CN104859267A - Housing preparation method and electronic device - Google Patents
Housing preparation method and electronic device Download PDFInfo
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- CN104859267A CN104859267A CN201410058225.2A CN201410058225A CN104859267A CN 104859267 A CN104859267 A CN 104859267A CN 201410058225 A CN201410058225 A CN 201410058225A CN 104859267 A CN104859267 A CN 104859267A
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- 239000000463 material Substances 0.000 claims description 8
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
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- 229920002480 polybenzimidazole Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 244000198134 Agave sisalana Species 0.000 claims description 3
- 229910052580 B4C Inorganic materials 0.000 claims description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 3
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 3
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- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 3
- 229920003235 aromatic polyamide Polymers 0.000 claims description 3
- 239000010425 asbestos Substances 0.000 claims description 3
- 239000011425 bamboo Substances 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 3
- OQRWAMBQGTYSRD-UHFFFAOYSA-N dipotassium;oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[K+].[K+].[Ti+4].[Ti+4].[Ti+4].[Ti+4] OQRWAMBQGTYSRD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 125000000623 heterocyclic group Chemical group 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000004763 nomex Substances 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
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- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 235000013824 polyphenols Nutrition 0.000 claims description 3
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229910052895 riebeckite Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 2
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- 230000008569 process Effects 0.000 abstract description 10
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- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000007731 hot pressing Methods 0.000 abstract 2
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- 239000003973 paint Substances 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
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- 229910000926 A-3 tool steel Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 239000003921 oil Substances 0.000 description 1
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- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
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- 239000012780 transparent material Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The present invention relates to a housing preparation method and an electronic device. The method comprises: dipping a fiber cloth in a resin to obtain a fiber cloth prepreg; applying a surface film on the fiber cloth prepreg surface, wherein the surface film is pre-provided with patterns and/or textures; and carrying out hot pressing forming on the fiber cloth prepreg with the surface film, wherein the surface film and the fiber cloth are adhered into the integration through the resin. According to the present invention, the surface film having the patterns and/or textures is arranged and the surface film and the fiber cloth are combined into the integration during the hot pressing forming process so as to directly form the outer surface of the housing product, such that the surface treatment step in the prior art is eliminated, the manufacturing time can be shortened, and the product yield can be increased.
Description
Technical field
The present invention relates to a kind of forming technique, particularly relate to one and be applied to the housing of electronic equipment and preparation method and electronic equipment.
Background technology
Usual mobile phone, the consumption electronic product housings such as panel computer are plastic cement or metal structure, housing total quality is heavier, some products are in order to the deficiency in balance mass and intensity, metal and plastic material can be combined, some supporting structures use metal, and the region lower at force request uses plastic cement, but these improvement farthest can not embody the mechanical property of product design requirement.For this reason, people have invested structural strength better eye, the fiber composite reinforcing material that quality is lighter, wherein carbon fiber composite reinforced material becomes the focus that people pay close attention to, carbon fibre material is along fiber axis to showing very high intensity, and carbon fiber proportion is little, has very high specific strength.The proportion of carbon fiber is not as good as 1/4 of steel, tensile strength is generally at more than 3500MPa, it is 7 ~ 9 times of steel, tensile modulus of elasticity is also higher than steel, be 23000 ~ 43000MPa, its strength of materials density ratio can reach 2000MPa/ (g/cm3), and the specific strength of A3 steel is only 59MPa/ (g/cm3) left and right.
The preparation process of existing carbon fiber electronic product casing mainly comprises, 3k carbon fiber is adopted to be compiled into fiber cloth, then resin-dipping is carried out, carry out hot-forming to the fiber cloth after impregnating resin, after shaped article is sheared, adopt Shooting Technique to form functional parts, the housing with application function can be obtained thus.For making housing have easily by the visual effect of consumers welcomed, also needing to process surface of shell, making it present texture or pattern.Processes such as generally comprising oil spout to the surface treatment of housing in prior art, polish, spray paint, finally obtains the carbon fiber skin product of lustrous surface and good mechanical performance.But the preparation method of above-mentioned carbon fiber shell exists complex procedures, and efficiency is low, the preparation time of housing is longer is generally 1 hour.Above-mentioned surface treatment process also can cause carbon fibre braiding lines uneven, the pin hole that sprays paint, orange peel, extension paint etc., and cause product fraction defective very high, cost raises.The bad product occurred in surface treatment process accounts for the 60-70% of total bad product.
Summary of the invention
Main purpose of the present invention is, a kind of preparation method and electronic equipment of housing are proposed, by adopt skin covering of the surface and in hot-forming process directly the formation picture on surface of housing and/or texture, thus reduce the complexity of the preparation technology of filament case, and then the yields of housing preparation method can be improved.
Object of the present invention can adopt following scheme to realize, and one embodiment of the present of invention propose a kind of preparation method of housing, and this housing is used in electronic equipment, and described method comprises the following steps:
Fiber cloth is flooded in resin, obtains fiber cloth prepreg;
Lay skin covering of the surface on the surface of described fiber cloth prepreg, described skin covering of the surface is preset with pattern and/or texture;
Undertaken hot-forming by the fiber cloth prepreg being laid with skin covering of the surface, described skin covering of the surface and described fiber cloth to be resin-bondedly integrated by described.
Further, described housing preparation method also comprises: shear the product after hot-forming, forms predetermined shape.
Further, described housing preparation method also comprises: put injection moulding in molding mold cavity into the product after hot-forming, forms the functional parts of housing.
Further, the described resin described in housing preparation method is thermosetting resin; Described resin is epoxy resin or phenolic resins.
Further, the described fiber cloth described in housing preparation method is two-layer or multilayer.
Further, the described fiber cloth described in housing preparation method is UD fiber cloth.
Further, the described pattern described in housing preparation method and/or texture adopt typography to be arranged on described skin covering of the surface.
Further, the material of the described fiber cloth described in housing preparation method is continuous fortifying fibre, carbon fiber, gas-phase growth of carbon fibre, polyacrylonitrile (PAN) base carbon fibre, viscose base carbon fibre, asphalt base carbon fiber, polyolefine fiber, superhigh molecular weight polyethylene fibers, polypropylene fibre, polytetrafluoroethylene fibre, polyacrylonitrile fibre, Fypro, polyimide fiber, aromatic polyamide fibre, Nomex pulp, polyester (PET) fiber, polyarylate fiber, poly-fragrant heterocycle fiber, polyphenol aldehyde fibre, polybenzimidazoles (PBI) fiber, polybenzothiozole (PBT) fiber, polyphenyl support Ben Bing bis-oxazole (PBO) fiber, polyether-ether-ketone (PEEK) fiber, string, bamboo fibre, sisal fiber, ramee, tossa, glass fibre, E-glass fibre, S-glass fibre, quartz glass fibre, resurrection glass fibre, asbestos fibre, basalt fibre, silicon carbide fibre, CVD silicon carbide fibre, polymer-derived method silicon carbide fibre, Zirconium oxide fibre, alumina fibre, silicon nitride fiber, boron fibre, titanium boride fibre, boron carbide fibre, zirconic acid aluminum fiber, alumina silicate fibre, potassium titanate fibre, bicomponent composite fibre or graphite fibre.
Another embodiment of the present invention also proposes a kind of electronic equipment, and it comprises multiple electronic devices and components; And housing, described housing is for forming a spatial accommodation, and described multiple electronic devices and components are arranged in described spatial accommodation; Described housing comprises fiber cloth and skin covering of the surface; Wherein, described fiber cloth lays described skin covering of the surface after resin-dipping, then through hot-forming, described skin covering of the surface and described fiber cloth is bonded as one; Described skin covering of the surface is as at least one surface of described electronic equipment.
Further, the housing of described electronic equipment is prepared from by above-mentioned casting of electronic device preparation method.
Further, described electronic equipment is mobile phone, panel computer, all-in-one, desktop computer, media player, notebook computer, television set, display or mobile memory.
By technique scheme, embodiments of the invention at least have following advantages:
By arranging the skin covering of the surface with pattern and/or decorative pattern, and in hot-forming process, skin covering of the surface and fiber cloth are combined, thus directly form the outer surface of shell product, thus save surface-treated step of the prior art, greatly can shorten manufacturing time.
In addition, the pattern of described skin covering of the surface and/or decorative pattern can be realized by typography, namely the high-fineness of pattern and/or decorative pattern can be realized, the bad phenomenon such as the pin hole that sprays paint caused in the surface treatment process of the prior art also reduced, orange peel, extension paint, thus the yields of product can be improved.
Adopt due to the image of the outer surface of housing can be realized for user's observation by skin covering of the surface, so, whether reduce user is the attention rate of carbon fiber establishment product to product, the lower unidirectional lamination of cost (UD carbon cloth) can be made to carry out alternative weaving carbon fiber cloth of the prior art, thus the material cost of housing can be reduced, the intensity of shell product can not be reduced simultaneously.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the preparation method of the housing that an embodiment proposes.
Detailed description of the invention
For further setting forth the present invention for the technological means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to the acoustic-control unlocking method proposed according to the present invention and its detailed description of the invention of electronic equipment, structure, feature and effect thereof, be described in detail as follows.In the following description, the not necessarily same embodiment that different " embodiment " or " embodiment " refers to.In addition, special characteristic, structure or feature in one or more embodiment can be combined by any suitable form.
One embodiment of the present of invention propose a kind of preparation method of housing, and this housing is applied in electronic equipment, and described housing is for forming the space of the electronic devices and components holding described electronic equipment.As shown in Figure 1, be the schematic flow sheet of method described in the present embodiment, this said method comprising the steps of: for carbon fibre materials:
Step S101, by carbon fiber bundle or individual carbon fibers parallel arranged or carry out interlacing, forms carbon cloth.Different decorative patterns or pattern can be formed due to the difference of weaving manner by the carbon cloth of braiding.Be then unidirectional lamination (also claim UD fiber cloth) by the fiber cloth of parallel arranged.Above-mentioned carbon cloth is put into resin flood, resin is penetrated into completely for best in each fiber gap of carbon cloth, thus forms carbon cloth prepreg.The carbon cloth prepreg that this step obtains, also can adopt existing commercial goods on market to substitute.
Preferably, described resin is thermosetting resin, through to be heated hardened forming gradually, then to be heated and also not soften, can not dissolve.Described thermosetting resin is preferably phenolic resins, epoxy resin, amino resins, unsaturated polyester resin or silicon ether resin.
Preferably, described carbon cloth adopts unidirectional lamination, adopts unidirectional lamination to have the low advantage of cost.
Step S20, provides a skin covering of the surface, and at least one surface of described skin covering of the surface is provided with pattern or decorative pattern.Preferably, when described skin covering of the surface is made up of transparent material, also pattern or decorative pattern can be all set on two of a described skin covering of the surface surface.On the carbon cloth prepreg being laid in described by this skin covering of the surface, then described skin covering of the surface will cover described carbon cloth, and a surface of skin covering of the surface then becomes user oriented surface, the pattern of this skin covering of the surface and decorative pattern will see by user.Described skin covering of the surface can be made up of plastics or resin, such as, be Merlon (PC) or PETG (PET).
Step S30, the described carbon cloth prepreg being laid with skin covering of the surface is inserted carry out in heat pressing forming machines hot-forming, the resin in carbon cloth prepreg is made to be heated and to harden, described skin covering of the surface also sticks by the resin simultaneously in thermal histories, thus make skin covering of the surface and carbon cloth by together with resin-bonded, become as a whole.
Step S40, shears the product after hot-forming according to predetermined shape, thus can obtain the major part of housing.
Step S50, injection moulding, forms housing functional parts.Due to adopt hot-forming after product be generally tabular, the part can seen by user of housing can only be obtained after shearing.Such as, as installing internal component or for coordinating the functional parts of miscellaneous part, screw mount pad, buckle, components and parts support seat etc., need to be realized by Shooting Technique.Described hot-forming rear product is placed in predetermined molding mold cavity, injects raw material, and after pressurize, solidification, cooling, open mould, the housing that can be applicable in electronic equipment can be obtained.
The surface can observed by user of described housing is above-mentioned skin covering of the surface, and the pattern of described skin covering of the surface and/or decorative pattern are exactly the image appearance of housing.
Preferably, described carbon cloth prepreg, can adopt sandwich construction, overlapping by two-layer or two-layer above carbon cloth tiling, is preferably layer 2-4, is then impregnated in resin by the carbon cloth of sandwich construction.The intensity of shell product can be strengthened thus.Preferably, described multi-storey up-down and translation can adopt the carbon cloth of a type, be all such as unidirectional lamination or be all braiding carbon cloth; Also dissimilar carbon cloth can be adopted to use with, and such as wherein one deck or which floor carbon cloth are unidirectional lamination, and the carbon cloth of other layers is the carbon cloth of braiding.
Preferably, one deck adhesive glue can also be set between the pre-cloth prepreg of carbon fiber and described skin covering of the surface, thus skin covering of the surface can be made can better to be bonded in described carbon cloth.
Further, the carbon fiber in above-described embodiment can substitute by other Fiber Materials, be such as continuous fortifying fibre, include but not limited to polyolefine fiber, superhigh molecular weight polyethylene fibers, polypropylene fibre, polytetrafluoroethylene fibre, polyacrylonitrile fibre, Fypro, polyimide fiber, aromatic polyamide fibre, Nomex pulp, polyester fiber, polyarylate fiber, poly-fragrant heterocycle fiber, polyphenol aldehyde fibre, PBI fibre, polybenzazole fibers, polyphenyl support Ben Bing bis-oxazole fiber, polyetheretherketonefiber fiber, string, bamboo fibre, sisal fiber, ramee, tossa, glass fibre, alkali-free glass fibre, high-strength and high-modulus glass fibre, quartz glass fibre, resurrection glass fibre, asbestos fibre, basalt fibre, silicon carbide fibre, chemical vapor deposition of silicon carbide fiber, polymer-derived method silicon carbide fibre, Zirconium oxide fibre, alumina fibre, silicon nitride fiber, boron fibre, titanium boride fibre, boron carbide fibre, zirconic acid aluminum fiber, alumina silicate fibre, potassium titanate fibre, bicomponent composite fibre, graphite fibre.
Adopt the casting of electronic device that said method obtains, owing to adopting the skin covering of the surface adding predetermined pattern and/or decorative pattern in the fabrication process, thus can omit in prior art surface treatment process is carried out to the housing after hot-forming, the cycle that housing is produced can be shortened like this.Unidirectional fiber cloth is adopted also more to save manufacturing cost than employing woven cloth.Meanwhile, because the predetermined pattern on skin covering of the surface and/or decorative pattern can be realized by typography of the prior art, the variation of pattern and/or decorative pattern can be made easily, and the fine degree of pattern and/or decorative pattern also improves greatly.There will not be the phenomenons such as the carbon fibre braiding lines usually occurred in existing carbon fiber shell preparation process is uneven, the pin hole that sprays paint, orange peel, extension paint, significantly can reduce the fraction defective of product.
Embodiments of the invention also propose a kind of electronic equipment, and it comprises multiple electronic devices and components; And housing, described housing is for forming a spatial accommodation, and described multiple electronic devices and components are arranged in described spatial accommodation; Described housing comprises fiber cloth and skin covering of the surface; Wherein, described fiber cloth lays described skin covering of the surface after resin-dipping, then through hot-forming, described skin covering of the surface and described fiber cloth is bonded as one; Described skin covering of the surface is as at least one surface of described electronic equipment.Preferably, namely the housing of described electronic equipment adopts the housing that the housing preparation method described in above-described embodiment is prepared from.Further, described electronic equipment is mobile phone, panel computer, all-in-one, desktop computer, media player, notebook computer, television set, display or mobile memory.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solution of the present invention, according to any simple modification that technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (12)
1. a preparation method for housing, this housing is used in electronic equipment, and described method comprises the following steps:
Fiber cloth is flooded in resin, obtains fiber cloth prepreg;
Lay skin covering of the surface on the surface of described fiber cloth prepreg, described skin covering of the surface is preset with pattern and/or texture;
Undertaken hot-forming by the fiber cloth prepreg being laid with skin covering of the surface, described skin covering of the surface and described fiber cloth to be resin-bondedly integrated by described.
2. housing preparation method according to claim 1, is characterized in that, also comprise:
Product after hot-forming is sheared, forms predetermined shape.
3. housing preparation method according to claim 1, is characterized in that, also comprise:
Injection moulding in molding mold cavity is put into the product after hot-forming, forms the functional parts of housing.
4. housing preparation method according to claim 1, is characterized in that, described resin is thermosetting resin.
5. housing preparation method according to claim 1, is characterized in that, described resin is epoxy resin or phenolic resins.
6. housing preparation method according to claim 1, is characterized in that, described fiber cloth is two-layer or multilayer.
7. housing preparation method according to claim 1, is characterized in that, described fiber cloth is UD carbon cloth.
8. housing preparation method according to claim 1, is characterized in that, described pattern and/or texture adopt typography to be arranged on described skin covering of the surface.
9. housing preparation method according to claim 1, is characterized in that, the material of described fiber cloth is carbon fiber, gas-phase growth of carbon fibre, polyacrylonitrile-based carbon fibre, viscose base carbon fibre, asphalt base carbon fiber, polyolefine fiber, superhigh molecular weight polyethylene fibers, polypropylene fibre, polytetrafluoroethylene fibre, polyacrylonitrile fibre, Fypro, polyimide fiber, aromatic polyamide fibre, Nomex pulp, polyester fiber, polyarylate fiber, poly-fragrant heterocycle fiber, polyphenol aldehyde fibre, PBI fibre, polybenzazole fibers, polyphenyl support Ben Bing bis-oxazole fiber, polyetheretherketonefiber fiber, string, bamboo fibre, sisal fiber, ramee, tossa, glass fibre, alkali-free glass fibre, high-strength and high-modulus glass fibre, quartz glass fibre, resurrection glass fibre, asbestos fibre, basalt fibre, silicon carbide fibre, chemical vapor deposition of silicon carbide fiber, polymer-derived method silicon carbide fibre, Zirconium oxide fibre, alumina fibre, silicon nitride fiber, boron fibre, titanium boride fibre, boron carbide fibre, zirconic acid aluminum fiber, alumina silicate fibre, potassium titanate fibre, bicomponent composite fibre or graphite fibre.
10. an electronic equipment, it comprises
Multiple electronic devices and components; And
Housing, described housing is for forming a spatial accommodation, and described multiple electronic devices and components are arranged in described spatial accommodation;
Described housing comprises fiber cloth and skin covering of the surface; Wherein, described fiber cloth lays described skin covering of the surface after resin-dipping, then through hot-forming, described skin covering of the surface and described fiber cloth is bonded as one;
Described skin covering of the surface is as at least one surface of described electronic equipment.
11. electronic equipments according to claim 10, is characterized in that, described housing is prepared from by the method described in any one of claim 1-9.
12. electronic equipments according to claim 9,10 or 11, it is characterized in that, described electronic equipment is mobile phone, panel computer, all-in-one, desktop computer, media player, notebook computer, television set, display or mobile memory.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410058225.2A CN104859267A (en) | 2014-02-20 | 2014-02-20 | Housing preparation method and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410058225.2A CN104859267A (en) | 2014-02-20 | 2014-02-20 | Housing preparation method and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104859267A true CN104859267A (en) | 2015-08-26 |
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ID=53905634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410058225.2A Pending CN104859267A (en) | 2014-02-20 | 2014-02-20 | Housing preparation method and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104859267A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517377A (en) * | 2015-11-30 | 2016-04-20 | 联想(北京)有限公司 | Electronic equipment and manufacturing method |
| CN105818323A (en) * | 2016-05-03 | 2016-08-03 | 嘉瑞科技（惠州）有限公司 | Process for attaching plastic film layer to carbon fiber surface layer |
| CN106579702A (en) * | 2016-11-18 | 2017-04-26 | 中航复材（北京）科技有限公司 | Structure-function-decorating integrated composite material mobile phone protective case and manufacturing method thereof |
| CN106626582A (en) * | 2016-10-08 | 2017-05-10 | 青岛海信电器股份有限公司 | Carbon fiber composite material, preparation method and electronic equipment enclosure |
| WO2018112893A1 (en) * | 2016-12-23 | 2018-06-28 | Covestro Deutschland Ag | A process for producing a molded article and the molded article produced thereby |
| CN108989526A (en) * | 2018-08-15 | 2018-12-11 | 北京小米移动软件有限公司 | Casing and preparation method thereof, intelligent terminal |
| CN109897338A (en) * | 2018-12-29 | 2019-06-18 | 北京新能源汽车技术创新中心有限公司 | Polyether-ether-ketone composite material, housing of power cell and preparation method |
| CN111278244A (en) * | 2020-03-03 | 2020-06-12 | Oppo广东移动通信有限公司 | Housing and preparation method, electronic device |
| CN113715382A (en) * | 2021-09-01 | 2021-11-30 | 中山市富达运动器材有限公司 | Composite forming process for sports shoe soles |
| CN119261240A (en) * | 2023-07-07 | 2025-01-07 | 北京小米移动软件有限公司 | Method for manufacturing shell, shell and electronic equipment |
| WO2025130103A1 (en) * | 2023-12-17 | 2025-06-26 | 荣耀终端股份有限公司 | Multi-layer composite structure, preparation method, battery cover, and electronic device |
| CN120730656A (en) * | 2025-06-30 | 2025-09-30 | Oppo广东移动通信有限公司 | Housing, preparation method thereof and electronic equipment |
| US20250375944A1 (en) * | 2024-06-06 | 2025-12-11 | Asustek Computer Inc. | Asustek computer inc. |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517377A (en) * | 2015-11-30 | 2016-04-20 | 联想(北京)有限公司 | Electronic equipment and manufacturing method |
| CN105818323A (en) * | 2016-05-03 | 2016-08-03 | 嘉瑞科技（惠州）有限公司 | Process for attaching plastic film layer to carbon fiber surface layer |
| CN106626582A (en) * | 2016-10-08 | 2017-05-10 | 青岛海信电器股份有限公司 | Carbon fiber composite material, preparation method and electronic equipment enclosure |
| CN106579702A (en) * | 2016-11-18 | 2017-04-26 | 中航复材（北京）科技有限公司 | Structure-function-decorating integrated composite material mobile phone protective case and manufacturing method thereof |
| WO2018112893A1 (en) * | 2016-12-23 | 2018-06-28 | Covestro Deutschland Ag | A process for producing a molded article and the molded article produced thereby |
| CN108989526A (en) * | 2018-08-15 | 2018-12-11 | 北京小米移动软件有限公司 | Casing and preparation method thereof, intelligent terminal |
| CN109897338A (en) * | 2018-12-29 | 2019-06-18 | 北京新能源汽车技术创新中心有限公司 | Polyether-ether-ketone composite material, housing of power cell and preparation method |
| CN111278244A (en) * | 2020-03-03 | 2020-06-12 | Oppo广东移动通信有限公司 | Housing and preparation method, electronic device |
| CN113715382A (en) * | 2021-09-01 | 2021-11-30 | 中山市富达运动器材有限公司 | Composite forming process for sports shoe soles |
| CN119261240A (en) * | 2023-07-07 | 2025-01-07 | 北京小米移动软件有限公司 | Method for manufacturing shell, shell and electronic equipment |
| WO2025130103A1 (en) * | 2023-12-17 | 2025-06-26 | 荣耀终端股份有限公司 | Multi-layer composite structure, preparation method, battery cover, and electronic device |
| US20250375944A1 (en) * | 2024-06-06 | 2025-12-11 | Asustek Computer Inc. | Asustek computer inc. |
| CN120730656A (en) * | 2025-06-30 | 2025-09-30 | Oppo广东移动通信有限公司 | Housing, preparation method thereof and electronic equipment |
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