CN103635725B - 密封构件和复合密封构件 - Google Patents

密封构件和复合密封构件 Download PDF

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Publication number
CN103635725B
CN103635725B CN201280024581.1A CN201280024581A CN103635725B CN 103635725 B CN103635725 B CN 103635725B CN 201280024581 A CN201280024581 A CN 201280024581A CN 103635725 B CN103635725 B CN 103635725B
Authority
CN
China
Prior art keywords
sealing member
molded body
silica hydrogel
component
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280024581.1A
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English (en)
Chinese (zh)
Other versions
CN103635725A (zh
Inventor
小田桐香织
服部祐介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jishui Baoli Ma Technology Co Ltd
Original Assignee
Polymatech Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymatech Japan Co Ltd filed Critical Polymatech Japan Co Ltd
Publication of CN103635725A publication Critical patent/CN103635725A/zh
Application granted granted Critical
Publication of CN103635725B publication Critical patent/CN103635725B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Sealing Material Composition (AREA)
  • Telephone Set Structure (AREA)
  • Gasket Seals (AREA)
CN201280024581.1A 2011-05-24 2012-05-17 密封构件和复合密封构件 Active CN103635725B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-116166 2011-05-24
JP2011116166 2011-05-24
PCT/JP2012/062706 WO2012161099A1 (ja) 2011-05-24 2012-05-17 シール部材及び複合シール部材

Publications (2)

Publication Number Publication Date
CN103635725A CN103635725A (zh) 2014-03-12
CN103635725B true CN103635725B (zh) 2016-08-10

Family

ID=47217178

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280024581.1A Active CN103635725B (zh) 2011-05-24 2012-05-17 密封构件和复合密封构件

Country Status (3)

Country Link
JP (1) JP6101911B2 (ja)
CN (1) CN103635725B (ja)
WO (1) WO2012161099A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9040187B2 (en) 2010-07-13 2015-05-26 Apple, Inc. Battery pack with cells of different capacities electrically coupled in parallel
CN104427043A (zh) * 2013-09-10 2015-03-18 中兴通讯股份有限公司 移动终端的防水塞子
KR102119660B1 (ko) * 2013-10-17 2020-06-08 엘지전자 주식회사 이동 단말기
CN106159333B (zh) 2015-05-14 2019-10-18 苹果公司 裸电芯堆在便携式电子设备的设备壳体内的封装
JP6320967B2 (ja) * 2015-06-09 2018-05-09 イイダ産業株式会社 飾り付け具
JP6834525B2 (ja) * 2017-01-24 2021-02-24 富士通株式会社 防水された装置
JP6432630B2 (ja) * 2017-03-23 2018-12-05 株式会社オートネットワーク技術研究所 シール部材および防水コネクタ
WO2020153345A1 (ja) * 2019-01-25 2020-07-30 積水ポリマテック株式会社 シール部材及び複合シール構造
JP7378967B2 (ja) * 2019-06-07 2023-11-14 日東電工株式会社 通気部品
JP7525843B2 (ja) * 2020-04-24 2024-07-31 株式会社デンソー 自動車用防水ケース
EP4164241A4 (en) * 2020-06-08 2024-07-17 Sony Interactive Entertainment Inc. Electronic apparatus
CN112709820B (zh) * 2020-12-17 2022-06-21 广东安普智信电气有限公司 一种热塑性硫化弹性体密封圈
CN114126308B (zh) * 2021-12-03 2023-07-25 成都航天通信设备有限责任公司 一种模块化通信电台的密封结构
JP2023166705A (ja) * 2022-05-10 2023-11-22 株式会社オートネットワーク技術研究所 端子台
TWI868504B (zh) * 2022-10-27 2025-01-01 張義盛 將多種異質材料利用熱壓方式形成一體化的成型方法及結構

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788430A (ja) * 1993-09-21 1995-04-04 Three Bond Co Ltd 光硬化性シリコーンゲルを用いたシール方法
JPH10169780A (ja) * 1996-12-05 1998-06-26 Shin Etsu Polymer Co Ltd ゴムパッキンおよびその製造方法
CN1199511A (zh) * 1995-08-23 1998-11-18 雷伊公司 密封组件
JP2007002228A (ja) * 2005-05-25 2007-01-11 Shin Etsu Chem Co Ltd 含フッ素材料
JP2009173837A (ja) * 2008-01-28 2009-08-06 Momentive Performance Materials Inc シリコーンゲル組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050106916A1 (en) * 2003-10-27 2005-05-19 Autonetworks Technologies, Ltd. Connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0788430A (ja) * 1993-09-21 1995-04-04 Three Bond Co Ltd 光硬化性シリコーンゲルを用いたシール方法
CN1199511A (zh) * 1995-08-23 1998-11-18 雷伊公司 密封组件
JPH10169780A (ja) * 1996-12-05 1998-06-26 Shin Etsu Polymer Co Ltd ゴムパッキンおよびその製造方法
JP2007002228A (ja) * 2005-05-25 2007-01-11 Shin Etsu Chem Co Ltd 含フッ素材料
JP2009173837A (ja) * 2008-01-28 2009-08-06 Momentive Performance Materials Inc シリコーンゲル組成物

Also Published As

Publication number Publication date
JPWO2012161099A1 (ja) 2014-07-31
CN103635725A (zh) 2014-03-12
JP6101911B2 (ja) 2017-03-29
WO2012161099A1 (ja) 2012-11-29

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PB01 Publication
PB01 Publication
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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Saitama Prefecture, Japan

Patentee after: Jishui Baoli Ma Technology Co., Ltd.

Address before: Saitama Prefecture, Japan

Patentee before: Polymatech Japan Co Ltd

CP01 Change in the name or title of a patent holder