CN103019428A - touch panel - Google Patents
touch panel Download PDFInfo
- Publication number
- CN103019428A CN103019428A CN2011103016737A CN201110301673A CN103019428A CN 103019428 A CN103019428 A CN 103019428A CN 2011103016737 A CN2011103016737 A CN 2011103016737A CN 201110301673 A CN201110301673 A CN 201110301673A CN 103019428 A CN103019428 A CN 103019428A
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- CN
- China
- Prior art keywords
- parallel
- section
- touch panel
- wire
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000008878 coupling Effects 0.000 claims abstract description 8
- 238000010168 coupling process Methods 0.000 claims abstract description 8
- 238000005859 coupling reaction Methods 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 abstract 1
- 230000006698 induction Effects 0.000 description 25
- 238000009413 insulation Methods 0.000 description 18
- 230000001939 inductive effect Effects 0.000 description 8
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Landscapes
- Position Input By Displaying (AREA)
Abstract
一种触控面板，包含一基板、一感应层、多条第一导线及第二导线，该基板具有一包括一第一侧边、一第二侧边以及一感测区域的上表面，该感应层包括多个排列于该第一侧边的并联部、至少两个自该并联部延伸的第一感应部以及多个自该第二侧边向该第一侧边延伸且与该第一感应部交错排列的第二感应部，该第一感应部具有一第一耦接端，该第一导线与该第二导线分别电性连接该第一耦接端以及该第二耦接端至一电路板。藉此，该并联部并联该第一感应部，并与该第一导线及该电路板形成一封闭回路，达到降低阻抗的功效以及减少输出信号的导线数量。
A touch panel includes a substrate, a sensing layer, a plurality of first wires and a second wire, the substrate having an upper surface including a first side, a second side and a sensing area, the sensing layer including a plurality of parallel parts arranged on the first side, at least two first sensing parts extending from the parallel parts and a plurality of second sensing parts extending from the second side to the first side and arranged alternately with the first sensing parts, the first sensing part having a first coupling end, the first wire and the second wire electrically connecting the first coupling end and the second coupling end to a circuit board respectively. Thus, the parallel part is connected in parallel with the first sensing part and forms a closed loop with the first wire and the circuit board, so as to achieve the effect of reducing impedance and reducing the number of wires of the output signal.
Description
Technical field
The present invention relates to a kind of contact panel, espespecially a kind ofly fall low-impedance capacitance type touch-control panel.
Background technology
Contact panel can be divided into resistance-type, condenser type, infrared-type, ultrasonic formula etc. according to the sensing principle, wherein has dustproof, scratch resistant and high-resolution advantage because of capacitance type touch-control panel, gradually be the main flow of consumer electronic product on the market, such as common mobile communication device, digital media device, panel computer etc.And along with scientific and technical innovation, the more convergence hommization of the use-pattern of contact panel, the better sensitivity of reaction, external form have more the design sense, so contact panel has been widely used in daily life.
Known capacitance type touch-control panel, disclose No. 200937270 such as the TaiWan, China patent of invention, disclose a kind of touch-control sensor of display screen of electronic installation, this touch-control sensor comprises that one forms the transparent conductive material layer on the transparency carrier, one prolongation input pad in this transparent conductive material layer, and one coupling this prolong input pad to the contact element of a processor, wherein this prolongation input pad comes to a point gradually and an input pad electric capacity is provided from the narrow end of a wide end to, make an electric capacity change to judge the position by touching this prolongation input pad, transmitted again indication to a processor of capacitance variations by this contact element, make this processor produce relative response.
Because the high touch-control sensor of resolution, this prolongation input pad number that institute must use will increase and increase with resolution, and so that the drive signal line of processor is not enough, and the increase of prolongation input pad so that resistance value relatively increase.
Summary of the invention
Fundamental purpose of the present invention is to solve known capacitance type touch-control panel, because of the inductive means quantity increase of induction touch-control, so that the problem that provides the number of conductors of induced signal transmission relatively to increase, and the resistance value of reduction inductive means.
For reaching above-mentioned purpose, the invention provides a kind of contact panel, include: a substrate, have a upper surface, the sensing region between this first side and this second side is located in the second side and that this upper surface has a first side, relative this first side; One inductive layer, comprise a plurality of sections in parallel that are arranged in this first side, at least two from this parallel connection section extend to this second side and be positioned at this sensing region the first induction part and a plurality of extend to this first side from this second side and be positioned at this sensing region and with staggered the second induction part of this first induction part, this first induction part has one and couples end away from first of this first connecting portion; And many first wires and many second wires, this first wire and this second wire be electrically connected respectively this first couple the end and this second connecting portion to a circuit board.
As known from the above, the present invention is compared to the accessible beneficial effect of prior art:
1, form a loop by this parallel connection section, this first induction part, this first wire and this circuit board, so that the impedance of current signal reduction, and the usefulness of the transmission of signal of lifting sensing.
2, make this first induction part in parallel by this parallel connection section, form a loop by this first wire and this circuit board again, and reduce in order to export the wire of induced signal.
Description of drawings
Fig. 1 is the structural representation of contact panel the first embodiment of the present invention.
Fig. 2 is the solid assembling synoptic diagram of contact panel the first embodiment of the present invention.
Fig. 3 is the vertical view of contact panel the first embodiment of the present invention.
Fig. 4 is the structural representation of contact panel the second embodiment of the present invention.
Fig. 5 is the vertical view of contact panel the second embodiment of the present invention.
Fig. 6 is the structural representation of contact panel the 3rd embodiment of the present invention.
Fig. 7 is the vertical view of contact panel the 3rd embodiment of the present invention.
[diagrammatical symbol explanation]
10: substrate
11: upper surface
12: the first side
13: the second side
14: sensing region
20: inductive layer
21: section in parallel
22: the first induction parts
Couple end at 221: the first
23: the second induction parts
Couple end at 231: the second
30: protective seam
40: insulation course
50: circuit board
60: the first wires
61: the first linkage sections
62: the first extensions
63: the first sections in parallel
70: the second wires
71: the second linkage sections
72: the second extensions
73: the second sections in parallel
Embodiment
Relevant detailed description of the present invention and technology contents now just cooperate graphic being described as follows:
Please consult first Fig. 1 to Fig. 3; be respectively the structural representation of contact panel the first embodiment of the present invention; three-dimensional assembling synoptic diagram and vertical view; this contact panel comprises a substrate 10; one inductive layer 20; one protective seam 30; one insulation course 40; one circuit board 50 and many first wires 60 and many second wires 70; this substrate 10 is oppositely arranged with this protective seam 30; this substrate 10 has a upper surface 11; this upper surface 11 is in the face of this protective seam 30, and wherein this upper surface 11 comprises a first side 12; the second side 13 and one of one relative this first side 12 places the sensing region 14 between this first side 12 and this second side 13.This inductive layer 20 is located at this sensing region 14, and this inductive layer 20 comprises that one arranges the section in parallel 21 of this first side 12, at least two the first induction part 22 and a plurality of the second induction parts 23 that extended to this first side 12 by this second side 13 that extend to this second side 13 from this parallel connection section 21, wherein, this parallel connection section 21 makes at least two these the first induction part 22 parallel connections, and the resistance value of this first induction part 22 is reduced.In present embodiment, this first induction part 22 illustrates for the use triangle as an example with this second induction part 23, yet the present invention is not limited to this, and according to practical application request, this first induction part 22 also can be other shapes with this second induction part 23, such as strip.
This first induction part 22 have one away from first of this parallel connection section 21 couple the end 221, this second induction part 23 have one away from second of this first side 12 couple the end 231, one end of this first wire 60 be electrically connected this first couple the end 221, the other end then is electrically connected this circuit board 50, one end of this second wire 70 connect this second couple the end 231, the other end then is electrically connected this circuit board 50.At present embodiment, this insulation course 40 is located between this first wire 60 and this second wire 70, this first wire 60 comprises this first the first extension 62 and at least one first in parallel section 63 of being electrically connected between this first linkage section 61 and this first extension 62 that couples end the first linkage section 61 of 221, this circuit board 50 of at least one electric connection of a plurality of electric connections, wherein, this first section 63 in parallel is connected in parallel to each other at least two these the first linkage sections 61 and this first extension 62; And, this second wire 70 comprises the second extension 72 and at least one second section 73 in parallel that is electrically connected between this second linkage section 71 and this second extension 72 of the second linkage section 71 of this second induction part 23 of a plurality of electric connections, this circuit board 50 of at least one electric connection, this second section 73 in parallel is connected in parallel to each other at least two these the second linkage sections 71 and this second extension 72, as shown in Figure 3, two these the first induction parts 22 form parallel connection by this first linkage section 61, and two these the second induction parts 23 form in parallel by this second linkage section 71.In contact panel the first embodiment of the present invention, second in parallel section 73 second side 13 of being located at this substrate 10 of this second linkage section 71 and this, and this circuit board 50 is located in this second extension 72, this insulation course 40 is covered in this second linkage section 71 and this second section 73 in parallel again, and, this first linkage section 61 strides across this insulation course 40 and extends to this circuit board 50, and this first extension 62 and this first section 63 in parallel are located at this circuit board 50.
Except above-mentioned, this the first linkage section 61 can be located at this substrate 10, this insulation course 40 covers this first linkage section 61, and this circuit board 50 is located in this first section 63 in parallel, this first extension 62, and this second linkage section 71 is located on this insulation course 40 with this second section 73 in parallel, and this circuit board 50 is located in this second extension 72.Also this first linkage section 61 and this first section 63 in parallel can be located at this substrate 10, and this insulation course 40 covers this first linkage section 61 and this first section 63 in parallel, and this circuit board 50 is located in this first extension 62, and this second linkage section 71 strides across this insulation course 40, and this second section 73 in parallel, this second extension 72 are located at this circuit board 50.Also this first linkage section 61 and this first section 63 in parallel can be located on this insulation course 40, and this circuit board 50 is located in this first extension 62, and this second linkage section 71 is located at this substrate 10, and this insulation course 40 covers these second linkage sections 71, and this second section 73 in parallel, this second extension 72 are located at this circuit board 50.
Please continue to consult Fig. 4 to Fig. 5, be respectively structural representation and the vertical view of contact panel the second embodiment of the present invention, in present embodiment, second in parallel section 73 second side 13 of being located at this substrate 10 of this second linkage section 71 and this, this circuit board 50 is located in this second extension 72, this insulation course 40 is covered in this second linkage section 71 and this second section 73 in parallel, and this first linkage section 61 is located at this insulation course 40 with this first section 63 in parallel, and this first extension 62 extends to this circuit board 50 from this insulation course 40.Present embodiment is located at this as an example explanation of insulation course 40 with this first linkage section 61 with this first section 63 in parallel, according to the actual design needs, also this first linkage section 61 can be located at the surface of this substrate 10 with this first section 63 in parallel, and this second linkage section 71 is located on this insulation course 40 with this second section 73 in parallel.
See also again Fig. 6 to Fig. 7, be respectively the structure intention of contact panel the 3rd embodiment of the present invention, three-dimensional assembling synoptic diagram and vertical view, in present embodiment, this contact panel does not comprise this insulation course 40, the part of the part of this first linkage section 61 of this first wire 60 and this second linkage section 71 of this second wire 70 all is located at this substrate 10, another part of another part of this first linkage section 61 of this first wire 60 and this second linkage section 71 of this second wire 70 is located at this circuit board 50, and this first extension 62 of this first wire 60, this second extension 72 of this first section 63 in parallel and this second wire 70, this second section 73 in parallel is located at this circuit board 50.Wherein, be short-circuited for avoiding this first wire 60 and this second wire 61 to be positioned at that same plane interferes with each other or connecting each other, another part of this first linkage section 61 embeds in the layer structure of this circuit board 50, and stride across this second section 73 in parallel and with these the first section 63 electric connections in parallel.Present embodiment is imbedded as an example explanation in this circuit board 50 with another part of this first linkage section 61, according to the actual design needs, also this first linkage section 61 can be located at the surface of this circuit board 50, and make another part of this second linkage section 71 imbed in this circuit board 50 and stride across this first linkage section 61.
Among the present invention; the material of this substrate 10 can be glass; polyethylene terephthalate (Polyethylene terephthalate; be called for short PET) or polycarbonate (Polycarbonate; be called for short PC); the material of this protective seam 20 can be glass; polyethylene terephthalate (Polyethyleneterephthalate; be called for short PET) or polycarbonate (Polycarbonate; be called for short PC); and the material of this insulation course 40 can be monox; silicon nitride or polymethylmethacrylate (Poly (methylmethacrylate); be called for short PMMA) etc. insulating material; in addition; this inductive layer 20 can be adopted tin indium oxide (Indium Tin Oxide; be called for short ITO); and can be formed at by sputter (Sputtering) sensing region 14 of this substrate 10; and this first wire 60 and this second wire 70 are conductive material; such as silver; the metal materials such as copper can be by printing (Printing) mode or such as the etched Wet-type etching of gold-tinted; the modes such as the dry-etching of laser-induced thermal etching are formed at this substrate 10.
In sum, the present invention mainly forms electric connection with this circuit board with this first induction part and this second induction part respectively by this first wire and this second wire, and make this parallel connection section, this first induction part, this first wire and this circuit board form a loop, so that the impedance of current signal reduces, reduce and transmit the error that signal produces, and then promote the accuracy of this contact panel sensing, and the number of lead wires that connects processor is reduced.
Below the present invention is described in detail, yet the above only is a preferred embodiment of the present invention, when not limiting scope of the invention process.Be that all equalizations of doing according to claim scope of the present invention change and modify etc., all should still belong in the patent covering scope of the present invention.
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103016737A CN103019428A (en) | 2011-09-27 | 2011-09-27 | touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103016737A CN103019428A (en) | 2011-09-27 | 2011-09-27 | touch panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103019428A true CN103019428A (en) | 2013-04-03 |
Family
ID=47968105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103016737A Pending CN103019428A (en) | 2011-09-27 | 2011-09-27 | touch panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103019428A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI502435B (en) * | 2013-08-12 | 2015-10-01 | Himax Tech Ltd | Touch control display system and routing layout of a touch panel thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297811B1 (en) * | 1999-06-02 | 2001-10-02 | Elo Touchsystems, Inc. | Projective capacitive touchscreen |
| CN101887334A (en) * | 2009-05-15 | 2010-11-17 | 晨星软件研发(深圳)有限公司 | Sensing structure and sensing method of capacitive touch panel |
| WO2010134947A1 (en) * | 2009-05-22 | 2010-11-25 | Tyco Electronics Corporation | System and method for a projected capacitive touchscreen having grouped electrodes |
| US20100295814A1 (en) * | 2009-05-22 | 2010-11-25 | Tyco Electronics Corporation | Electrode configurations for projected capacitive touch screen |
-
2011
- 2011-09-27 CN CN2011103016737A patent/CN103019428A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297811B1 (en) * | 1999-06-02 | 2001-10-02 | Elo Touchsystems, Inc. | Projective capacitive touchscreen |
| CN101887334A (en) * | 2009-05-15 | 2010-11-17 | 晨星软件研发(深圳)有限公司 | Sensing structure and sensing method of capacitive touch panel |
| WO2010134947A1 (en) * | 2009-05-22 | 2010-11-25 | Tyco Electronics Corporation | System and method for a projected capacitive touchscreen having grouped electrodes |
| US20100295814A1 (en) * | 2009-05-22 | 2010-11-25 | Tyco Electronics Corporation | Electrode configurations for projected capacitive touch screen |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI502435B (en) * | 2013-08-12 | 2015-10-01 | Himax Tech Ltd | Touch control display system and routing layout of a touch panel thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130403 |