CN105163478A - Pressure-sensitive electromagnetic protection film - Google Patents

Abstract

The invention provides a pressure-sensitive electromagnetic protection film. According to the pressure-sensitive electromagnetic protection film, a surface of a base material is provided with a separation type layer, the surface of the separation type layer is provided with a blocking insulation layer, the surface of the blocking insulation layer is provided with at least one metal layer, the surface of the metal layer is provided with a pressure-sensitive conductive adhesive layer, and the surface of the pressure-sensitive conductive adhesive layer is provided with a protection film. The pressure-sensitive conductive adhesive layer has properties of excellent electromagnetic wave signal shielding reflection capability and simple processing technology, requires no extra laminators and oven equipment, requires no extra personnel and complex operation steps, can effectively reduce energy consumption and danger possibility in subsequent operation and can be widely applied to mobile phones, cameras, medical apparatuses and note computers which require electromagnetic protection.

Description

A pressure-sensitive electromagnetic protective film

technical field

The invention relates to the field of electromagnetic protective films for circuit boards, in particular to a pressure-sensitive electromagnetic protective film.

Background technique

As the concept of "light and thin, small three-dimensional volume, and anti-interference" of electronic products has penetrated into major electronics manufacturers and ordinary people, functional flexible circuit boards that are ultra-thin, bendable and foldable, and have high wiring assembly density have been widely used. An important indicator of its functional flexible circuit board is the anti-interference performance.

However, with the high frequency of internal components such as mobile phones, notebooks, tablet computers, and display screens, the anti-interference requirements of flexible circuit boards are urgent. Mounting electromagnetic protective films has better practicability, better operability, It is more cost-effective and can better meet the requirements of thinning, so it is more favored by major electronics manufacturers.

The existing electromagnetic protective film mainly has the following structures:

first structure

The Chinese patent with the application number 200680016573.7 discloses a shielding film, a shielding printed circuit board, a shielding flexible printed circuit board and corresponding manufacturing methods. The structure of this shielding film consists of a wear-resistant hard layer and a flexible soft layer to form an insulating layer , forming a metal layer on it, and then forming a thermally cured conductive adhesive layer on the metal layer. The shielding can achieve 50dB shielding effectiveness in a wide frequency range.

second structure

The Chinese patent application number 200680005088.X discloses an electromagnetic wave shielding film, a preparation method and an electromagnetic shielding method for an adherend. The structure of this shielding film is composed of an insulating layer and an isotropic conductive adhesive layer. The shielding film has only 40dB shielding effectiveness in the high frequency band.

third structure

The Chinese patent application number 201220297494.0 discloses a very thin shielding film with high shielding effectiveness, which is composed of an insulating layer, two or more metal layers of different materials and a conductive adhesive layer. The second reflection achieves a high shielding effectiveness of 60dB.

When the electromagnetic protective film (shielding film) of the above three structures is applied to a flexible circuit board, they are all assembled by heating and laminating post-curing process, that is, pre-curing at 180°C for 30s, and then laminating for 2 minutes under a pressure of 2Mpa. Afterwards, it was transferred to a 160°C oven for curing for 30 minutes.

The above heating lamination curing process has the following defects:

A. The operation is cumbersome, there are many steps required, and there are many equipment such as laminating machines and ovens, and many operators are required;

B. Serious energy consumption and high cost;

C. There are certain risks, such as high-temperature operation, high-temperature heating products produce toxic and harmful substances, etc.;

D. If the placement is wrong, the active groups of the heated and cured products have completely reacted and are not easy to clean. If the flexible circuit board layout is not cleaned, the flexible circuit board may be scrapped.

Contents of the invention

The technical problem to be solved by the present invention is to provide a pressure-sensitive electromagnetic protective film in view of the deficiencies in the prior art. The product of the present invention is not prone to defects such as delamination, foaming, and protrusions during the preparation process, and the product has high Excellent shielding effectiveness and grounding conductivity can play an effective anti-interference and protection role for electronic instruments. It is easy to use and understand, saving personnel and equipment. When a problem occurs, it is easy to peel off, which improves the use of electromagnetic protective film. .

Technical problem described in the present invention is solved by following technical scheme:

A pressure-sensitive electromagnetic protective film, in which a release layer, a barrier insulating layer, at least one metal layer, a pressure-sensitive conductive adhesive layer, and a protective film are sequentially arranged on the surface of a substrate, and the pressure-sensitive conductive adhesive layer is It is obtained by coating and curing a coating liquid composed of the following substances by weight percentage: 20%-70% of conductive metal powder, 25%-78% of pressure-sensitive adhesive resin, and 2%-5% of additives.

In the above pressure-sensitive electromagnetic protective film, the conductive metal powder is at least one of silver powder, copper powder, nickel powder, silver-coated copper powder, silver-coated nickel powder, carbon nanotubes, and silver-coated carbon nanotubes.

In the above-mentioned pressure-sensitive electromagnetic protective film, the pressure-sensitive adhesive resin is at least one of rubber-type pressure-sensitive adhesives, acrylic-type pressure-sensitive adhesives, silicone pressure-sensitive adhesives, and polyurethane-type pressure-sensitive adhesives.

In the above-mentioned pressure-sensitive electromagnetic protective film, the auxiliary agent is at least one of dispersant, antioxidant, catalyst, aging agent, antistatic agent, anti-settling agent, leveling agent and the like.

In the above pressure-sensitive electromagnetic protective film, the thickness of the pressure-sensitive conductive adhesive layer is 8-15 μm.

In the above pressure-sensitive electromagnetic protective film, the 180° peel force of the pressure-sensitive conductive adhesive layer is 1.5N/cm-4N/cm.

In the above-mentioned pressure-sensitive electromagnetic protection film, the barrier insulating layer is formed by coating and curing a coating solution composed of a high-temperature-resistant resin and carbon black filler, and the thickness of the barrier insulating layer is 4-6 μm.

In the above-mentioned pressure-sensitive electromagnetic protective film, the thickness of the metal layer is 0.05-0.5 μm.

In the above pressure-sensitive electromagnetic protective film, the release force of the release layer is 0.1N/cm-1N/cm.

Beneficial effect

Compared with the existing heating lamination curing process, the present invention sets a pressure-sensitive conductive adhesive layer in the product, and only needs to align the product with the position where the electromagnetic protective film needs to be attached, and apply a little pressure with finger pressure. It has the advantages of simple process operation, less demand for personnel and equipment, energy saving, obvious cost reduction, and low risk, and if there are errors in the placement of electromagnetic protective films or wrong positioning, the traditional cleaning method is to wipe with alcohol. , but after heating and lamination, the active groups of the product in the curing process react completely, and it adheres well to the flexible circuit board. In case of mounting errors or positioning errors, etc., you only need to peel off the product by hand, which ensures that the flexible circuit board is clean and usable.

In addition, at least one metal layer is set to cooperate with the pressure-sensitive conductive adhesive layer to meet the requirements for product grounding, and the insulating layer blocks the damage to electrical components caused by external water, air and heat; through the cooperation between the layers, the The product not only has high shielding effectiveness but also meets the needs of grounding and conduction, thus playing an anti-interference and protective role for electronic instrument components.

The conductive adhesive layer of the existing electromagnetic protective film is obtained by coating the coating liquid prepared by utilizing materials such as thermosetting resin, conductive metal powder, curing agent, and the conductive adhesive layer of the present invention adopts pressure-sensitive resin, conductive metal powder, The protective film prepared by coating the coating liquid prepared from additives and other materials is simple to use and easy to understand, saving manpower and equipment. In addition, pressure-sensitive adhesive materials generally have the disadvantage of poor heat resistance, which leads to obvious defects such as blistering, delamination, and protrusions in the prepared pressure-sensitive electromagnetic protective film in the subsequent reflow soldering process and solder dipping process. , and the present invention not only improves the heat-resistant type of the product, but also improves the scope of application of the product by screening the silicone pressure-sensitive adhesive material.

Description of drawings

Fig. 1 is the product structural representation of embodiment 1,3,4 of the present invention;

Fig. 2 is a schematic diagram of the product structure of Embodiment 2 of the present invention.

The symbols in the figure are represented as: 1. base material; 2. release layer; 3. barrier insulation layer; 4. 5. metal layer; 6. pressure-sensitive adhesive conductive adhesive layer; 7. protective layer.

Detailed ways

The pressure-sensitive electromagnetic protective film provided by the invention is composed of a base material, a release layer, a barrier insulating layer, at least one metal layer, a pressure-sensitive conductive adhesive layer and a protective film, wherein the release layer is arranged on the surface of the base material, The barrier insulating layer is located between the release layer and the metal layer, a pressure-sensitive conductive adhesive layer is arranged on the surface of the metal layer, and the protective film is located on the outermost side of the electromagnetic protective film.

The present invention has no special requirements on the substrate, and it can choose known engineering plastic films, such as polyester film, polyimide film, polyimide amide film, polyphenylene sulfide film, polypropylene film and the like. Due to the adoption of the new finger-pressing process, the cheap polyester film is preferred.

The material requirements of the release layer of the present invention can be cold peeled after finger pressure, preferably no silicon release layer, and the release force of the release layer is preferably 0.1N/cm-1N/ cm, when the release force is greater than 1N/cm, the subsequent operation is not easy to peel off the tape base, and when the release force is less than 0.1N/cm, the coating is prone to peeling off.

The function of the barrier insulation layer in the present invention is mainly to provide excellent wear resistance, heat insulation, water insulation, gas insulation, insulation and other functions when the electromagnetic protective film is processed and applied to the circuit board. The barrier insulation layer is made of high temperature resistant resin The coating solution composed of carbon black filler is coated and cured, and its high temperature resistant resin can be composed of one or more thermosetting resins such as epoxy resin, polyester resin, polyurethane resin, polyamide resin, or acrylic, One or several components of methacrylic acid and polyurethane modified acrylic UV curing resin, such as commercially available epoxy resin E-20, etc.

In the present invention, the thickness of the barrier insulating layer is 4-6 μm. If the thickness of the insulating layer is less than 4 μm, the properties of wear resistance, heat insulation, water insulation, gas insulation, and insulation will be poor. If the thickness of the barrier insulating layer is greater than 6 μm, its flexibility will decrease. , Poor flexibility and bending resistance.

The role of the carbon black filler in the present invention is to provide a black appearance, reduce the insulation resistance of the surface, and play the role of antistatic. The amount of carbon black added accounts for 5%-40% of the solid content, preferably 10%-40%. When it is greater than 40%, the insulation performance decreases, the coating becomes brittle, and the flexibility decreases. When it is less than 5%, the blackness cannot meet the requirements and cannot meet the requirements of non-reflective subsequent processing (recognized).

The role of the metal layer in the present invention is to reflect electromagnetic wave signals, and its material can be selected from aluminum, nickel, copper, silver, gold, or formed by a combination of the above two or several materials, preferably a silver layer or a copper layer. Its thickness is 0.05-0.5 μm, preferably 0.1-0.2 μm. When the thickness of the metal layer is less than 0.1um, the shielding effectiveness is less than 50dB. When the thickness of the metal layer is greater than 0.2μm, the stress of the layer is relatively large, and the metal layer is easy to break during the flexibility test. The metal layer is formed on the surface of the barrier insulating layer by vacuum evaporation, sputtering and other processes.

The pressure-sensitive conductive adhesive layer in the present invention not only satisfies the requirement of grounding, electric conduction and heat conduction of the product, but also simplifies the processing technology. Compared with the existing heating lamination curing process, it only needs to align the product and attach the electromagnetic protective film For the part, just apply a little pressure with finger pressure. It is obtained by coating and curing a coating solution composed of the following weight percentages: 20%-70% of conductive metal powder, 25%-78% of pressure-sensitive adhesive resin, and 2%-5% of other additives. The above-mentioned substances are mixed with a solvent such as toluyphenone in a certain proportion, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes. Its thickness is controlled at 8-15 μm. If the thickness of the pressure-sensitive adhesive type conductive adhesive layer is less than 8 μm, the adhesion fastness is poor, and it is easy to fall off and separate during long-term use; It does not meet the needs of ultra-thin development.

Under the subsequent reflow soldering process and solder dipping process, products with poor conductive adhesive layer are prone to obvious defects such as blistering, delamination, and protrusions, and the pressure-sensitive adhesive resin suitable for the present invention is rubber-type pressure-sensitive adhesive, At least one of acrylic pressure-sensitive adhesives, silicone pressure-sensitive adhesives, and polyurethane pressure-sensitive adhesives. Due to the follow-up known reflow soldering process and solder dipping process, the heat resistance of the product is highly required, and silicone pressure-sensitive adhesive is preferred. In addition, in order to meet the requirements of step filling and small hole grounding conductivity, rubber-type pressure-sensitive adhesives can be mixed. Including but not limited to the following well-known substances: solvent-free silicone pressure-sensitive adhesive Dow Corning adhesive, SBS series pressure-sensitive adhesive (rubber-type pressure-sensitive adhesive) produced by Beijing Guanghui Century, etc.; pressure-sensitive adhesives prepared using the above-mentioned preferred materials The sensitive electromagnetic protective film not only improves the heat resistance of the product, but also improves the scope of application of the product.

The conductive metal powder suitable for the present invention can be selected from one or more of commercially available silver powder, copper powder, nickel powder, silver-coated copper powder, and silver-coated nickel powder. The shape of the conductive metal powder suitable for the present invention is dendritic, flake, rod, spherical or a combination of several types. Dendritic conductive metal powder is preferred when the conductivity is high, such as Mitsui Metal Industry Co., Ltd. The ALAX-225 dendritic silver-coated copper powder of production; Other additives suitable for the present invention are at least one of dispersant, antioxidant, catalyst, aging agent, antistatic agent, anti-settling agent or leveling agent, etc., Including but not limited to the following known substances: dispersant 163, antioxidant 168, antioxidant 1010, etc.

After the pressure-sensitive conductive adhesive layer of the present invention is attached to the flexible circuit board by finger pressure, the peeling force of the 180° test is preferably 1.5N/cm-4N/cm. When the peeling force is less than 1.5N/cm, the peeling force is When the base material is easy to appear, the overall coating is not firmly adhered to the flexible circuit board, so that it will fall off, and the 3M adhesive tape is easy to fall off. When the peeling force is greater than 4N/cm, it is difficult to clean up after mounting errors, resulting in the scrapping of the flexible circuit board.

The protective film of the present invention has no special requirements, and it can be selected from known engineering plastic films, such as polyester film, polyimide film, polyimide amide film, polyphenylene sulfide film, polypropylene film and the like. Inexpensive polyester films are preferred. The protective film of the present invention needs to be compounded on the outside of the pressure-sensitive conductive adhesive layer through known temperature and pressure.

The preparation method of the pressure-sensitive type electromagnetic protective film provided by the invention is as follows:

Coat the release layer on the substrate, after curing, coat the barrier insulating layer on the surface of the release layer, vacuum evaporate at least one metal layer on the barrier insulating layer, and coat the pressure-sensitive conductive adhesive on the surface of the metal layer Layer, after a certain temperature and pressure composite protective film to obtain a pressure-sensitive electromagnetic protective film with high shielding effectiveness.

The coating method adopts known coating methods, such as extrusion coating, nozzle coating, three-roll coating, anilox roll coating, printing coating and the like.

When the pressure-sensitive electromagnetic protective film provided by the present invention is used for flexible circuit boards or flexible circuit boards, it is only necessary to peel off the protective film before use, then align the position where the electromagnetic protective film needs to be installed, and press it with finger pressure, and then peel it off The base material and the release layer do not require too many equipment such as laminators and ovens; there is no need for complicated personnel settings and complicated operation steps, and it can effectively reduce energy consumption and the possibility of danger in subsequent operations.

The present invention will be further described below in conjunction with embodiment.

Example 1

1. Preparation of coating liquid for pressure-sensitive conductive adhesive layer 6

ALAX-225 dendritic silver-coated copper powder produced by Mitsui Metal Industry Co., Ltd. 20g

Dow Corning Silicone Pressure Sensitive Adhesive Dow Corning Adhesive 78g

BYK-1631g produced by BYK Chemicals in Germany

Antioxidant BASF1680.5g produced by BASF, Germany

Antioxidant BASF10100.5g produced by BASF, Germany;

The above-mentioned substances are mixed with a solvent such as toluyphenone in a certain proportion, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes.

2. Preparation of pressure-sensitive adhesive-type electromagnetic protective film

Coat the acrylic resin release layer 2 on the 50 μm PET carrier film 1, and coat the coating solution composed of epoxy-modified polyurethane resin and carbon black filler on the surface of the release layer after curing to form a barrier with a thickness of 4 μm. On the insulating layer 3, a 0.1 μm silver-plated layer 4 is vacuum-deposited on the surface of the barrier insulating layer, and the pressure-sensitive conductive adhesive coating liquid configured above is coated on the surface of the silver-plated layer to form a pressure-sensitive conductive adhesive with a dry film thickness of 8 μm. Adhesive layer 6, after curing, compound protective film 7 under certain temperature and pressure to obtain a pressure-sensitive electromagnetic protective film.

Test-related properties are listed in Table 1.

Example 2

1. Preparation of coating liquid for pressure-sensitive conductive adhesive layer 6

ALAX-225 dendritic silver-coated copper powder produced by Mitsui Metal Industry Co., Ltd. 30g

Dow Corning Silicone Pressure Sensitive Adhesive Dow Corning Adhesive 68g

BYK-1631g produced by BYK Chemicals in Germany

Antioxidant BASF1680.5g produced by BASF, Germany

Antioxidant BASF10100.5g produced by BASF, Germany;

The above-mentioned substances are mixed with a solvent such as toluyphenone in a certain proportion, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes.

2. Preparation of pressure-sensitive adhesive-type electromagnetic protective film

Coat the acrylic resin release layer 2 on the 50 μm PET carrier film 1, and coat the coating solution composed of epoxy-modified polyurethane resin and carbon black filler on the surface of the release layer after curing to form a barrier with a thickness of 4 μm. Insulation layer 3, a 0.05 μm silver-plated layer 4 is vacuum-deposited on the surface of the barrier insulation layer, a 0.05-μm copper-plated layer 5 is vacuum-deposited on the surface of the silver-plated layer, and the pressure-sensitive conductive adhesive configured above is coated on the surface of the copper-plated layer The coating solution forms a pressure-sensitive conductive adhesive layer 6 with a dry film thickness of 8 μm, and after curing, a pressure-sensitive electromagnetic protective film is obtained by compounding a protective film 7 under a certain temperature and pressure.

Test-related properties are listed in Table 1.

Example 3

1. Preparation of coating liquid for pressure-sensitive conductive adhesive layer 6

ALAX-225 dendritic silver-coated copper powder produced by Mitsui Metal Industry Co., Ltd. 50g

Dow Corning Silicone Pressure Sensitive Adhesive Dow Corning Adhesive 46g

BYK-1632.5g produced by BYK Chemicals in Germany

Antioxidant BASF1680.75g produced by BASF, Germany

Antioxidant BASF10100.75g produced by BASF, Germany;

The above-mentioned substances are mixed with a solvent such as toluyphenone in a certain proportion, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes.

2. Preparation of pressure-sensitive adhesive-type electromagnetic protective film

Coat the acrylic resin release layer 2 on the 50 μm PET carrier film 1, and coat the coating solution composed of epoxy-modified polyurethane resin and carbon black filler on the surface of the release layer after curing to form a barrier with a thickness of 6 μm. For the insulating layer 3, a 0.2 μm silver-plated layer 4 is vacuum-deposited on the surface of the barrier insulating layer, and the pressure-sensitive conductive adhesive coating solution configured above is coated on the surface of the silver-plated layer to form a pressure-sensitive conductive adhesive with a dry film thickness of 15 μm. Adhesive layer 6, after curing, compound protective film 7 under certain temperature and pressure to obtain a pressure-sensitive electromagnetic protective film.

Test-related properties are listed in Table 1.

Example 4

1. Preparation of coating liquid for pressure-sensitive conductive adhesive layer 6

ALAX-225 dendritic silver-coated copper powder produced by Mitsui Metal Industry Co., Ltd. 70g

Dow Corning Silicone Pressure Sensitive Adhesive Dow Corning Adhesive 25g

BYK-1633g produced by BYK Chemicals in Germany

Antioxidant BASF1681g produced by BASF, Germany

Antioxidant BASF10101g produced by BASF, Germany;

The above-mentioned substances are mixed with a solvent such as toluyphenone in a certain proportion, and then dispersed by known high-speed stirring, ball milling, fast hand, grinding and other processes.

2. Preparation of pressure-sensitive adhesive-type electromagnetic protective film

Coat the acrylic resin release layer 2 on the 50 μm PET carrier film 1, and coat the coating solution composed of epoxy-modified polyurethane resin and carbon black filler on the surface of the release layer after curing to form a barrier with a thickness of 4 μm. For the insulating layer 3, a 0.1 μm silver-plated layer 4 is vacuum-deposited on the surface of the barrier insulating layer, and the pressure-sensitive conductive adhesive coating solution configured above is coated on the surface of the silver-plated layer to form a pressure-sensitive conductive adhesive with a dry film thickness of 15 μm. Adhesive layer 6, after curing, compound protective film 7 under certain temperature and pressure to obtain a pressure-sensitive electromagnetic protective film.

Test-related properties are listed in Table 1.

The pressure-sensitive electromagnetic protective film obtained in the above examples was pressure-bonded with KAPTON 100H by means of finger pressure, and the performance was tested.

Comparative example 1: Coating a fluorine-containing resin release layer on a 50 μm PET carrier film, coating a UV curable resin layer on the surface of the release layer after curing, forming a hard layer with a dry film thickness of 2 μm after UV curing, and coating the hard layer on the surface of the hard layer Coating a flexible polyurethane soft layer with a dry film thickness of 3 μm, sputtering a 0.1 μm silver-plated layer on the flexible soft layer, coating an epoxy resin conductive adhesive layer on the surface of the silver-plated layer, with a dry film thickness of 17 μm, after a certain temperature Composite protective film with pressure to obtain electromagnetic wave protective film.

The electromagnetic wave protection film prepared above and the DuPont polyimide film KAPTON100H were processed by a known process, that is, pre-cured at 180°C for 30s, and then laminated at a pressure of 2Mpa for 2min, and then transferred to a 160°C oven for curing for 30min.

Comparative Example 2: Coating an acrylic release layer on a 50 μm PET carrier film, coating polyurethane polyurea resin on the surface of the release layer after curing to form a 7 μm insulating layer, and coating isotropic polyurethane polyurea resin on the surface of the insulating layer. The urea resin conductive adhesive layer has a dry film thickness of 15 μm, and the electromagnetic wave protective film is obtained by compounding the protective film at a certain temperature and pressure.

The electromagnetic wave protection film prepared above and the DuPont polyimide film KAPTON100H were processed by a known process, that is, pre-cured at 180°C for 30s, and then laminated at a pressure of 2Mpa for 2min, and then transferred to a 160°C oven for curing for 30min.

Comparative example 3: Coating an acrylic release layer on a 50 μm PET carrier film, coating epoxy resin on the surface of the release layer after curing to form a 4 μm insulating layer, and vacuum-depositing a 0.1 μm silver-plated layer on the surface of the insulating layer , 0.2 μm copper plating layer is vacuum deposited on the surface of the silver plating layer, and an epoxy resin conductive adhesive layer is coated on the surface of the copper plating layer, with a dry film thickness of 15 μm. After a certain temperature and pressure composite protective film, an electromagnetic wave protective film is obtained.

The electromagnetic wave protective film prepared above is processed with the DuPont polyimide film KAPTON100H by a known process, that is, pre-cured at 180°C for 30s, and then laminated at a pressure of 2Mpa for 2min, and then transferred to a 160°C oven for curing for 30min .

Table 1 Performance test table

1. Shielding effectiveness test method:

Test according to GJB6190-2008 "Measurement Method for Shielding Effectiveness of Electromagnetic Shielding Materials".

2. Test method for adhesion fastness:

Well-known in the industry with 3M600 tape adhesion test

3. Connection resistance test method:

Test with a four-wire milliohmmeter.

4. Bending resistance test method:

Under the condition that the bending radius is 0.1mm, the reciprocating motion is tested for 100,000 times, and the microscope is used to observe whether the coating is broken

5. Test method of reflow soldering process and dip soldering process

Reflow soldering process: The reflow soldering process test is carried out under the reflow soldering temperature curve with a maximum temperature of 265°C and a temperature above 220°C for 20s

Solder immersion process test: immerse in tin solution at 288°C for 10s for inspection. From the above results, it can be seen that the embodiment prepared by the present invention is equivalent to the electromagnetic protective film of the comparative example in terms of shielding effectiveness, connection resistance, adhesion fastness, bending resistance, reflow soldering resistance and solder immersion tin, and in the subsequent operation Great improvements have been made in processing and correction after placement or positioning errors have occurred.

Claims (9)

1. a pressure sensitive electromagnetic protection film; set gradually release layer on the surface of base material, intercept insulating barrier, at least one deck metal level, pressure sensitive conductive adhesive layer, diaphragm; it is characterized in that; the coating liquid solidification that described pressure sensitive conductive adhesive layer is made up of the material containing following weight percentage obtains: conductive metal powder 20%-70%; pressure sensitive adhesive resin 25%-78%, auxiliary agent 2%-5%.

2. electromagnetic protection film according to claim 1, is characterized in that, described conductive metal powder is at least one in silver powder, copper powder, nickel powder, silver-coated copper powder, silver coated nickel powder, carbon nano-tube, silver-colored bag carbon nano-tube.

3. electromagnetic protection film according to claim 2, is characterized in that, described pressure sensitive adhesive resin is at least one in rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive, organic pressure-sensitive gel, polyurethanes pressure sensitive adhesive.

4. electromagnetic protection film according to claim 3, is characterized in that, described auxiliary agent be dispersant, antioxidant, catalyst, aging dose, antistatic agent, at least one in anti-settling agent or levelling agent etc.

5. electromagnetic protection film according to claim 4, is characterized in that, described pressure sensitive conductive adhesive layer thickness is 8-15 μm.

6. electromagnetic protection film according to claim 5, is characterized in that, described pressure sensitive conductive adhesive layer 180 ° of peeling forces are 1.5N/cm-4N/cm.

7. electromagnetic protection film according to claim 6, is characterized in that, the coating liquid that described obstruct insulating barrier is made up of resistant to elevated temperatures resin and carbon black filler solidify to form, and the thickness intercepting insulating barrier is 4 ~ 6 μm.

8. electromagnetic protection film according to claim 7, is characterized in that, the thickness of described metal level is 0.05 ~ 0.5 μm.

9. electromagnetic protection film according to claim 8, is characterized in that, the off-type force of described release layer is 0.1N/cm-1N/cm.