CN105870159B - A kind of organic LED display panel, display device and production method - Google Patents

Abstract

The present invention provides an organic light emitting diode display panel, a display device and a manufacturing method. The organic light emitting diode display panel includes: an organic light emitting diode display substrate and an encapsulation layer for encapsulating the organic light emitting diode display substrate. The organic light emitting diode The display substrate includes an anode, an organic light-emitting layer and a cathode, and the encapsulation layer can provide a channel for conducting the cathode and an EVSS power supply port on an external printed circuit board. In the subsequent assembly process, the EVSS power supply port on the printed circuit board can be electrically connected to the cathode through the channel provided by the packaging layer to transmit the EVSS current. COF no longer needs to transmit EVSS current, and there is no need to set EVSS transmission line on COF, only EVDD transmission line is needed, which can reduce the size of COF and make it suitable for narrow bezel products.

Description

Organic light emitting diode display panel, display device and manufacturing method

technical field

The invention relates to the field of display technology, in particular to an organic light emitting diode display panel, a display device and a manufacturing method.

Background technique

Please refer to FIG. 1. FIG. 1 is a schematic structural view of an organic light-emitting diode (OLED) display device in the prior art. The OLED display device includes: an OLED display panel, a chip-on-film (COF) 31 and a printed circuit board (PCB) 32 , The OLED display panel includes: a base substrate 11 , a thin film transistor (TFT) layer 12 , an anode 13 , an organic light emitting layer 14 , a cathode 15 and an encapsulation layer 16 .

The EVDD (power supply) and EVSS (ground) power supply of the OLED display panel are both conducted to the COF31 through the PCB32, and then conducted to the OLED display panel by the COF31. That is to say, a power supply transmission line for EVDD and EVSS needs to be set on the COF. The above-mentioned power supply transmission line occupies a large amount of space on the COF, which undoubtedly increases the width of the COF, making it difficult to apply to products with narrow borders.

Contents of the invention

In view of this, the present invention provides an organic light-emitting diode display panel, a display device and a manufacturing method, which are used to solve the problem that EVDD and EVSS power supply transmission lines need to be installed on the COF of the existing OLED display device at the same time, and there are many power supply transmission lines, resulting in COF It is difficult to apply to narrow bezel products because of its large size.

In order to solve the above technical problems, the present invention provides an organic light emitting diode display panel, comprising an organic light emitting diode display substrate and an encapsulation layer for encapsulating the organic light emitting diode display substrate, the organic light emitting diode display substrate includes an anode, an organic light emitting diode Layer and cathode, the encapsulation layer can provide a channel to connect the cathode to the EVSS power supply port on the external printed circuit board.

Preferably, the encapsulation layer includes: an encapsulation adhesive layer and a metal encapsulation layer, one side of the metal encapsulation layer is electrically connected to the cathode, and the other side can be electrically connected to the EVSS power supply port on the printed circuit board.

Preferably, the organic light emitting diode display panel further includes: a first conductive pattern, the first conductive pattern penetrates the encapsulation layer, one side is in contact with the cathode, and the other side is in contact with the metal encapsulation layer, The metal encapsulation layer and the cathode are electrically connected through the first conductive pattern.

Preferably, there are at least two first conductive patterns.

Preferably, the metal encapsulation layer is in direct contact with the cathode, and the encapsulation adhesive layer is only arranged around the display area of the OLED display substrate.

Preferably, the metal packaging layer is a metal plate.

Preferably, the encapsulation layer is a thin film encapsulation layer, and the thin film encapsulation layer includes at least one inorganic thin film layer and at least one organic thin film layer alternately stacked, and the thin film encapsulation layer is provided with a the via hole; the display panel also includes: a second conductive pattern, part of the second conductive pattern is filled in the via hole, one side is electrically connected to the cathode through the via hole, and the other side can Electrically connect with the EVSS power supply port on the external printed circuit board.

Preferably, the encapsulation layer includes an encapsulation adhesive layer and a cover glass, and the cover glass is provided with a via hole penetrating the glass encapsulation layer; the display panel further includes: a third conductive pattern, the third Part of the conductive pattern is filled in the via hole, one side is electrically connected to the cathode through the via hole, and the other side can be electrically connected to the EVSS power supply port on the external printed circuit board.

The present invention also provides an organic light emitting diode display device, including the above-mentioned organic light emitting diode display panel, and the display device further includes: a printed circuit board, and the EVSS power supply port on the printed circuit board communicates with the channel provided by the encapsulation layer. The cathode on the OLED display panel is electrically connected.

Preferably, the organic light emitting diode display device further includes: a chip-on-chip COF, one end of the COF is connected to the EVDD power supply port on the printed circuit board, and the other end is connected to the non-display area of the organic light emitting diode display panel wiring connections.

The present invention also provides a method for manufacturing an organic light emitting diode display panel, comprising:

forming an organic light emitting diode display substrate, the organic light emitting diode display substrate including an anode, an organic light emitting layer and a cathode;

An encapsulation layer for encapsulating the organic light emitting diode display substrate is formed, wherein the encapsulation layer can provide a channel for conducting the cathode and the EVSS power supply port on the external printed circuit board.

Preferably, the encapsulation layer includes an encapsulation adhesive layer and a metal encapsulation layer;

Before the step of forming an encapsulation layer for encapsulating the organic light emitting diode display substrate, it may further include: forming a first conductive pattern on the cathode;

The step of forming an encapsulation layer for encapsulating the organic light emitting diode display substrate includes:

Coating an encapsulation adhesive layer on the cathode formed with the first conductive pattern;

A metal plate is used as a metal encapsulation layer to be pressed on the encapsulation adhesive layer by a lamination process, and after lamination, the metal plate is in contact with the conductive pattern.

Preferably, the encapsulation layer includes an encapsulation adhesive layer and a metal encapsulation layer; the step of forming the encapsulation layer for encapsulating the OLED display substrate includes:

Coating an encapsulation adhesive layer around the display area of the organic light emitting diode display substrate;

A metal plate is used as the metal encapsulation layer and laminated on the encapsulation adhesive layer, and the metal plate is directly in contact with the cathode after lamination.

The beneficial effects of above-mentioned technical scheme of the present invention are as follows:

Since the packaging layer can provide a channel for conducting the cathode and the EVSS power supply port on the external printed circuit board, in the subsequent assembly process, the EVSS power supply port on the printed circuit board can be electrically connected to the cathode through the above-mentioned conduction channel to transmit EVSS current. That is to say, COF no longer needs to transmit EVSS current, so it is no longer necessary to set EVSS transmission line on COF, and only EVDD transmission line is required, so that the size of COF can be reduced and it can be applied to narrow bezel products.

On the other hand, since only EVDD is transmitted on COF, the power supply of EVDD is also improved, reducing the risk of COF burnout.

On the other hand, there is no need to design the shorting bar (short-circuit node) of EVSS inside the OLED display panel, and the cross-short circuit and display broken line caused by the original shorting bar will no longer appear, which improves the performance of the OLED display panel. yield.

Description of drawings

FIG. 1 is a schematic structural view of an organic light emitting diode display device in the prior art;

2 is a schematic structural diagram of an OLED display panel according to Embodiment 1 of the present invention;

3 is a schematic structural diagram of an OLED display panel according to Embodiment 2 of the present invention;

4 is a schematic structural diagram of an organic light emitting diode display panel according to Embodiment 3 of the present invention;

5 is a schematic structural diagram of an OLED display panel according to Embodiment 4 of the present invention;

6 is a schematic structural view of an organic light emitting diode display device according to Embodiment 5 of the present invention;

FIG. 7 is a schematic structural diagram of an organic light emitting diode display device according to Embodiment 6 of the present invention.

Detailed ways

In order to solve the problem that EVDD and EVSS power supply transmission lines need to be installed on the COF of the existing OLED display device at the same time, and there are many power supply transmission lines, resulting in a large size of the COF, which is difficult to apply to narrow frame products, the embodiment of the present invention provides an organic light emitting diode. A display panel, including an organic light emitting diode display substrate and an encapsulation layer for encapsulating the organic light emitting diode display substrate, the organic light emitting diode display substrate includes an anode, an organic light emitting layer and a cathode, wherein the encapsulation layer can provide conduction The cathode is connected to the EVSS supply port on the external PCB.

Since the packaging layer can provide a channel for conducting the cathode and the EVSS power supply port on the external printed circuit board, in the subsequent assembly process, the EVSS power supply port on the printed circuit board can be electrically connected to the cathode through the above-mentioned conduction channel to transmit EVSS current. That is to say, COF no longer needs to transmit EVSS current, so it is no longer necessary to set EVSS transmission line on COF, and only EVDD transmission line is required, so that the size of COF can be reduced and it can be applied to narrow bezel products.

On the other hand, since only EVDD is transmitted on COF, the power supply of EVDD is also improved, reducing the risk of COF burnout.

On the other hand, there is no need to design the shorting bar (short-circuit node) of EVSS inside the OLED display panel, and the cross-short circuit and display broken line caused by the original shorting bar will no longer appear, which improves the performance of the OLED display panel. yield.

The encapsulation layer in the OLED display panel can be roughly divided into two types: glass encapsulation and film encapsulation. Among them, the glass encapsulation is to combine the cover glass with the organic light-emitting diode display substrate through the encapsulation glue. Thin-film packaging is a new type of packaging. The cover plate is no longer made of glass material, but is replaced by a thin film. The thin film may be a metal material, or other thin film materials (for example, alternately stacked inorganic thin film layers and organic thin film layers). Thin-film packaging has the advantages of being thin and easy to bend.

Embodiments of the present invention will be described in detail below for different types of encapsulation layers.

The following is an embodiment using metal thin film packaging.

The encapsulation layer includes: an encapsulation adhesive layer and a metal encapsulation layer, one side of the metal encapsulation layer is electrically connected to the cathode, and the other side can be electrically connected to the EVSS power supply port on the printed circuit board.

In the embodiment of the present invention, the metal encapsulation layer is a channel connecting the cathode and the EVSS power supply port on the external printed circuit board.

Since the metal packaging layer is electrically connected to the cathode, in the subsequent assembly process of the organic light emitting diode display panel, the metal packaging layer can be electrically connected to the EVSS power supply port on the PCB to conduct the cathode and the EVSS power supply port, so that the EVSS current can be Conduction to the cathode through the metal encapsulation layer. That is to say, it is no longer necessary to transmit EVSS current through COF, and there is no need to set EVSS transmission line on COF, only EVDD transmission line is required, so that the size of COF can be reduced and it can be applied to narrow bezel products.

There are many ways to connect the metal packaging layer and the cathode, which will be described with examples below.

Please refer to FIG. 2. FIG. 2 is a schematic structural diagram of an organic light emitting diode display panel according to Embodiment 1 of the present invention. The organic light emitting diode display panel includes: an organic light emitting diode display substrate and a package for packaging the organic light emitting diode display substrate An adhesive layer 27 and a metal encapsulation layer 28 , the organic light emitting diode display substrate includes a base substrate 21 , a TFT layer 22 , an anode 23 , an organic light emitting layer 24 and a cathode 25 .

The organic light emitting diode display panel further includes: a first conductive pattern 26, the first conductive pattern 26 penetrates the encapsulation layer 27, one side is in contact with the cathode 25, and the other side is in contact with the metal encapsulation layer 28 Contact, that is, the metal encapsulation layer 28 and the cathode 25 are electrically connected through the first conductive pattern 26 .

In the embodiment of the present invention, the cathode 25 is electrically connected to the metal encapsulation layer 28 through the first conductive pattern 26, and the implementation method is simple.

In order to reduce the on-resistance, preferably, the number of the first conductive patterns 26 is at least two. Of course, the number of the first conductive pattern 26 can also be one, as long as the width of the first conductive pattern 26 is appropriately increased, the purpose of reducing the on-resistance can also be achieved.

The first conductive pattern 26 can be arranged in the non-display area of the OLED display substrate, or in the display area of the OLED display substrate.

Please refer to FIG. 3. FIG. 3 is a schematic structural diagram of an OLED display panel according to Embodiment 2 of the present invention. The OLED display panel includes: an OLED display substrate and a package for packaging the OLED display substrate. An adhesive layer 27 and a metal encapsulation layer 28 , the organic light emitting diode display substrate includes a base substrate 21 , a TFT layer 22 , an anode 23 , an organic light emitting layer 24 and a cathode 25 .

Wherein, the metal encapsulation layer 28 is in direct contact with the cathode 25, and the encapsulation adhesive layer 27 is no longer provided between the metal encapsulation layer 28 and the cathode 25, and the encapsulation adhesive layer 27 only surrounds the display of the OLED display substrate. regional settings.

In the embodiment of the present invention, the metal encapsulation layer 28 is disposed on the cathode 25 and is in direct contact with the cathode 25, so there is no need to make a conductive pattern for conducting the metal encapsulation layer 28 and the cathode 25, which reduces the manufacturing cost.

In the above embodiment, preferably, the metal encapsulation layer 28 is a metal plate, and the metal plate can be directly pressed onto the OLED display substrate coated with the encapsulation adhesive layer during encapsulation.

When the metal encapsulation layer 28 is a metal plate, in the embodiment where the metal encapsulation layer 28 is in direct contact with the cathode 25, the flatness of the surface of the metal plate is highly required, so that the metal plate and the cathode can be in close contact to achieve large-area conduction the goal of.

Of course, in some other embodiments of the present invention, the metal encapsulation layer 28 may be a metal thin film formed by deposition or sputtering.

The following are examples of encapsulation with other thin films.

Please refer to FIG. 4. FIG. 4 is a schematic structural diagram of an OLED display panel according to Embodiment 3 of the present invention. The OLED display panel includes: an OLED display substrate and a thin film for encapsulating the OLED display substrate. Encapsulation layer 29, the thin film encapsulation layer includes at least one inorganic thin film layer and at least one organic thin film layer arranged alternately. In the embodiment shown in FIG. 4, the thin film encapsulation layer includes three layers. On the top, there are the first inorganic thin film layer, the organic thin film layer and the second inorganic thin film layer in sequence. The organic light emitting diode display substrate includes a base substrate 21 , a TFT layer 22 , an anode 23 , an organic light emitting layer 24 and a cathode 25 .

The thin film encapsulation layer 29 is provided with a via hole 291 penetrating the thin film encapsulation layer; the display panel further includes: a second conductive pattern 210, and a part of the second conductive pattern 210 is filled in the via hole 291 , one side is electrically connected to the cathode 25 through the via hole 291 , and the other side can be electrically connected to the EVSS power supply port on the external printed circuit board.

The number of the via hole 291 can be one or more, so as to reduce the on-resistance.

In the embodiment of the present invention, the via hole on the thin film encapsulation layer is a channel for connecting the cathode and the EVSS power supply port on the external printed circuit board.

Since the second conductive pattern 210 is electrically connected to the cathode 25, in the subsequent assembly process of the organic light emitting diode display panel, the second conductive pattern 210 can be electrically connected to the EVSS power supply port on the PCB, so as to conduct the cathode and EVSS power supply port, so that the EVSS current can be conducted to the cathode through the second conductive pattern 210 . That is to say, it is no longer necessary to transmit EVSS current through COF, and there is no need to set EVSS transmission line on COF, only EVDD transmission line is required, so that the size of COF can be reduced and it can be applied to narrow bezel products.

The following are examples using other glass packages.

Please refer to FIG. 5. FIG. 5 is a schematic structural diagram of an OLED display panel according to Embodiment 4 of the present invention. The OLED display panel includes: an OLED display substrate and a package for packaging the OLED display substrate. A glue layer 27 and a cover glass 211 , the organic light emitting diode display substrate includes a base substrate 21 , a TFT layer 22 , an anode 23 , an organic light emitting layer 24 and a cathode 25 .

The cover glass 211 is provided with a via hole 2111 penetrating through the encapsulation layer; the display panel further includes: a third conductive pattern 212, a part of the third conductive pattern 212 is filled in the via hole 2111, One side is electrically connected to the cathode 25 through the via hole 2111 , and the other side can be electrically connected to the EVSS power supply port on the external printed circuit board.

In the embodiment of the present invention, the via hole 2111 on the cover glass 211 provides a channel for connecting the cathode 25 and the EVSS power supply port on the external printed circuit board.

Since the third conductive pattern 212 is electrically connected to the cathode 25, in the subsequent assembly process of the organic light emitting diode display panel, the third conductive pattern 212 can be electrically connected to the EVSS power supply port on the PCB, so as to conduct the cathode and EVSS power supply port, so that the EVSS current can be conducted to the cathode through the third conductive pattern 212 . That is to say, it is no longer necessary to transmit EVSS current through COF, and there is no need to set EVSS transmission line on COF, only EVDD transmission line is required, so that the size of COF can be reduced and it can be applied to narrow bezel products.

The present invention also provides an organic light emitting diode display device, including the organic light emitting diode display panel described in any one of the above embodiments, and the display device further includes: a printed circuit board, and the EVSS power supply port on the printed circuit board passes through the The channel provided by the encapsulation layer is electrically connected to the cathode on the OLED display panel.

The organic light emitting diode display device further includes: a chip-on-chip COF, one end of the COF is connected to the EVDD power supply port on the printed circuit board, and the other end is connected to the wiring of the non-display area of the organic light emitting diode display panel. connect.

That is to say, the EVSS current can be transmitted to the cathode through the channel provided by the encapsulation layer, so that there is no need to install EVSS transmission lines on COF, only EVDD transmission lines are required, which can reduce the size of COF and enable it to be applied to products with narrow borders .

Please refer to FIG. 6. FIG. 6 is a schematic structural diagram of an organic light emitting diode display device according to Embodiment 5 of the present invention. The organic light emitting diode display device includes: an organic light emitting diode display panel, a PCB42, and a COF41, wherein the organic light emitting diode display The panel includes: an organic light emitting diode display substrate, an encapsulation glue layer 27 and a metal encapsulation layer 28 for encapsulating the organic light emitting diode display substrate. The organic light emitting diode display substrate includes a base substrate 21 , a TFT layer 22 , an anode 23 , an organic light emitting layer 24 and a cathode 25 . The organic light emitting diode display panel further includes: a first conductive pattern 26, the first conductive pattern 26 penetrates the encapsulation layer 27, one side is in contact with the cathode 25, and the other side is in contact with the metal encapsulation layer 28 Contact, that is, the metal encapsulation layer 28 and the cathode 25 are electrically connected through the first conductive pattern 26 . In addition, the metal packaging layer 28 is connected to the EVSS power supply port on the PCB through conductive glue, so that the cathode 25 is connected to the EVSS power supply port on the PCB.

Please refer to FIG. 7. FIG. 7 is a schematic structural diagram of an organic light emitting diode display device according to Embodiment 6 of the present invention. The organic light emitting diode display device includes: an organic light emitting diode display panel, a PCB42, and a COF41, wherein the organic light emitting diode display The panel includes: an organic light emitting diode display substrate and an encapsulation layer 27 and a metal encapsulation layer 28 for encapsulating the organic light emitting diode display substrate. The organic light emitting diode display substrate includes a base substrate 21, a TFT layer 22, an anode 23, organic light emitting layer 24 and cathode 25 . Wherein, the metal encapsulation layer 28 is in direct contact with the cathode 25, and the encapsulation adhesive layer 27 is no longer provided between the metal encapsulation layer 28 and the cathode 25, and the encapsulation adhesive layer 27 only surrounds the display of the OLED display substrate. regional settings. In addition, the metal packaging layer 28 is also connected to the EVSS power supply port on the PCB through conductive glue, so that the cathode 25 is connected to the EVSS power supply port on the PCB.

In the above embodiment, the metal packaging layer is connected to the EVSS power supply port, and the EVSS is connected to GND (ground). Therefore, the metal packaging layer is electrically connected to GND, and the metal packaging layer is electrically GND, so the metal packaging layer has the effect of electromagnetic shielding. Improved EMI (electromagnetic shielding) characteristics of OLED display panels. The electrical property of the metal packaging layer is GND. When the organic light emitting diode display panel encounters static electricity, the static electricity can be transmitted to GND through the metal packaging layer in time, which improves the ESD (electrostatic discharge) characteristics of the organic light emitting diode display panel.

In the above embodiments, when designing the printed circuit board, a large piece of copper leakage is exposed on the bonding (connection) surface of the PCB, and the exposed copper is electrically a net property of the EVSS. In the assembly process after module bonding, the exposed PAD of the PCB is glued to the conductive adhesive, and then the conductive adhesive is adhered to the metal packaging layer to achieve the purpose of electrical connection between the metal packaging layer and the EVSS power supply port on the PCB. Since there are no electronic components on the bonding surface of the PCB, the area of copper leakage can be increased, and the area of conductive adhesive can be increased to improve the on-resistance.

The present invention also provides a method for manufacturing an organic light emitting diode display panel, comprising:

Step S101: forming an organic light emitting diode display substrate, the organic light emitting diode display substrate including an anode, an organic light emitting layer and a cathode;

Step S102: forming an encapsulation layer for encapsulating the organic light emitting diode display substrate, wherein the encapsulation layer can provide a channel for conducting the cathode and the EVSS power supply port on the external printed circuit board.

In an embodiment of the present invention, the encapsulation layer includes an encapsulation adhesive layer and a metal encapsulation layer;

Before the step of forming an encapsulation layer for encapsulating the organic light emitting diode display substrate, it may further include: forming a first conductive pattern on the cathode;

The step of forming an encapsulation layer for encapsulating the organic light emitting diode display substrate includes:

Coating an encapsulation adhesive layer on the cathode formed with the first conductive pattern;

A metal plate is used as a metal encapsulation layer to be pressed on the encapsulation adhesive layer by a lamination process, and after lamination, the metal plate is in contact with the conductive pattern.

In another embodiment of the present invention, the encapsulation layer includes an encapsulation adhesive layer and a metal encapsulation layer; the step of forming the encapsulation layer for encapsulating the OLED display substrate includes:

Coating an encapsulation adhesive layer around the display area of the organic light emitting diode display substrate;

A metal plate is used as the metal encapsulation layer and laminated on the encapsulation adhesive layer, and the metal plate is directly in contact with the cathode after lamination.

The above description is a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications can also be made. It should be regarded as the protection scope of the present invention.

Claims (4)

1. a kind of organic LED display device, including：Display panel, printed circuit board and chip on film, the printing Ground supply port and power supply power supply port are provided on circuit board；

The display panel includes display base plate and encapsulated layer；The display base plate includes anode, organic luminous layer and cathode, It is characterized in that,

The anode is connect by the chip on film with the power supply power supply port, and the cathode passes through the encapsulated layer and institute State ground supply port connection；The encapsulated layer is capable of providing the channel of conducting cathode and described ground supply port；The flip is thin Film is capable of providing the channel of conducting anode and the power supply power supply port；

The cathode is connect by the encapsulated layer with described ground supply port, specifically：The encapsulated layer includes：Encapsulate glue-line It is electrically connected with the cathode with the side of Metal Packaging layer, the Metal Packaging layer, the other side can be with described ground supply port Electrical connection, the Metal Packaging layer are in direct contact with the cathode, and the encapsulation glue-line is only around the Organic Light Emitting Diode The display area of display base plate is arranged；

Or

The cathode is connect by the encapsulated layer with described ground supply port, specifically：The encapsulated layer is thin-film encapsulation layer, The thin-film encapsulation layer includes at least one layer of inorganic thin film layer and at least one layer of organic thin film layer that alternating is superposed, described thin The via for penetrating through the thin-film encapsulation layer is offered on film encapsulated layer；The display panel further includes：Second conductive pattern, it is described Second conductive pattern is partially filled in the via, and side is electrically connected by the via with the cathode, other side energy It is enough to be electrically connected with described ground supply port；

Or

The cathode is connect by the encapsulated layer with described ground supply port, specifically：The encapsulated layer includes encapsulation glue-line And cover-plate glass, the via for penetrating through the cover-plate glass is offered on the cover-plate glass；The display panel further includes：Third Conductive pattern, the third conductive pattern are partially filled in the via, and side passes through the via and cathode electricity Connection, the other side can be electrically connected with described ground supply port.

2. organic LED display device according to claim 1, which is characterized in that the Metal Packaging layer is gold Belong to plate.

3. a kind of production method of organic LED display panel, which is characterized in that including：

Organic light-emitting diode display substrate is formed, the organic light-emitting diode display substrate includes anode, organic luminous layer And cathode；The anode is connect by chip on film with the power supply power supply port in external printed circuit board；

Form the encapsulated layer for encapsulating the organic light-emitting diode display substrate, wherein the cathode passes through the encapsulation Layer is connect with the ground supply port in the external printed circuit board；The encapsulated layer is capable of providing conducting cathode and the printing The channel of ground supply port on circuit board；

The encapsulated layer includes：Encapsulation glue-line and Metal Packaging layer, the side of the Metal Packaging layer are electrically connected with the cathode, The other side can be electrically connected with the ground supply port on the printed circuit board, and the Metal Packaging layer directly connects with the cathode It touches, the encapsulation glue-line is arranged only around the display area of the organic light-emitting diode display substrate；

Or

The encapsulated layer is thin-film encapsulation layer, and the thin-film encapsulation layer includes at least one layer of inorganic thin film layer being alternately superposed With at least one layer of organic thin film layer, the via for penetrating through the thin-film encapsulation layer is offered in the thin-film encapsulation layer；The display Panel further includes：Second conductive pattern, second conductive pattern are partially filled in the via, and side passes through the mistake Hole is electrically connected with the cathode, and the other side can be electrically connected with the ground supply port in external printed circuit board；

Or

The encapsulated layer includes encapsulation glue-line and cover-plate glass, and the mistake for penetrating through the cover-plate glass is offered on the cover-plate glass Hole；The display panel further includes：Third conductive pattern, the third conductive pattern are partially filled in the via, and one Side is electrically connected by the via with the cathode, and the other side can be electrically connected with the ground supply port in external printed circuit board It connects.

4. the production method of organic LED display panel according to claim 3, which is characterized in that the encapsulation Layer includes encapsulation glue-line and Metal Packaging layer；Encapsulated layer of the formation for encapsulating the organic light-emitting diode display substrate The step of include：

In the display area surrounding coating encapsulation glue-line of the organic light-emitting diode display substrate；

Be pressed together on the encapsulation glue-line as Metal Packaging layer using a metallic plate, after pressing the metallic plate directly with it is described Cathode contacts.