CN104339751B - 铜条、带镀敷的铜条以及引线框 - Google Patents

铜条、带镀敷的铜条以及引线框 Download PDF

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Publication number
CN104339751B
CN104339751B CN201410274659.6A CN201410274659A CN104339751B CN 104339751 B CN104339751 B CN 104339751B CN 201410274659 A CN201410274659 A CN 201410274659A CN 104339751 B CN104339751 B CN 104339751B
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CN
China
Prior art keywords
plating layer
base plating
copper bar
growth
copper strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410274659.6A
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English (en)
Chinese (zh)
Other versions
CN104339751A (zh
Inventor
小平宗男
古德浩
古德浩一
山本佳纪
青柳幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Metals Ltd
Original Assignee
SH Copper Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SH Copper Products Co Ltd filed Critical SH Copper Products Co Ltd
Publication of CN104339751A publication Critical patent/CN104339751A/zh
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/416—Reflective
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/702—Amorphous
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
CN201410274659.6A 2013-08-05 2014-06-19 铜条、带镀敷的铜条以及引线框 Active CN104339751B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-162309 2013-08-05
JP2013162309A JP6085536B2 (ja) 2013-08-05 2013-08-05 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール

Publications (2)

Publication Number Publication Date
CN104339751A CN104339751A (zh) 2015-02-11
CN104339751B true CN104339751B (zh) 2018-09-28

Family

ID=52496590

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410274659.6A Active CN104339751B (zh) 2013-08-05 2014-06-19 铜条、带镀敷的铜条以及引线框

Country Status (4)

Country Link
JP (1) JP6085536B2 (ja)
KR (1) KR20150016885A (ja)
CN (1) CN104339751B (ja)
TW (1) TWI647345B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6450639B2 (ja) * 2015-04-27 2019-01-09 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP7011142B2 (ja) * 2016-09-30 2022-01-26 日亜化学工業株式会社 発光装置、発光装置用パッケージ及び発光装置の製造方法
JP6877210B2 (ja) * 2017-03-30 2021-05-26 株式会社Ｋａｎｚａｃｃ 銀メッキ銅系基材およびその製造方法
WO2020217787A1 (ja) 2019-04-22 2020-10-29 Ｎｇｋエレクトロデバイス株式会社 金属部材およびその製造方法
JP7401877B2 (ja) * 2021-02-18 2023-12-20 沢井製薬株式会社 打錠臼
JP7781002B2 (ja) * 2022-03-30 2025-12-05 古河電気工業株式会社 電気接点材料、ならびにこれを用いた接点、端子およびコネクタ
JPWO2023189418A1 (ja) * 2022-03-30 2023-10-05
EP4502247A4 (en) * 2022-03-30 2026-01-14 Furukawa Electric Co Ltd ELECTRICAL CONTACT MATERIAL, AND CONTACT, TERMINAL AND CONNECTOR USING IT
US20240364032A1 (en) * 2022-03-30 2024-10-31 Furukawa Electric Co., Ltd. Electrical contact material, and contact, terminal and connector made using this

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101101950A (zh) * 2006-07-06 2008-01-09 松下电工株式会社 通过向基底材料实施电镀银处理而形成的银膜
CN101405863A (zh) * 2006-03-27 2009-04-08 飞兆半导体公司 使用涂覆有金属的导线的半导体装置及电部件制造
JP2009144248A (ja) * 2005-07-05 2009-07-02 Furukawa Electric Co Ltd:The 電子機器用析出型銅合金材料及びその製造方法
CN102257647A (zh) * 2008-12-19 2011-11-23 古河电气工业株式会社 光半导体装置用引线框及其制造方法
CN102667989A (zh) * 2010-02-12 2012-09-12 古河电气工业株式会社 可动接点部件用银包覆复合材料、其制造方法以及可动接点部件
CN102804429A (zh) * 2009-06-24 2012-11-28 古河电气工业株式会社 光半导体装置用引线框架及其制造方法以及光半导体装置
CN102844897A (zh) * 2010-06-15 2012-12-26 古河电气工业株式会社 光半导体装置用引线框架、光半导体装置用引线框架的制造方法以及光半导体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6335107B1 (en) * 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
US20020185716A1 (en) * 2001-05-11 2002-12-12 Abys Joseph Anthony Metal article coated with multilayer finish inhibiting whisker growth
CN102575369B (zh) * 2009-06-29 2015-08-05 Om产业股份有限公司 电气元件的制造方法和电气元件
JP4629154B1 (ja) * 2010-03-23 2011-02-09 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金及びその製造方法
CN103443309B (zh) * 2011-05-02 2017-01-18 古河电气工业株式会社 铜合金板材及其制造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009144248A (ja) * 2005-07-05 2009-07-02 Furukawa Electric Co Ltd:The 電子機器用析出型銅合金材料及びその製造方法
CN101405863A (zh) * 2006-03-27 2009-04-08 飞兆半导体公司 使用涂覆有金属的导线的半导体装置及电部件制造
CN101101950A (zh) * 2006-07-06 2008-01-09 松下电工株式会社 通过向基底材料实施电镀银处理而形成的银膜
CN102257647A (zh) * 2008-12-19 2011-11-23 古河电气工业株式会社 光半导体装置用引线框及其制造方法
CN102804429A (zh) * 2009-06-24 2012-11-28 古河电气工业株式会社 光半导体装置用引线框架及其制造方法以及光半导体装置
CN102667989A (zh) * 2010-02-12 2012-09-12 古河电气工业株式会社 可动接点部件用银包覆复合材料、其制造方法以及可动接点部件
CN102844897A (zh) * 2010-06-15 2012-12-26 古河电气工业株式会社 光半导体装置用引线框架、光半导体装置用引线框架的制造方法以及光半导体装置

Also Published As

Publication number Publication date
TWI647345B (zh) 2019-01-11
KR20150016885A (ko) 2015-02-13
JP2015030892A (ja) 2015-02-16
JP6085536B2 (ja) 2017-02-22
CN104339751A (zh) 2015-02-11
TW201506209A (zh) 2015-02-16

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20210408

Address after: Osaka Japan

Patentee after: NEOMAX MAT Co.,Ltd.

Address before: Ibaraki

Patentee before: SH Copper Co.,Ltd.

TR01 Transfer of patent right