CN106815549B

CN106815549B - Package structure and its manufacturing method

Info

Publication number: CN106815549B
Application number: CN201510918434.4A
Authority: CN
Inventors: 唐绍祖; 蔡岳颖; 蔡瀛洲
Original assignee: Siliconware Precision Industries Co Ltd
Current assignee: Siliconware Precision Industries Co Ltd
Priority date: 2015-11-30
Filing date: 2015-12-11
Publication date: 2022-07-15
Anticipated expiration: 2035-12-11
Also published as: CN106815549A; TW201719813A; TWI591768B

Abstract

A package structure and a manufacturing method thereof, the package structure includes: a substrate, an electronic component embedded in the substrate and having a sensing surface, and an insulating layer formed on the substrate and the sensing surface, through the insulating layer The sensing surface of the electronic component is covered to prevent fingers from directly touching the sensing area, so that the problem of failure of the electronic component due to damage to the sensing surface can be avoided.

Description

Package structure and method for fabricating the same

Technical Field

The present invention relates to a package structure, and more particularly, to a package structure of a fingerprint sensor and a method for fabricating the same.

Background

With the improvement of living standard, the degree of privacy emphasis of consumers is increasing day by day, and many advanced electronic products are equipped with identification systems to increase the security of data in the electronic products, so the development and design of identification systems are also the direction of electronic industry development along with consumer demands.

Today identification systems are mainly developed towards biometric systems (biometrics). In the biometric identification system, two types of biometric identification systems, i.e., physiological characteristics (e.g., fingerprint, pupil, face, voice print) and behavior characteristics (e.g., signature, voice) can be broadly classified according to different identification targets, wherein the biometric identification system for identifying the physiological characteristics has the advantages of singleness, high anti-counterfeiting degree, convenience, and the like, and thus is widely accepted by consumers.

In addition, since high-end electronic products are developed in the direction of high integration such as light, thin, short, small, etc., most of the biometric devices are fingerprint identification devices or face identification devices, and the fingerprint identification devices are most widely used, so as to achieve the purpose of making the electronic products light, thin, short, and small. In the conventional fingerprint recognition device, the scanning method of the fingerprint is divided into an optical fingerprint recognition device for scanning a fingerprint pattern and a silicon crystal fingerprint recognition device for detecting trace charges in the fingerprint pattern.

As shown in fig. 1, a conventional package structure 1 with a fingerprint image sensor (fingerprint sensor) includes a substrate 10 having a first electrical contact pad 101, a sensing chip 11 having a sensing region 110 and a second electrical contact pad 111, and an encapsulant 12 covering the sensing chip 11 and exposing the sensing region 110, so that a user can touch and slide (swipe) the sensing region 110 to sense a fingerprint.

Specifically, the sensing chip 11 is disposed on the substrate 10, and a plurality of bonding wires 13 are electrically connected to the first electrical contact pad 101 of the substrate 10 and the second electrical contact pad 111 of the sensing chip 11, and the encapsulant 12 is formed on the substrate 10 to seal the bonding wires 13.

However, since a finger of the silicon fingerprint image sensor directly touches the sensing area 110 of the sensing chip 11, the surface of the sensing area 110 is easily damaged, which shortens the lifetime of the conventional fingerprint image sensor.

Therefore, how to overcome the above problems in the prior art, increase the service life of the fingerprint image sensor, and satisfy the expectation of diversified package structures is a direction to be urgently developed in the industry.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the present invention provides a package structure and a method for fabricating the same, which can avoid the problem of failure of the electronic component due to the damage of the sensing surface.

The packaging structure of the invention comprises: a substrate having a first surface and a second surface opposite to each other; the electronic component is embedded in the substrate, has opposite sensing surfaces and non-sensing surfaces and is electrically connected with the substrate; and an insulating layer formed on the first surface of the substrate and the sensing surface of the electronic component.

The invention also provides a manufacturing method of the packaging structure, which comprises the following steps: providing a substrate embedded with an electronic component, wherein the substrate is provided with a first surface and a second surface which are opposite, and the electronic component is provided with a sensing surface and a non-sensing surface which are opposite, so that the sensing surface of the electronic component is exposed out of the first surface of the substrate, and the electronic component is electrically connected with the substrate; and forming an insulating layer on the first surface of the substrate and the sensing surface of the electronic component.

In the foregoing package structure and the method for fabricating the same, the substrate has an opening communicating the first and second surfaces for placing the electronic component in the opening, so that a package body can be formed in the opening to cover the electronic component before the insulating layer is formed, wherein the package body is formed by compression molding or transfer molding.

In the foregoing package structure and the method for fabricating the same, the electronic component is a fingerprint sensing chip.

In the foregoing package structure and the manufacturing method thereof, the sensing surface of the electronic component is electrically connected to the substrate by wire bonding (wire bonding).

In the foregoing package structure and the method for fabricating the same, the insulating layer is formed by spraying.

In the foregoing package structure and the method for fabricating the same, the insulating layer is made of one of paint, ceramic, sapphire, glass, and zirconia.

Therefore, the package structure and the manufacturing method thereof cover the sensing surface of the electronic component through the insulating layer to prevent a finger from directly touching the sensing surface, so compared with the prior art, the package structure and the manufacturing method thereof can avoid the defect that the electronic component fails due to the damage of the sensing surface.

Drawings

FIG. 1 is a cross-sectional view of a conventional package structure; and

fig. 2A to fig. 2F are schematic cross-sectional views illustrating a manufacturing method of a package structure according to the present invention.

Description of the symbols

1,2 packaging structure

10,20 substrates

101,201 first electrical contact pad

11 sensing chip

110 sensing region

12 packaging colloid

13,23 welding line

111,202 second electrical contact pad

20a first surface

20b second surface

200 opening

21 electronic assembly

21a sensing surface

21b non-sensing surface

210 electrode pad

22 Package

24 insulating layer

25 conductive assembly

9 bonding layer.

Detailed Description

Other advantages and capabilities of the present invention will be apparent to those skilled in the art from the present disclosure by describing specific embodiments of the present invention in the following. The invention may be practiced or carried out in various other embodiments, and its several details are capable of modification in various, obvious aspects all without departing from the spirit of the invention.

It should be understood that the structures, proportions, and dimensions shown in the drawings and described in the specification are for illustrative purposes only and are not intended to limit the scope of the present invention, which is defined by the claims. The term "sensing surface" used herein means, but is not limited to, a surface having a sensing region in an electronic device, and similarly, a surface without a sensing region is a "non-sensing surface". In addition, the terms "above", "first", "second", and the like, referred to in the present specification, are for clarity of description only, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial changes in the technical contents thereof.

Fig. 2A and 2F are schematic cross-sectional views illustrating a method for fabricating the package structure 2 according to the present invention.

As shown in fig. 2A, a substrate 20 is disposed on a bonding layer 9 such as a film (film) or a tape, and the substrate 20 has a first surface 20a and a second surface 20b opposite to each other, and is bonded to the bonding layer 9 by the first surface 20 a.

In the present embodiment, the substrate 20 has a plurality of openings 200 communicating the first and

second surfaces

20a,20 b.

In addition, the substrate 20 is a circuit board, and has a first electrical contact pad 201 and a plurality of second electrical contact pads 202 on the first surface 20a and the second surface 20b, respectively.

As shown in fig. 2B, a plurality of electronic components 21 are respectively disposed in the openings 200.

In the present embodiment, the electronic component 21 has a sensing surface 21a and a non-sensing surface 21b opposite to each other, the sensing surface 21a has a sensing region (not shown) and an electrode pad 210 thereon, and the electronic component 21 is bonded to the bonding layer 9 by the sensing surface 21a thereof.

In addition, the electronic component 21 is a sensing chip, i.e. a sensing chip for detecting the change of the charge of the living body, the temperature difference, the pressure, etc., and more preferably a fingerprint identification chip, which can perform the biological identification through the capacitance difference received by the sensing surface 21 a.

As shown in fig. 2C, a package 22 is formed in each opening 200 to cover each electronic component 21, so that each electronic component 21 is embedded in the substrate 20. Then, the bonding layer 9 is removed, so that the sensing surface 21a of the electronic component 21 is exposed out of the first surface 20a of the substrate 20.

In the present embodiment, the method of forming the package body 22 is compression molding or transfer molding.

As shown in fig. 2D, a plurality of bonding wires 23 are respectively connected to each of the first electrical contact pads 201 and each of the electrode pads 210 by wire bonding, so that each of the electronic components 21 is electrically connected to the substrate 20.

As shown in fig. 2E, an insulating layer 24 is formed on the first surface 20a of the substrate 20 and the sensing surface 21a of the electronic component 21, such that the insulating layer 24 completely covers the bonding wires 23 and completely covers the sensing surface 21 a.

In the present embodiment, the method of forming the insulating layer 24 is a spraying method, and the material of the insulating layer 24 is paint (ink type or acryl type), ceramic, sapphire, glass or zirconia.

As shown in fig. 2F, a singulation process is performed along the cutting path S shown in fig. 2E to form the package structure 2 of the present invention, and a plurality of conductive elements 25, such as solder balls, are formed on the second electrical contact pads 202 of the second surface 20b of the substrate 20, so that the package structure 2 is bonded to an electronic device (not shown) through the plurality of conductive elements 25.

When using the fingerprint sensor with the package structure 2 of the present invention, the sensing surface 21a scans the received capacitance by touching the surface of the insulating layer 24 with a finger, such as charge variation, temperature difference, pressure, etc. for the electronic component 21 to recognize.

The invention provides a package structure 2, which includes a substrate 20, an electronic component 21, a package 22 and an insulating layer 24.

The substrate 20 has a first surface 20a and a second surface 20b opposite to each other, and an opening 200 communicating the first and

second surfaces

20a,20 b.

The electronic component 21 is disposed in the opening 200 and has a sensing surface 21a and a non-sensing surface 21b opposite to each other, so that the sensing surface 21a of the electronic component 21 is exposed to the first surface 20a of the substrate 20, and the electronic component 21 is electrically connected to the substrate 20.

The package 22 is formed in the opening 200 to encapsulate the electronic component 21.

The insulating layer 24 is formed on the first surface 20a of the substrate 20 and the sensing surface 21a of the electronic component 21.

In one embodiment, the electronic component 21 is a fingerprint sensing chip.

In one embodiment, the sensing surface 21a of the electronic component 21 is electrically connected to the first surface 20a of the substrate 20 through at least one bonding wire 23.

In one embodiment, the insulating layer 24 is formed of paint, ceramic, sapphire, glass, or zirconia.

In summary, in the package structure 2 and the manufacturing method thereof of the present invention, the insulating layer 24 covers the sensing surface 21a of the electronic component 21 to prevent a finger from directly touching the sensing surface 21a of the electronic component 21, so compared with the prior art, the present invention can avoid the defect that the sensing surface 21a is damaged to cause the failure of the electronic component 21, thereby prolonging the life of the package structure 2.

In addition, the electronic component 21 is disposed in the opening 200, which not only reduces the overall height of the package structure 2, but also reduces the distance from the sensing surface 21a to the first surface 20a of the substrate 20, so as to improve the sensing sensitivity of the sensing surface 21 a.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.

Claims

1. a package structure, it is characterized in that, this package structure comprises:

a base plate, which has an opposite first surface and a second surface, and the base plate has an opening communicating with the first and second surfaces;

An electronic component is placed in the opening to be embedded in the substrate, and has opposite sensing surfaces and non-sensing surfaces, and the sensing surface is electrically connected to the substrate by bonding wires, wherein the electronic components The sensing surface of the component is flush with the first surface of the substrate;

a package body formed in the opening to enclose the electronic component; and

An insulating layer is formed on the package body, the first surface of the substrate and the sensing surface of the electronic component, so that the insulating layer completely covers the bonding wire and the sensing surface.

2 . The package structure of claim 1 , wherein the electronic component is a fingerprint sensor chip. 3 .

3 . The package structure of claim 1 , wherein the insulating layer is formed of one of paint, ceramics, sapphire, glass or zirconia. 4 .

4. A preparation method of a package structure, characterized in that the preparation method comprises:

A substrate is provided, wherein the substrate has opposite first and second surfaces and an opening communicating with the first and second surfaces;

An electronic component is placed in the opening, and the electronic component has opposite sensing surfaces and non-sensing surfaces, so that the sensing surface of the electronic component is exposed on the first surface of the substrate, and the sensing surface of the electronic component is the surface is flush with the first surface of the substrate;

forming a package body in the opening to cover the electronic component so that the electronic component is embedded in the substrate;

The sensing surface of the electronic component is electrically connected to the substrate by bonding wires by means of bonding wires; and

5 . The method of claim 4 , wherein the method of forming the package body is compression molding or transfer molding. 6 .

6 . The method of claim 4 , wherein the electronic component is a fingerprint sensor chip. 7 .

7 . The method of claim 4 , wherein the insulating layer is formed by spraying. 8 .

8 . The method of claim 4 , wherein the insulating layer is formed from one of paint, ceramics, sapphire, glass or zirconia. 9 .