal time periods.

503. Generate a display corresponding to each scan cycle according to the image pixel data of each frame of image

data.

generating first display data corresponding to the first scanning period according to the first coordinates and the image pixel data of each frame of image;

The second display data corresponding to the second scanning period is generated according to the second coordinates and the image pixel data of each frame of image.

504. Receive display data, and drive the virtual LED display module according to the defined scanning coordinates, scanning timing and period.

In the embodiment of the present invention, the virtual display control circuit has a storage chip and a driver chip. The storage chip is used to store the received display data. Display of video data. When the input data source is an image, the virtual display of the image is completed after two scans; if the input data source is a video, two scans are performed on one frame of image to complete the virtual display, and then the next frame of image is scanned twice scanning, culminating in a high-resolution virtual display of the video data.

Through the virtual LED double-frequency display method based on the three-color I-shaped LED chip of the embodiment of the present invention, the three-color I-shaped integrated LED chip is used to achieve a smaller dot pitch, and then through the method of sub-pixel sharing, the original 23 Display pixels, can form 42 virtual display pixels. The sub-pixels located on the peripheral edge of the virtual LED display module generally cannot be shared twice. When the virtual LED display module is large and the number of light-emitting units forming the virtual LED display module is large, the visual density increases to about 2 times. Therefore, the method of the embodiment of the present invention significantly improves the definition of image display, effectively improves the display effect, and has good application value in the field of indoor display screens.

The LED display module described in the above embodiments may be any of LED light bars, LED light boards, LED boxes, LED display screens and the like.

To sum up, this article uses specific examples to illustrate the virtual LED display module based on the three-color I-shaped LED chip and the 2-fold frequency display method of the present invention. The description of the above embodiments is only used to help understand the present invention. method and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. The limitation of the invention, the scope of protection of the present invention should be based on the appended claims.

Claims (10)

1. a kind of virtual LED display module based on the I-shaped LED chip of three colors, which is characterized in that including：It is I-shaped by three colors The three-color LED chipset of LED chip and monochromatic LED chip composition；Each I-shaped LED chip of three colors includes 5 LED and sends out Light unit；

In the three-color LED chipset, multiple I-shaped LED chips of three colors are arranged with m n array, the monochromatic LED core Piece is arranged in the m n array and goes up among the adjacent I-shaped LED chip of three colors along the first direction；

In the three-color LED chipset, multiple LED luminescence units rearrange multiple triangles, and along the first party Spacing between LED luminescence units described in arbitrary neighborhood is equal.

2. virtual LED display module according to claim 1, which is characterized in that the virtual LED display module further includes Virtual display control circuit, for the virtual LED display module to be controlled virtually to be shown.

3. virtual LED display module according to claim 2, which is characterized in that the virtual display control circuit is 2 times Frequency scanning circuit.

4. virtual LED display module according to claim 1, which is characterized in that the I-shaped LED chip of three colors is base In the LED chip of RGB tri- colors one prepared by GaN material.

5. virtual LED display module according to claim 1, which is characterized in that the I-shaped LED chip of three colors includes 2 the first primary-color LED units, 2 the second primary-color LED units and 1 third primary-color LED unit.

6. virtual LED display module according to claim 5, which is characterized in that the I-shaped LED chip of three colors includes 2 red-light LED units, 2 green light LED units and 1 blue-ray LED unit.

7. virtual LED display module according to claim 5, which is characterized in that the I-shaped LED chip of three colors also wraps It includes：

1 the first public electrode is set to the first end of the I-shaped bar-shaped LED chip of three color；

3 second electrodes are respectively arranged at the second end of three LED luminescence units.

8. a kind of 2 times of frequency displaying methods of virtual LED based on the I-shaped LED chip of three colors, for driving such as claim 1~7 Any virtual LED display module is virtually shown, which is characterized in that including：

2 kinds of scanning coordinates are defined, including the first coordinate and the second coordinate；

Is divided to each frame image of input, including the first scan period and the second scan period the scan period of 2 sequential；

The display data of each corresponding scan period is generated according to the image pixel data of each frame image；

The display data is received, according to 2 kinds of scanning coordinates, scan periods, the virtual LED display module is driven It is dynamic.

9. display methods according to claim 8, which is characterized in that 2 kinds of scanning coordinates include：

First coordinate, since the virtual LED display module upper left corner, with every three behaviors a cycle, by every the 2 of the first row A sub-pixel and the second row 1 sub-pixel closest with it form a virtual display pixel, by every 2 sub- pictures of the third line Element forms a virtual display pixel with the second row 1 sub-pixel closest with it；First sub-pixel of the third line and last One sub-pixel respectively forms 1/3rd virtual display pixels；Each sub-pixel only uses once；

Second coordinate, since the virtual LED display module upper left corner, with every three behaviors a cycle, the third line first Sub-pixel and the last one sub-pixel respectively form 1/3rd virtual display pixels；Remaining sub-pixel, by every 2 of the first row Sub-pixel and the second row 1 sub-pixel closest with it form a virtual display pixel, by every 2 sub-pixels of the third line 1 sub-pixel closest with it with the second row forms a virtual display pixel；Each sub-pixel only uses once.

10. display methods according to claim 8 or claim 9, which is characterized in that according to the image pixel of each frame image The step of display data of each corresponding scan period of data generation, includes：

According to the image pixel data of first coordinate and each frame image, generation corresponding first scan period First display data；

According to the image pixel data of second coordinate and each frame image, generation corresponding second scan period Second display data.