CN103455219A - Capacitive touch panel unit - Google Patents
Capacitive touch panel unit Download PDFInfo
- Publication number
- CN103455219A CN103455219A CN2012105920133A CN201210592013A CN103455219A CN 103455219 A CN103455219 A CN 103455219A CN 2012105920133 A CN2012105920133 A CN 2012105920133A CN 201210592013 A CN201210592013 A CN 201210592013A CN 103455219 A CN103455219 A CN 103455219A
- Authority
- CN
- China
- Prior art keywords
- arbitrary
- control panel
- conductive layer
- capacitance type
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 16
- -1 polyethylene terephthalate Polymers 0.000 claims description 16
- 239000004743 Polypropylene Substances 0.000 claims description 8
- 239000004793 Polystyrene Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 8
- 239000004800 polyvinyl chloride Substances 0.000 claims description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 229920002223 polystyrene Polymers 0.000 claims description 6
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910004205 SiNX Inorganic materials 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims 8
- 230000001681 protective effect Effects 0.000 claims 5
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 claims 2
- 125000004122 cyclic group Chemical group 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 abstract description 46
- 239000000758 substrate Substances 0.000 abstract description 35
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 239000011241 protective layer Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 5
- 239000004698 Polyethylene Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000006072 paste Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000012994 photoredox catalyst Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Position Input By Displaying (AREA)
- Laminated Bodies (AREA)
Abstract
Description
技术领域technical field
本发明是有关于一种电容式触控面板单元,尤指一种兼具有大幅减少厚度及降低生产成本的效果的电容式触控面板单元。The present invention relates to a capacitive touch panel unit, in particular to a capacitive touch panel unit with the effects of greatly reducing thickness and reducing production cost.
背景技术Background technique
随着资讯技术与通讯网路的迅速发展,电子资讯产品渐渐普及于个人,相对的触控面板也同时迅速发展,现今触控面板依其感应原理的不同,主要区分为电阻式、电容式、电磁式以及光学式等四种,其中电容式触碰面板结构具防尘、防火以及高解析度等特性,因而广泛地被采用,该电容式触控面板作用原理,主要是依据电容量变化来确认接触点位置,利用触控物(如手指等导体)的接近对电极间产生电容性的电性变化,而确定接触点的座标。With the rapid development of information technology and communication networks, electronic information products are gradually popularized by individuals, and the corresponding touch panels are also developing rapidly. Today, touch panels are mainly divided into resistive, capacitive, and electromagnetic based on their different sensing principles. Type and optical type, etc., among them, the capacitive touch panel structure has the characteristics of dustproof, fireproof and high resolution, so it is widely used. The working principle of the capacitive touch panel is mainly confirmed by the change of capacitance. For the position of the contact point, the coordinates of the contact point are determined by using the proximity of the touch object (such as a conductor such as a finger) to generate a capacitive electrical change between the electrodes.
电容式触控面板已渐渐的成为触控技术中的主流,并应用在各项电子资讯产品当中,例如手机、平板电脑、随身听、手持式电子装置(设备)、各种显示器、监视器等等,所述电容式触控面板的电子资讯产品其原理为应用感应人体微弱电流所形成的电容值变化的方式来达到触控的目的,进而测得手指的位置变化与点选状况,与达成操控的目的。Capacitive touch panels have gradually become the mainstream of touch technology and are used in various electronic information products, such as mobile phones, tablet computers, walkmans, handheld electronic devices (equipment), various displays, monitors, etc. etc. The principle of the electronic information product of the capacitive touch panel is to use the method of sensing the change of the capacitance value formed by the weak current of the human body to achieve the purpose of touch control, and then measure the position change and click status of the finger, and achieve purpose of manipulation.
而一般电容式的触控面板主要应用为双层式触控面板,其双层式触控面板均于各透明导电基板上进行多道网版印刷制程或黄光蚀刻制程有可相互对应配合的氧化铟锡(ITO)层,该类透明导电基板的材质多为玻璃,由于透明导电基板单价高,制造时会重复耗费较多的生产材料,当触控面板制程中产生不良品时,必须将整个触控面板报废,且无法回收,进而造成成本浪费,更且各透明导电基板需分别进行有所述氧化铟锡(ITO)层,而其进行多道网版印刷制程或黄光蚀刻制程且对应时其制造步骤繁琐与制造成本同时大幅提升,又且其双层式的触控面板亦会使电子装置的整体厚度增加,无法满足可携式电子装置轻薄短小的需求,因此整体厚度较厚等缺点势必需要有所改良;故公知技术具有下列缺点:The general capacitive touch panel is mainly used as a double-layer touch panel, and the double-layer touch panel performs multiple screen printing processes or yellow photolithography processes on each transparent conductive substrate, which can be matched with each other. Indium tin oxide (ITO) layer, the material of this kind of transparent conductive substrate is mostly glass, due to the high unit price of transparent conductive substrate, it will consume a lot of production materials repeatedly during manufacture, when defective products are produced during the touch panel manufacturing process, it must be The entire touch panel is scrapped and cannot be recycled, resulting in waste of cost. Moreover, each transparent conductive substrate needs to be respectively provided with the above-mentioned indium tin oxide (ITO) layer, and it is subjected to multiple screen printing processes or yellow photolithography processes. Correspondingly, its manufacturing steps are cumbersome and the manufacturing cost is greatly increased at the same time, and its double-layer touch panel will also increase the overall thickness of the electronic device, which cannot meet the needs of portable electronic devices. Therefore, the overall thickness is relatively thick Shortcomings such as must need to be improved to some extent; Therefore known technology has following shortcoming:
1.厚度较厚;1. The thickness is thicker;
2.制造繁琐;2. Manufacture is cumbersome;
3.制造成本较高。3. The manufacturing cost is relatively high.
因此,要如何解决上述公用的问题与缺失,即为本案的发明人与从事此行业的相关厂商所亟欲研究改善的方向所在。Therefore, how to solve the above common problems and deficiencies is the direction that the inventors of this case and related manufacturers engaged in this industry want to study and improve.
发明内容Contents of the invention
为此,为解决上述公知技术的缺点,本发明的主要目的,是提供一种减少整体厚度的电容式触控面板单元。Therefore, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a capacitive touch panel unit with reduced overall thickness.
本发明的另一目的,是提供一种可大幅降低制造成本的电容式触控面板单元。Another object of the present invention is to provide a capacitive touch panel unit which can greatly reduce the manufacturing cost.
为达上述目的本发明提供一种电容式触控面板单元,包括:一透明基板、一导电层及一保护层;To achieve the above object, the present invention provides a capacitive touch panel unit, comprising: a transparent substrate, a conductive layer and a protective layer;
所述透明基板具有一第一侧及一相反该第一侧的第二侧;所述导电层披覆于该第二侧上;所述保护层与前述导电层相对透明基板另一侧对应贴合,通过本发明的电容式触控面板单元的设计,俾使有效达到减少导电层设置以降低制造成本及减少整体厚度的效果。The transparent substrate has a first side and a second side opposite to the first side; the conductive layer is covered on the second side; the protective layer is correspondingly attached to the other side of the transparent substrate opposite to the conductive layer In combination, through the design of the capacitive touch panel unit of the present invention, the effect of reducing the arrangement of conductive layers to reduce the manufacturing cost and the overall thickness can be effectively achieved.
附图说明Description of drawings
图1是本发明的较佳实施例的分解剖面示意图;Fig. 1 is a schematic diagram of an exploded cross-section of a preferred embodiment of the present invention;
图2是本发明的较佳实施例的组合剖面示意图;Fig. 2 is a combined sectional schematic view of a preferred embodiment of the present invention;
图3是本发明的第二较佳实施例的组合剖面示意图。Fig. 3 is a combined cross-sectional schematic view of the second preferred embodiment of the present invention.
主要元件符号说明Description of main component symbols
电容式触控面板单元 1Capacitive
透明基板 10
第一侧 101
第二侧 102
遮蔽层 103
导线层 104
软性基板 105
导电胶 106
导电层 11
保护层 12
触控区 2Touch
非触控区 3Non-touch
具体实施方式Detailed ways
本发明的上述目的及其结构与功能上的特性,将依据所附图式的较佳实施例予以说明。The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.
本发明是一种电容式触控面板单元,请参阅图1图及图2所示,显示本发明较佳实施例的分解剖面示意图及组合剖面示意图;该电容式触控面板单元1包括:一透明基板10、一导电层11及一保护层12,其中该透明基板10的材质于该较佳实施以玻璃做说明,但并不局限于此,亦可选择为聚乙烯对苯二甲酸酯(Polyethylene Terephthalate,PET)、聚碳酸酯(Poly Carbonate,PC)、聚乙烯(polyethylene,PE)、聚氯乙烯(Poly Vinyl Chloride,PVC)、聚丙烯(PolyPropylene,PP)、聚苯乙烯(Poly Styrene,PS)、聚甲基丙烯酸甲酯(Polymethylmethacrylate,PMMA)、环烯烃共聚物(cyclo olefin coplymer,COC)其中任一材质。The present invention is a capacitive touch panel unit, please refer to Fig. 1 and Fig. 2, which show a schematic diagram of an exploded section and a schematic diagram of a combined section of a preferred embodiment of the present invention; the capacitive
另者前述透明基板10具有一第一侧101及一相反该第一侧的第二侧102,所述导电层11设置在该第二侧102上,且其材质为铟锡氧化物(Indium TinOxide,ITO)或锑锡氧化物(Antimony Tin Oxide,ATO)或铟锌氧化物(indiumzinc oxide,IZO)薄膜;并所述导电层11于该较佳实施例以溅镀的方式形成在该第二侧102上,但并不局限于此,于具体实施时,亦可选择以涂布凝胶、电镀或蒸镀的方式形成在该第二侧102上,合先陈明。In addition, the aforementioned
续参阅图1及图2,所述保护层12对应贴合在该导电层11相对透明基板10另一侧,且其材质为氮化硅(SiNx)、二氧化硅(SiO2)、碳化硅(SiC)其中任一;并所述保护层12于该较佳实施例以涂布凝胶、电镀、蒸镀、沉积或溅镀其中任一的方式所形成的薄膜结构在该导电层11相对透明基板10另一侧并披覆保护。1 and 2, the
另请参阅图3为本发明电容式触控面板结构第二较佳实施例的组合剖面示意图,如图所示,所述电容式触控面板结构包括有一透明基板10、一遮蔽层103、一导电层11、一导线层104、一软性基板105及一保护层12;Please also refer to FIG. 3, which is a combined cross-sectional schematic diagram of a second preferred embodiment of the capacitive touch panel structure of the present invention. As shown in the figure, the capacitive touch panel structure includes a
所述透明基板10具有一第一侧101及一第二侧102,且该透明基板10于中央位置处界定有一触控区2与侧边位置处界定有一非触控区3,其中该透明基板10的材质于该较佳实施以玻璃做说明,但并不局限于此,亦可选择为聚乙烯对苯二甲酸酯(Polyethylene Terephthalate,PET)、聚碳酸酯(PolyCarbonate,PC)、聚乙烯(polyethylene,PE)、聚氯乙烯(Poly Vinyl Chloride,PVC)、聚丙烯(Poly Propylene,PP)、聚苯乙烯(Poly Styrene,PS)、聚甲基丙烯酸甲酯(Polymethylmethacrylate,PMMA)、环烯烃共聚物(cyclo olefincoplymer,COC)其中任一材质。The
而该遮蔽层103设置于所述透明基板10的第二侧102且相对设置于其非触控区3位置处,而该透明基板10的上披覆有所述遮蔽层103的区域界定为所述非触控区3,反之,该透明基板10之上未披覆有所述遮蔽层103的区域界定为所述触控区2,而本实施例的遮蔽层103可例如是采用不透明(透光)且绝缘的材料印刷或涂布而成。The
而该导电层11披覆于所述透明基板10的第二侧102位置处且相对设置于其触控区2位置处,而部分的导电层11由第二侧102位置处延伸至所述遮蔽层103相对该透明基板10另一侧位置处,且其材质为铟锡氧化物(IndiumTin Oxide,ITO)或锑锡氧化物(Antimony Tin Oxide,ATO)或铟锌氧化物(indiumzinc oxide,IZO)薄膜;并所述导电层11于该较佳实施例以溅镀的方式形成在该第二侧102上,但并不局限于此,于具体实施时,亦可选择以涂布凝胶、电镀或蒸镀的方式形成在该第二侧102上,合先陈明。The
而该导线层104设置于所述非触控区3且相对设置于所述遮蔽层103相反该第二侧102的一侧,而部分的导线层104同时延伸至所述导电层11相对该遮蔽层103另一侧位置处且与所述导电层11电性连接,且该导线层104可为银浆或铜或钼等金属材质构成。And the
而该软性基板105设置于所述非触控区3,且该软性基板105与导线层104间具有一导电胶106,该导电胶106一侧贴附有所述软性基板105,另一侧贴附有所述导线层104,而该导电胶106为异方性导电膜(AnisotropicConductive Film,ACF)或异方向性导电胶106(Anisotropic conductive paste,ACP)。The
而该保护层12与所述导电层11相对透明基板10另一侧对应贴合,另言之,其保护层12对应贴合在该导电层11相对透明基板10另一侧,且其材质为氮化硅(SiNx)、二氧化硅(SiO2)、碳化硅(SiC)其中任一;并所述保护层12于该较佳实施例以涂布凝胶、电镀、蒸镀、沉积或溅镀其中任一的方式所形成的薄膜结构在该导电层11相对透明基板10另一侧并披覆保护,并该保护层12同时披覆于软性基板105及导线层104相对透明基板10另一侧并披覆保护。The
故本发明的电容式触控面板单元1设计可以单一导电层11进行侦测与完成触控的目的,以达到可减少导电层11设置与降低制造成本的功效,并同时利用其为薄膜结构成形的保护层12达到减少整体厚度的效果。Therefore, the design of the capacitive
以上所述,本发明相较于公知技术具有下列的优点:As described above, the present invention has the following advantages compared to known technologies:
1.减少整体厚度;1. Reduce the overall thickness;
2.制造步骤简单;2. The manufacturing steps are simple;
3.制造成本较低。3. Low manufacturing cost.
按,以上所述,仅为本发明的较佳具体实施例,惟本发明的特征并不局限于此,任何熟悉该项技艺者在本发明领域内,可轻易思及的变化或修饰,皆应涵盖在以下本发明的申请专利范围中。According to, the above description is only a preferred embodiment of the present invention, but the features of the present invention are not limited thereto, and any changes or modifications that can be easily conceived by those skilled in the art within the field of the present invention are all Should be covered in the scope of patent application of the present invention below.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105920133A CN103455219A (en) | 2012-05-29 | 2012-12-29 | Capacitive touch panel unit |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210172834 | 2012-05-29 | ||
| CN201210172834.1 | 2012-05-29 | ||
| CN2012105920133A CN103455219A (en) | 2012-05-29 | 2012-12-29 | Capacitive touch panel unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103455219A true CN103455219A (en) | 2013-12-18 |
Family
ID=48898278
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220748255 Expired - Fee Related CN203117951U (en) | 2012-05-29 | 2012-12-29 | Capacitive touch panel unit |
| CN2012105920133A Pending CN103455219A (en) | 2012-05-29 | 2012-12-29 | Capacitive touch panel unit |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220748255 Expired - Fee Related CN203117951U (en) | 2012-05-29 | 2012-12-29 | Capacitive touch panel unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN203117951U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105630222A (en) * | 2014-11-27 | 2016-06-01 | 林志忠 | Touch panel with fingerprint identification function |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203117951U (en) * | 2012-05-29 | 2013-08-07 | 林志忠 | Capacitive touch panel unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200935277A (en) * | 2008-02-05 | 2009-08-16 | Au Optronics Corp | Sensing structure of a display |
| TWM414616U (en) * | 2010-11-09 | 2011-10-21 | Tpk Touch Solutions Inc | Touch panel stackup |
| CN202217245U (en) * | 2011-08-17 | 2012-05-09 | 宸鸿科技(厦门)有限公司 | Touch control panel |
| CN203117951U (en) * | 2012-05-29 | 2013-08-07 | 林志忠 | Capacitive touch panel unit |
-
2012
- 2012-12-29 CN CN 201220748255 patent/CN203117951U/en not_active Expired - Fee Related
- 2012-12-29 CN CN2012105920133A patent/CN103455219A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200935277A (en) * | 2008-02-05 | 2009-08-16 | Au Optronics Corp | Sensing structure of a display |
| TWM414616U (en) * | 2010-11-09 | 2011-10-21 | Tpk Touch Solutions Inc | Touch panel stackup |
| CN202217245U (en) * | 2011-08-17 | 2012-05-09 | 宸鸿科技(厦门)有限公司 | Touch control panel |
| CN203117951U (en) * | 2012-05-29 | 2013-08-07 | 林志忠 | Capacitive touch panel unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105630222A (en) * | 2014-11-27 | 2016-06-01 | 林志忠 | Touch panel with fingerprint identification function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN203117951U (en) | 2013-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI502429B (en) | Touch-control display and fabrication method thereof | |
| JP2009146373A (en) | Hybrid touch panel and method making thereof | |
| CN103713763A (en) | Touch panel and manufacturing method thereof | |
| CN101320309A (en) | Single-layer touch sensing structure and touch display panel using same | |
| JP3190211U (en) | Touch device | |
| CN104571733A (en) | Touch panel | |
| CN101464743B (en) | Hybrid touch panel and method for forming the same | |
| JP2015018532A (en) | Touch sensor | |
| TWI474385B (en) | Abstract of the disclosure | |
| TWI486859B (en) | Capacitive touch panel structure | |
| JP3178844U (en) | Touch control unit | |
| TWM443227U (en) | Touch panel | |
| TW201335819A (en) | Touch device | |
| CN103885649A (en) | Touch module | |
| US8987625B2 (en) | Capacitive touch panel structure | |
| CN202995696U (en) | Capacitive Touch Panel Structure | |
| CN103455219A (en) | Capacitive touch panel unit | |
| TWI486857B (en) | Touch module | |
| CN202548810U (en) | Touch control device | |
| US20150103261A1 (en) | Touch panel and manufacturing method thereof | |
| US8816233B2 (en) | Capacitive touch panel unit | |
| CN204203938U (en) | Touch panel structure | |
| CN202948434U (en) | Touch module | |
| CN103257765A (en) | Capacitive touch control unit | |
| CN103257764A (en) | capacitive touch device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131218 |