CN106409745A - Peeling method and peeling apparatus - Google Patents

Abstract

Provided are a peeling method and a peeling device capable of peeling a protective tape (sheet) affixed to a semiconductor wafer (plate member) without using a peeling tape with a complicated structure and a large burden on running costs. According to the present application, a peeling method and a peeling device capable of performing the peeling method are provided. The peeling method includes at least: a first peeling step of making the front end of the front needle-shaped member abut against the sheet of the plate-shaped member held by the holding table. At least a part of the outer periphery, so that this part is peeled from the plate-shaped member; the peeling starting point generation process blows air between the part of the peeled sheet and the plate-shaped member, and generates a part that includes the part. a peeling starting point formed by the enlarged peeling region; and a final peeling step of separating and peeling the unpeeled remaining portion of the sheet from the plate-shaped member starting from the peeling starting point.

Description

Stripping method and stripping device

technical field

The present invention relates to a peeling method and a peeling device for peeling a sheet adhered to a plate-like member such as a semiconductor wafer.

Background technique

In the manufacturing process of semiconductor devices, a plurality of regions are divided by dividing lines arranged in a grid pattern on the front surface of a substantially disk-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the divided regions. And, after the back surface of the semiconductor wafer is ground to a predetermined thickness by a grinding device, the semiconductor wafer is cut along a planned dividing line by a dicing device, a laser processing device, etc. Individual semiconductor devices are manufactured by dividing.

In order to miniaturize semiconductor chips such as ICs and LSIs, it is preferable to make the back surface of the semiconductor wafer (plate-shaped member) as thin as possible in the above-mentioned grinding process, and to protect the front surface of the semiconductor wafer on which devices are formed during grinding. On the other hand, a protective tape (sheet) made of an adhesive film or the like is pasted.

After the grinding process is completed, the protective tape needs to be peeled off from the semiconductor wafer. As a method for peeling the protective tape, it is known to bond an adhesive tape for peeling to the end of the protective tape by thermocompression, and pull the adhesive tape. The protective tape is peeled off from the semiconductor wafer, wherein the protective tape is stuck on the front surface of the semiconductor wafer (for example, refer to Patent Documents 1 and 2).

Patent Document 1: Japanese Patent Application Laid-Open No. 11-016862

Patent Document 2: Japanese Patent Laid-Open No. 2003-338477

In the peeling device of the protective tape based on the above-mentioned prior art, there is the following problem: since the protective tape is stuck on the front surface of the semiconductor wafer due to the pressing force generated during the grinding process, it becomes difficult to peel the protective tape from the front surface of the semiconductor wafer. In the case of a protective tape, a peeling tape exhibiting a strong adhesive force is attached to the protective tape, and the peeling tape is pulled to peel off the protective tape. In order to realize this structure, at least a conveying mechanism for the peeling tape, The structure of the cutting mechanism of the peeling tape and the crimping mechanism of the peeling tape becomes complicated. Furthermore, the following problems have also arisen: as described above, a strong adhesive force is required for the peeling tape, and it is required to be able to withstand the strength of the peeling process of the protective tape firmly attached, and the tape used as a consumable The running cost of the peeling tape of the peeling device becomes high.

In addition, in the above-mentioned conventional technology, there is a problem in that after the peeling tape is bonded to the end of the protective tape by pressure and peeled, the peeled protective tape is discarded in the waste container of the peeling device. , The adhesive surface of the peeling tape will adhere to the side wall of the waste container, regardless of whether there is any remaining capacity in the waste container, the peeled protective tape will block the opening of the waste container, and the capacity of the waste container cannot be fully utilized.

Contents of the invention

The object of the present invention is to provide a peeling method and peeling device capable of peeling a protective tape (sheet) attached to a semiconductor wafer (plate-like member) without using a tape for peeling with a complicated structure or a large burden of running costs. .

In order to solve the above-mentioned technical problems, according to the present invention, a peeling method is provided for peeling a sheet attached to a plate-shaped member from the plate-shaped member, wherein the peeling method includes at least the following steps: a first peeling step, making the front end The front end portion of the needle-shaped member abuts against at least a part of the outer periphery of the sheet of the plate-shaped member held by the holding table, so that the part is peeled off from the plate-shaped member; Air is blown between the sheet and the plate member to generate a peeling starting point formed by an enlarged peeling region including the part; and the final peeling process is to make the sheet from the peeling starting point The unpeeled remaining portion is separated from the plate-like member for peeling.

In the above-mentioned peeling method, the peeling method has a peeling starting point clamping step, after the peeling starting point generating step, the generated peeling starting point is clamped, and the final peeling is performed through the peeling starting point clamping step process. In addition, in the peeling starting point generating step, there may be a second peeling step, in which air is blown between the sheet and the plate-shaped member, and after the peeling starting point is generated, it is further abutted against the tip of the tip needle-shaped member. The exfoliation area is enlarged.

Furthermore, according to the present invention, there is provided a peeling device for peeling a sheet adhered to a plate-shaped member from a plate-shaped member, wherein the peeling device has: The holding surface on which the plate-shaped member is held; the peeling starting point generation unit, which makes the front end of the needle-shaped member abut against at least a part of the outer periphery of the sheet of the plate-shaped member held by the holding table so that the part is removed from the plate. The part is peeled off, and air is blown between the part of the sheet that has been peeled off and the plate-shaped part to generate a peeling starting point formed by an enlarged peeling area including the part; The peeling starting point that has been peeled off is clamped; the separation unit separates the clamping unit that clamped the peeling starting point upward relative to the holding table; The lower side of the holding unit acts on the adhesive surface side of the sheet peeled off from the plate-shaped member, and bends the sheet in the peeling direction while peeling off the plate-shaped member; and the moving unit makes the sheet The bending roller and at least one of the holding tables move relatively in a peeling direction parallel to the plate-shaped member, so that the sheet is peeled from the plate-shaped member, and the sheet is completely removed from the plate-shaped member by the movement of the moving unit. Plate parts are peeled off.

In the above peeling device, there are: a sheet holding unit that sucks and holds the sheet peeled from the plate member; and a waste container that stores the peeled sheet, and is preferably configured as follows: After the sheet holding unit sucks and holds the sheet, it moves to directly above the waste container, releases the suction of the suction-held sheet directly above the waste container, and stores the sheet in the waste container. In waste container.

The peeling method of the present invention is constituted as above, and is a peeling method for peeling a sheet attached to a plate-shaped member from a plate-shaped member. Since the peeling method includes at least: a first peeling step, the front end of the needle-shaped member at the front end is abutting against at least a part of the outer periphery of the sheet of the plate-shaped member held by the holding table, and peeling the part from the plate-shaped member; Air is blown between the shaped parts to generate a peeling starting point formed by an enlarged peeling region including the part; Since the strip is separated and peeled from the plate-shaped member, there is no need for a mechanism for conveying, cutting, and crimping the strip for stripping, and expensive consumables such as a strip for stripping are unnecessary, and the running cost at the time of performing the stripping process can be suppressed.

Furthermore, the peeling device of the present invention is a peeling device that peels the sheet attached to the plate-shaped member from the plate-shaped member. Since the peeling device has: The holding surface for holding; a peeling starting point generating unit that abuts the front end of the needle member against at least a part of the outer periphery of the sheet of the plate member held by the holding table to peel the part from the plate member Air is blown between the part of the peeled sheet and the plate member to generate a peeling starting point formed by an enlarged peeling region including the part; The peeling starting point is clamped; the separation unit is used to separate the clamping unit clamping the peeling starting point from the holding table upward; the bending roller is used to separate the clamping unit from the upward separation The lower side acts on the adhesive surface side of the sheet peeled from the plate-shaped member, bending the sheet in the peeling direction while peeling off the plate-shaped member; and a moving unit that makes the bending roller At least one of the holding tables is relatively moved in a peeling direction parallel to the plate-shaped member, so that the sheet is peeled off from the plate-shaped member, and the sheet is completely removed from the plate-shaped member by the movement of the moving unit. Therefore, similar to the above, there is no need for conveying, cutting, and crimping mechanisms for the stripping tape, and expensive consumables such as the stripping tape are not required, and the running cost when performing the stripping process can be suppressed.

In addition, it is preferable that the peeling device includes: a sheet holding unit that sucks and holds the sheet peeled from the plate member; and a waste container that stores the peeled sheet, and the sheet holding unit There is a waste unit, after the sheet is sucked and held, it is moved to the top of the waste container, the suction of the suctioned and held sheet is released right above the waste container, and the sheet is stored in the waste container. In waste container. In the peeling device used in the present invention, since no adhesive consumables such as peeling tapes are used, there is no such thing as sticking to the entrance or the inner side of the waste container when the sheet is stored in the waste container. Unfortunately, the sheets can be easily discarded by stacking them from the bottom of the waste container by the sheet holding unit, and the capacity of the waste container can be fully utilized.

Description of drawings

Figure 1 is a perspective view of a peeling device constructed in accordance with the present invention.

(a), (b), and (c) of FIG. 2 are perspective views showing the sheet holding unit of the peeling device shown in FIG. 1 .

Fig. 3 is a perspective view showing a support frame of bending rollers constituting the peeling device shown in Fig. 1 .

Fig. 4 is a perspective view of a peeling origin generating unit of the peeling device shown in Fig. 1 .

Fig. 5 is a side view of main parts of the peeling device shown in Fig. 1 .

6 is a side view of main parts showing a state in which the semiconductor wafer to which the protective tape is pasted is placed on the holding table in the state shown in FIG. 5 .

7 is a side view of main parts showing a state in which the holding table is moved to move the semiconductor wafer from the state in FIG. 6 .

8 is a side view of main parts showing a state in which the tip needle member is moved downward from the state shown in FIG. 7 to approach the semiconductor wafer.

FIG. 9 is a side view of main parts showing a state in which the tip needle member is brought into contact with the semiconductor wafer from the state shown in FIG. 8 .

10 is a side view of main parts showing a state in which air is sprayed from the air nozzle between the peeled portion of the protective tape and the semiconductor wafer from the state of FIG. 9 .

Fig. 11 is a side view of main parts showing a state in which the grip member is operated to grip the outer peripheral end of the peeled protective tape from the state shown in Fig. 10 .

Fig. 12 is a side view of main parts showing a state in which the bending roller is moved to contact the adhesive surface of the protective tape from the state of Fig. 11 .

Fig. 13 is a view showing a state in which the protective tape is bent and peeled off by moving the bending roller and the holding table from the state of Fig. 12 .

FIG. 14 is a diagram showing a state in which the protective tape is peeled off from the semiconductor wafer by moving the bending rollers from the state in FIG. 13 .

FIG. 15 is a diagram illustrating a state in which the peeled protective tape is sucked and held on the lower surface of the sheet holding plate from the state in FIG. 14 .

16 is a side view of main parts showing a state in which the sheet holding unit is moved to directly above the waste container while the protective tape is sucked and held on the lower surface of the sheet holding plate from the state in FIG. 15 .

Fig. 17 is a diagram showing a state in which the sheet holding plate is lowered into the waste container from the state in Fig. 16 .

Label description

1: Peeling device; 2: Stationary abutment; 3: Holding table mechanism (holding table); 4: Sheet holding unit; 5: Bending roller moving unit; 6: Peeling starting point generating unit; 7: Waste container ;10: semiconductor wafer (plate-shaped part); 11: protective tape (sheet); 12: peeling starting point; 31, 31: guide rail; 32: mobile base; 36: table main body; 44: No. 2 cylinder; 47: No. 3 cylinder; 48: Clamping member; 55: Bending roller; 61: No. 4 cylinder; 64: Front part; 65: Front needle part; 66: Air nozzle.

detailed description

Hereinafter, preferred embodiments of a peeling method according to the present invention and a peeling device for performing the peeling method will be described in detail with reference to the drawings.

FIG. 1 shows a perspective view of one embodiment of a peeling device 1 constructed according to the present invention. The peeling device 1 in the illustrated embodiment includes a stationary base 2 , a holding table mechanism 3 , a sheet holding unit 4 , a bending roller moving unit 5 , a peeling starting point generating unit 6 , and a waste container 7 .

As shown in the figure, the holding table mechanism 3 includes: two guide rails 31, 31, which are arranged on the stationary base 2 along the feeding direction (peeling direction) of the peeling process shown by arrow X; 32, which is slidably arranged on the two guide rails 31, 31; the ball screw shaft 33, which is engaged with the nut portion on the lower surface of the mobile base 32 along the guide rails 31, 31; bearing 34, This ball screw shaft 33 is rotatably supported on one end side of the ball screw shaft 33 ; Move in a free reciprocating manner in the X direction.

The moving base 32 has a cylindrical table body 36 disposed on the moving base 32 , and an adsorption chuck 37 disposed on the upper surface of the table body 36 . The suction chuck 37 is formed of a porous ceramic material, is connected to a suction unit (not shown), and an appropriate negative pressure is generated on the surface of the suction chuck 37 . Therefore, the semiconductor wafer 10 constituting the plate-shaped member of the present invention placed on the suction chuck 37 is sucked and held on the suction chuck 37 by operating a suction unit (not shown).

As shown in Fig. 1 and (a) to (c) of Fig. 2, the sheet holding unit 4 is arranged on the stationary base 2, and the sheet holding unit 4 has: a first air cylinder 41, which is erected on the stationary base 2. and a holding base 43 supported by a shaft 42 extending from the first cylinder 41 . The holding base 43 is provided with: a second air cylinder 44 erected on the upper surface; and a sheet holding plate 46 penetrating from the second air cylinder 44 to the lower surface side of the holding base 43 and second. 2. The cylinder 44 is supported by the shaft 45 which can move forward and backward freely; the third cylinder 47 is arranged on the holding base 43 and has a holding piece 48a at the end and has a shaft which can move forward and backward freely in the horizontal direction; and the holding piece 48b is located on the lower surface side of the holding base 43, is arranged at a position facing the clamping piece 48a, and constitutes a clamping unit 48 together with the clamping piece 48a.

The sheet holding plate 46 is configured to be hollow inside, and a plurality of microholes not shown are provided on the entire lower surface, and is configured so that the sheet can be aligned inside the shaft that connects the second air cylinder 44 and the sheet holding plate 46 . Suction is carried out inside the sheet holding plate 46, and a negative pressure can be generated on the lower surface of the sheet holding plate by means of the micropores.

The holding base 43 is configured to be able to move up and down together with the shaft 42, which is driven by the first air cylinder 41 so as to be capable of advancing and retreating. Furthermore, as shown by the arrow in FIG. The base 43 can rotate in the horizontal direction around the shaft 42 . In addition, by rotating the holding base 43 in the clockwise direction from the position shown in FIG. 2(a) on the guide rails 31, 31 toward the position shown in FIG. 46 moves to directly above the waste container 7 installed in the vicinity of the stationary base 2 .

As shown in FIG. 3 , the bending roller moving unit 5 is composed of a support frame 51 in a door-shaped shape, and the support frame 51 has: column parts 52, 52 that follow the guide rails 31, 31 on the support base 2 Arranged side by side at intervals; a support part 53, which connects the upper ends of the column parts 52, 52; The guide hole 54 of the part 53 moves. This bending roller 55 can rotate around the axial center of the longitudinal direction, is at least longer than the diameter of the protective tape 11 that is pasted on the semiconductor wafer 10 and constitutes the sheet of the present invention, and is coated with fluororesin on its front surface so that The adhesive surface of the peeled protective tape will not adhere.

As shown in FIG. 4 , the peeling starting point generating unit 6 includes: a fourth air cylinder 61; a shaft 62 extending from the fourth air cylinder 61 and capable of finely adjusting the position in the height direction in a freely advancing and retreating manner; member 63 ; and a front end member 64 provided at the front end portion of the arm member 63 and having a front needle member 65 and an air nozzle 66 . With this configuration, the tip member 64 is configured to be movable up and down, and is configured to be able to position the tip of the needle member at the height position of the protective band on the plate member by adjusting its height position. Furthermore, the air nozzle 66 is configured to supply air thereto via the fourth air cylinder 61 and the shaft 62 and to discharge air as necessary.

As described in FIG. 1 , the waste container 7 is configured to be arranged near the sheet holding unit 4 of the stationary base 2, and is formed in a cylindrical shape with an open top, and is formed into a protective cover that is cut into a substantially circular shape and used. The tape 11 is larger, and the protective tape 11 peeled off by the peeling device of the present invention can be stacked in the container.

The peeling device 1 in the illustrated embodiment is configured as described above, and its operation will be described with reference to FIGS. 5 to 17 . In addition, FIGS. 5 to 15 are side views of main parts of the peeling device 1 of FIG. 1 , and the stationary base 2 , support frame 51 , first air cylinder 41 , and fourth air cylinder 61 are appropriately omitted in order to explain the operation easily. , motor 35 and the like are structures that are not directly related to the description of the action.

In this peeling device 1, when starting the peeling process of peeling the protective tape 11 stuck on the semiconductor wafer 10, first, as shown in FIG. 31 is on standby at the standby position (right side in the figure), and the sheet holding plate 46 is lifted to the uppermost position by the second air cylinder 44 . Furthermore, the bending roller 55 is positioned on the standby position side of the moving base 32 relative to the air nozzle 66 .

As shown in FIGS. 5 and 6 , first, the semiconductor wafer 10 with the protective tape 11 stuck on the front surface is placed on the adsorption chuck 37 of the stage main body 36 of the movable base 32 . At this time, the space on the back side of the suction chuck 37 is connected to a suction unit not shown to generate a negative pressure on the suction chuck 37, and the semiconductor wafer 10 is sucked and fixed on the suction chuck 37. 37 is made of a porous ceramic material, and is formed to be able to ventilate between the front and the back.

After the semiconductor wafer 10 is fixed on the suction chuck 37, the pulse motor 35 is driven to rotate the ball screw shaft 33, thereby moving the moving base 32 from the standby position in FIG. Below the holding unit 4 and the peeling origin generating unit 6 . At this time, the slightly outer portion of the outer peripheral end of the protective tape 11 attached to the semiconductor wafer 10 is positioned directly below the tip of the tip needle member 65 of the peeling starting point generating unit 6 (see FIG. 7 ).

(1st peeling process)

After the slightly outer portion of the outer peripheral end of the semiconductor wafer 10 is positioned directly below the tip needle-shaped member 65 of the peeling starting point generating unit 6, the fourth air cylinder 61 is operated to lower the tip of the tip needle-shaped member 65 to A position close to the outer peripheral end of the protective tape 11 of the semiconductor wafer 10 (see FIG. 8 ).

The height of the front end portion of this front end needle-shaped member 65 is finely adjusted according to the front height of this protective tape 11, so that the front end of the front end needle-shaped member 65 is close to the outer peripheral portion of the protective tape 11 of the semiconductor wafer 10. The mobile base is moved slightly to the right in the drawing in the state of the left side, whereby the front end of the front end needle member 65 abuts against the outer peripheral portion of the protective tape 11 (see FIG. 9 ). In addition, as shown in FIG. 9 , the front end portion may be abutted from the outer side of the protective tape 11 in the circumferential direction, or may be abutted against the front end portion from above the outer peripheral portion of the protective tape 11 .

And, after the front end portion abuts against the outer peripheral portion of the protective belt 11, the fourth air cylinder 61 is operated, the front end needle member 65 is slightly raised and the mobile base is further moved to the right, thereby , a part of the outer peripheral portion of the protective tape 11 was well peeled off.

(Peel origin part generation process)

After the part of the protective tape 11 is peeled off, as shown in FIG. 10, the front end portion 64 is raised, and high-pressure air is sprayed from the air nozzle 66, whereby the outer peripheral portion of the protective tape 11 is lifted from the front end needle-shaped member. 65 is detached, and the peeling area including the part that has been peeled off in the outer peripheral portion of the protective tape 11 is expanded, and the peeling starting point 12 suitable for being clamped by the clamping unit 48 described later is generated. In addition, the height of the holding base 43 in the peeling starting point generation process is adjusted so that when the peeling starting point 12 is peeled off by the high-pressure air from the air nozzle 66, the peeling starting point 12 is placed on the holding base. Between the clamping pieces 48a, 48b of the clamping unit 48 on the seat 43. In addition, when the high-pressure air is sprayed from the air nozzle 66 to expand the peeling area, the tip needle-like member 64 used in the first peeling step described above may be further brought into abutment. In this way, the peeling starting point is favorably produced.

(final peeling process)

When the outer peripheral end of the protective belt 11 is lifted by the high-pressure air from the air nozzle 66, the movement of the moving base 32 toward the standby position is temporarily stopped, and the clamping member 48a is moved to the clamping position by the action of the third air cylinder 47. On the holding member 48b side, the outer peripheral end portion of the peeled protective tape 11 is held by the holding unit 48 (see FIG. 11 ). Then, the first air cylinder 41 is operated to move the entire sheet holding unit 4 upward to such an extent that the bending rollers 55 can enter below the nip unit 48 .

While moving the sheet holding unit 4 upward and moving the moving base 32 in the standby direction, the bending roller 55 is moved to the sheet along the guide hole 54 of the support portion 53 of the door-shaped support frame 51 . material holding unit 4 side (refer to Fig. 12). In addition, the bending roller 55 is coated with a fluororesin so that it can be wound in the longitudinal direction in order to advance the peeling while being in contact with the adhesive surface side of the protective tape 11 with respect to the semiconductor wafer 10 . The center of the shaft rotates, and the adhesive surface of the contacting protective tape 11 will not adhere to it.

In the present embodiment, the protective tape 11 on the semiconductor wafer 10 is bent 180 degrees toward the peeling direction (left in the figure) (see FIG. 13 ), but the bending angle does not necessarily have to be 180 degrees. However, the back surface of the semiconductor wafer 10 is ground and formed into an extremely thin plate shape. If the bending angle is small, there is a possibility that the semiconductor wafer 10 may be cracked or damaged when the protective tape 11 is peeled off. It may be preferable to bend at an angle of 180 degrees or close to 180 degrees.

When the bending roller 55 moves to the other end on the left side in the figure on the lower surface of the sheet holding plate 46 , the protective tape 11 is completely peeled off from the semiconductor wafer 10 (see FIG. 14 ). In this way, the final peeling process is completed.

As shown in FIG. 15, when the peeled protective tape 11 is spread on the lower surface of the sheet holding plate 46, the sheet holding plate 46 formed hollow and provided with micropores on the lower surface is formed by a suction unit not shown. The inside of the strip is sucked, and the stripped protective tape 11 is sucked and held. And, the mobile base 32 and the bending roller 55 move to the standby position positioned when the peeling process starts, and the clamping unit 48a is separated from the other clamping unit 48b by the action of the third air cylinder 47 to release the tension of the protective tape 11. Peripheral end.

Next, a discarding step of discarding the peeled protective tape 11 in the discarding container 7 following the peeling step will be described with reference to FIGS. 2 , 16 , and 17 .

As described above, the protective tape 11 peeled off from the semiconductor wafer 10 is sucked and held while the sheet holding plate 46 is positioned above the guide rails 31 , 31 of the stationary base 2 .

From this state, while maintaining the state in which the protective tape 11 is sucked and held on the sheet holding plate 46, the shaft 42 of the first air cylinder 41 is rotated clockwise around the top view, and the sheet holding plate 46 is positioned on the waste container 7. , where the waste container 7 is disposed near the stationary base 2 (see FIG. 2( b ), FIG. 16 ). In addition, FIGS. 16 and 17 are side views viewed from the side of the stationary base 2 where the waste container is disposed. For convenience of explanation, only the sheet holding unit 4 and the waste container 7 are shown, and the waste container 7 is a cross-sectional view. .

After positioning the sheet holding plate 46 directly above the waste container 7, the second air cylinder 44 is operated to lower the sheet holding plate 46 into the waste container 7 (see FIG. 17 ). The lower end position during this descent may be appropriately changed according to the stacking level of the discarded protective tape 11 using a level sensor (not shown) provided in the discard container 7, or may be counted by counting the number of discarded sheets. The number of sheets out makes it change.

After the sheet holding plate 46 is lowered into the waste container, the suction from the pores on the lower surface of the sheet holding plate 46 is stopped at the lowermost end, and the protective tape 11 is dropped. At this time, detachment of the protective tape 11 can be performed more reliably by blowing air out from the fine holes on the lower surface of the sheet holding plate 46 . In addition, when the level sensor of the waste container 7 detects that the peeled protective tape 11 stacked in the waste container is stored in a predetermined amount in the waste container, or when the counted number of sheets reaches a predetermined amount Next, measures such as generating an alarm sound to notify the operator of the peeling apparatus, lighting an alarm lamp, etc. are performed to prompt the discarding of the protective tape 11 stored in the discarding container 7 .

The stripping device based on the present invention is constituted as described above, can be widely used in various fields where stripping of the protective tape is required, and is easy to use. This peeling device is configured in a complex manner, and since the peeled protective tapes can be efficiently discarded in stacks in a waste container, the capacity of the waste container can be fully utilized.

In addition, although the plate-shaped member is used as a semiconductor wafer in the above-mentioned embodiment of the present invention, it is not limited thereto. In the case of inferiority, the invention of the present application can be applied as long as a plate-like member with a sheet-like member attached to the front surface is used and the sheet-like member is peeled off.

Claims (6)

1. A peeling method, peeling off the sheet material pasted on the plate-shaped member from the plate-shaped member, wherein, the peeling method at least includes the following steps: In the first peeling step, the front end portion of the front needle-shaped member is brought into contact with at least a part of the outer periphery of the sheet of the plate-shaped member held by the holding table, and the part is peeled off from the plate-shaped member; A peeling starting point generating step of blowing air between the part of the peeled sheet and the plate member to generate a peeling starting point formed by an enlarged peeling region including the part; and In the final peeling step, starting from the peeling starting point, the unpeeled remaining portion of the sheet is separated from the plate-shaped member and peeled. 2. The stripping method according to claim 1, wherein, This peeling method has a peeling starting point clamping step, after the peeling starting point generation step, the generated peeling starting point is clamped, and the final peeling step is performed through the peeling starting point clamping step. 3. The peeling method according to claim 1 or 2, wherein, In this peeling starting point generating step, the tip of the tip needle member is further abutted to expand the peeling area. 4. A peeling device that peels off a sheet adhered to a plate-shaped member from a plate-shaped member, wherein the peeling device has: A holding table having a holding surface for holding the plate-like member pasted with the sheet; a peeling starting point generation unit that abuts the front end portion of the needle-shaped member against at least a part of the outer periphery of the sheet of the plate-shaped member held by the holding table to peel the part from the plate-shaped member, and the part has been Air is blown between the peeled sheet and the plate member to generate a peeling starting point formed by an enlarged peeling region including the part; a clamping unit, which clamps the peeled peeling starting point; a separating unit that separates the clamping unit clamping the peeling starting point upward relative to the holding table; The bending roller acts on the adhesive surface side of the sheet peeled from the plate-shaped member under the clamping unit separated upward, and the sheet is peeled from the plate-shaped member while bending in the direction of peeling; and a moving unit that relatively moves at least one of the bending roller and the holding table in a peeling direction parallel to the plate member so that the sheet is peeled from the plate member, The sheet is completely peeled off from the plate-like member by the movement of the moving unit. 5. The peeling device according to claim 4, wherein, The peeling device includes a sheet holding unit that suction-holds the sheet peeled from the plate-like member. 6. The peeling device according to claim 4 or 5, wherein, The peeling device has a waste container, and the waste container stores the peeled sheet, and the sheet holding unit moves to directly above the waste container after sucking and holding the sheet, and the waste container The suction of the sheet held by suction is released immediately above the suction and held, and the sheet is stored in the waste container.