CN102346867B - Embedded anti-metallic radio frequency identification label - Google Patents
Embedded anti-metallic radio frequency identification label Download PDFInfo
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- CN102346867B CN102346867B CN201010245405.3A CN201010245405A CN102346867B CN 102346867 B CN102346867 B CN 102346867B CN 201010245405 A CN201010245405 A CN 201010245405A CN 102346867 B CN102346867 B CN 102346867B
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- conductor layer
- matrix
- label
- radio frequency
- frequency identification
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
The invention discloses a kind of embedded anti-metallic radio frequency identification label, it comprises the first matrix, first conductor layer, second matrix, second conductor layer, 3rd conductor layer, label chip, via hole, 4th conductor layer, first matrix is above the second matrix, first conductor layer is attached to the upper surface of the first matrix, second conductor layer and the 3rd conductor layer are attached to the upper surface of the second matrix and are positioned at the below of the first matrix, second conductor layer and the 3rd conductor layer are in same plane, label chip is between the second conductor layer and the 3rd conductor layer, second conductor layer, 3rd conductor layer is connected with the 4th conductor layer by via hole, 4th conductor layer is attached to the lower surface of the second matrix.The present invention when not needing additionally to increase absorbing material, can obtain be pasted onto common objects surface condition under close readwrite performance.
Description
Technical field
The present invention relates to a kind of radio-frequency (RF) identification (Radio Frequency Identification, RFID) label, particularly relate to a kind of embedded anti-metallic radio frequency identification label.
Background technology
As everyone knows, restricting one of factor of REID application is to read the RFID tag on metal or liquid object.Ordinary electronic identification label is when pasting metal object, and its reading/writing distance can significantly reduce, and even not can read.This is because when reading tag, the magnetic flux that radio-frequency recognition system produces can in metal surface inductive loop, and the field of eddy current to reader has the opposite effect (Lenz law determines), cause the magnetic field on metal surface to carry out strong decay, cause can not communicating again between reader with label.Metal can cause extra stray capacitance (energy loss that the electromagnet-friction namely caused by metal causes) in addition, causes the off resonance of read write line and label antenna, destroys the performance of radio-frequency recognition system.Final in some frequency range, interference will be formed between label and read write line by the energy that metallic reflection is returned.
In general, between coil and metal surface, insert the isolated material of high permeability, the appearance of eddy current can be avoided in sizable degree.Common solution uses certain division board to come separation tags and metal, and this division board adopts absorbing material, and thickness is generally larger, and may cause easily coming off in the middle of reality uses.In addition due to the characteristic of absorbing material itself, the radiation efficiency of label antenna can decline, and can not obtain the reading performance of same label at common objects surface-stable under equidistant.The method of another kind of anti-metal adopts the dielectric material of high-k ground connection come of the metal be stuck as label antenna to be used, but this kind of method Q value is higher, and bandwidth is narrow, and reading/writing distance is more responsive to frequency change.On the whole, reading tag under the environment that metal object is more, can make actual read-write rate, reading/writing distance and reliability greatly reduce, far below the result drawn under experimental situation.
Summary of the invention
Technical matters to be solved by this invention is to provide a kind of embedded anti-metallic radio frequency identification label, when not needing additionally to increase absorbing material, can obtain be pasted onto common objects surface condition under close readwrite performance.
The present invention solves above-mentioned technical matters by following technical proposals: a kind of embedded anti-metallic radio frequency identification label, it is characterized in that, it comprises the first matrix, first conductor layer, second matrix, second conductor layer, 3rd conductor layer, label chip, via hole, 4th conductor layer, first matrix is above the second matrix, first conductor layer is attached to the upper surface of the first matrix, second conductor layer and the 3rd conductor layer are attached to the upper surface of the second matrix and are positioned at the below of the first matrix, second conductor layer and the 3rd conductor layer are in same plane, label chip is between the second conductor layer and the 3rd conductor layer, second conductor layer, 3rd conductor layer is connected with the 4th conductor layer by via hole, 4th conductor layer is attached to the lower surface of the second matrix.
Preferably, the shape of described first conductor layer, the second conductor layer, the 3rd conductor layer and the 4th conductor layer is all any one in circle, ellipse, polygon and irregular figure.
Preferably, the material of described first conductor layer, the second conductor layer, the 3rd conductor layer and the 4th conductor layer is all any one in the good conductors such as silver, copper, aluminium.
Preferably, described first matrix and the second matrix adopt the pcb board material of specific inductive capacity between 1 ~ 150.
Preferably, the face that described first conductor layer forms with the second conductor layer, the 3rd conductor layer is separated by the first matrix, is separated between the face that the 4th conductor layer and the second conductor layer, the 3rd conductor layer form by the second matrix.
Preferably, described via hole is positioned at one end of the second conductor layer and one end of the 3rd conductor layer.
Preferably, described via hole is positioned at one end of the second conductor layer or one end of the 3rd conductor layer.
Preferably, described via hole is the cylindric through hole that inwall scribbles conducting metal.
Positive progressive effect of the present invention is: UHF (the Ultra High Frequency designed with general employing dipole paster antenna or folded dipole antenna, ultrahigh frequency) RFID tag compares, size of the present invention significantly reduces, thus can be placed into narrow space.The present invention takes the method increasing number of vias and modified hole site to change the inductive component of label antenna to realize the impedance conjugate impedance match of label antenna and tag electronics chip.In addition, different from general anti-metal tag, present invention employs the fractal structure of two matrixes, the method for the performance changing label antenna part can be taked to adjust label antenna, in the middle of adjustment, in label antenna of the present invention, do not need the part adjusted to maintain the original state.The present invention both can paste common objects surface as general UHF RFID tag and use, such as paper, timber, plastic ware etc., also can paste metal object surface to use, such as aluminium sheet, spanner, container shell etc., the maximum read distance of label is substantially constant in both cases.The more important thing is, the present invention can also be embedded into metal surface and use, and still can obtain good maximum read distance.After adopting this mounting means, label be embedded into good the combining together of object, compared with general outstanding installation method, label difficult drop-off of the present invention, thus improve the adaptability of RFID tag to environment for use.In addition, adopt the RFID tag of structure of the present invention, when needing the rigors to reading/writing distance, matrix can adopt pottery, lower-cost PCB (Printed Circuit Board is chosen in general application, printed circuit board (PCB)) sheet material makes, significantly can save design and material cost when producing in enormous quantities, effectively realizing asset management and mark.
Accompanying drawing explanation
Fig. 1 is the perspective view of embedded anti-metallic radio frequency identification label of the present invention.
Fig. 2 is the side structure schematic diagram of embedded anti-metallic radio frequency identification label of the present invention.
Fig. 3 is the structural representation of the second conductor layer and the 3rd conductor layer in the present invention.
Fig. 4 is equivalent circuit diagram of the present invention.
Fig. 5 is the schematic diagram of the reading distance of the present invention when different modes.
Embodiment
Present pre-ferred embodiments is provided, to describe technical scheme of the present invention in detail below in conjunction with accompanying drawing.
In general, the label of embedded anti-metal must have three large condition pacing itemss: the first, and being pasted onto metal surface can normally identify; The second, be embedded into below metal surface and still can read; 3rd, there is waterproof and antidetonation anti-collision capacity, that is have good adaptability to complex environment.
As shown in Figure 1 to Figure 3, embedded anti-metallic radio frequency identification label of the present invention comprises the first matrix 1, first conductor layer 2, second matrix 3, second conductor layer 4, 3rd conductor layer 5, label chip 6, via hole 7, 4th conductor layer 8, first matrix 1 is above the second matrix 3, first conductor layer 2 is attached to the upper surface of the first matrix 1, second conductor layer 4 and the 3rd conductor layer 5 are attached to the upper surface of the second matrix 3 and are positioned at the below of the first matrix 1, second conductor layer 4 and the 3rd conductor layer 5 are in same plane, label chip 6 is between the second conductor layer 4 and the 3rd conductor layer 5, second conductor layer 4, 3rd conductor layer 5 is connected with the 4th conductor layer 8 by via hole 7, 4th conductor layer 8 is attached to the lower surface of the second matrix 3.
First matrix 1 and the second matrix 3 can adopt the pcb board material of specific inductive capacity between 1 ~ 150, and the material of the first matrix 1 and the second matrix 3 can be glass-epoxy or pottery etc.First matrix 1 is different with the thickness of the second matrix 3, and the thickness of the first matrix 1 is less than the thickness of the second matrix 3, the thickness also visual concrete service condition adjustment of the two.The first conductor layer 2 on first matrix 1 is made up of the good conductor (as silver, copper, aluminium etc.) that one deck is thin.The size and dimension of the first conductor layer 2 is not fixing, the resonance frequency of label can be adjusted as required the length and width of conductor layer.The lower surface that first matrix 1 only has upper surface to be covered with the first conductor layer 2, first matrix 1 adopts glue to be connected with the second conductor layer 4 the 3rd conductor layer 5.
The shape of the first conductor layer 2, second conductor layer 4, the 3rd conductor layer 5 and the 4th conductor layer 8 can be any one in circular, oval, polygon and irregular figure.Any one otch in circle, ellipse, polygon and irregular figure can be had in the middle of first conductor layer 2, second conductor layer 4, the 3rd conductor layer 5 and the 4th conductor layer 8.The material of the first conductor layer 2, second conductor layer 4, the 3rd conductor layer 5 and the 4th conductor layer 8 can be any one in the good conductors such as silver, copper, aluminium.
In general, the size of the first conductor layer 2 will be slightly less than the face of the second conductor layer 4 and the 3rd conductor layer 5 composition.The face of the second conductor layer 4 and the 3rd conductor layer 5 composition is positioned on the upper surface of the second matrix 3.Second conductor layer 4 is not be directly connected with the 3rd conductor layer 5, and the second conductor layer 4 is reserved with in the middle of the 3rd conductor layer 5 space being connected label chip 6.At connection label chip place, can, according to binding requirement, have a bit of outstanding.A kind of in the good conductors such as label chip 6 available silver line, copper cash or aluminium is tied on the second conductor layer 4 and the outstanding two ends of the 3rd conductor layer 5.Via hole 7 is positioned at one end of the second conductor layer 4 and one end of the 3rd conductor layer 5, and via hole 7 also can be positioned at one end of the second conductor layer 4 or one end of the 3rd conductor layer 5.Via hole 7 is positioned at the inside of the second matrix 3, and via hole 7 scribbles the cylindric through hole of conducting metal for inwall.The position of via hole 7 is satisfactory for result when the both sides near the second matrix 3 are learnt in test.
The face that first conductor layer 2 and the second conductor layer 4, the 3rd conductor layer 5 form is separated by the first matrix 1, separated by the second matrix 3 between the face that 4th conductor layer 8 and the second conductor layer 4, the 3rd conductor layer 5 form, between these four conductor layers and two matrixes, form the resonant tank with certain resonance frequency.
Composition graphs 4 illustrates principle of work of the present invention.RFID tag of the present invention can be equivalent to LC resonant tank based on microstrip transmission lines theory, as shown in Figure 4.The resonance frequency of this resonant tank is
l in formula
efor the equivalent inductance of resonant tank, C
tfor the equivalent capacity in whole loop, C
t=C
p+ C
g.C
tfor the equivalent capacity formed between the first conductor layer 2 and the second conductor layer 4, the 3rd conductor layer 5.Change the distance between the first conductor layer 2 and the second conductor layer 4, the 3rd conductor layer 5, namely the thickness size of the first matrix 1 can change equivalent capacitance value C
t.Second conductor layer 4 is connected with the 4th conductor layer 8 by the via hole 7 of one end, and the 3rd conductor layer 5 is connected with the 4th conductor layer 8 by the via hole 7 of the other end, and said structure forms equivalent inductance L
e.The position of via hole 7 on conductor layer is different with quantity, and the equivalent inductance value formed is also different.R
pand C
pfor resistance and the electric capacity of adopted label chip, these two values are provided by the production firm of label chip.Because the impedance of the label antenna of this type is all complex impedance, to consider that when making antenna matching conjugate impedance match is to obtain maximum power transfer.The present invention is by rationally changing the length and width that connect label chip section microstrip line, and the size of conductor layer realizes the impedance conjugate impedance match of antenna and label chip.From equivalent electrical circuit aspect, regulate each component values that can regulate in resonant tank exactly, improve label antenna to the collection storage capacity of feeble signal, still can obtain the energy of enough work at farther place chip, thus obtain larger reading/writing distance.
RFID tag of the present invention belongs to passive radio-frequency identification labeled, that is the electromagnetic wave that the energy required for labeling task is all sent from read write line by label antenna obtains.When the resonance frequency in resonant tag loop drops on the RFID frequency range of regulation, label chip just can obtain energy from read write line and enter state of activation, and after label chip activates, the information be stored in label chip will be sent to read write line by radiating surface.For showing anti-metal characteristic of the present invention, through experiment test, as shown in Figure 5, when embedded anti-metallic radio frequency identification label of the present invention is pasted onto metal object surperficial, maximum read distance is 3.9m, Comparatively speaking, when being embedded into metal surface, maximum read distance is 3.7m, when being embedded into the degree of depth of twice label thickness, maximum read distance is 3m.Can find out, after label is embedded into metal, maximum read distance still has 95% of maximum read distance when being placed on metal surface, even if be embedded into the position of the twice degree of depth, is arranged on 77% reading distance in the situation of metal surface in addition.Through comparing, under same test environment, the present invention read apart from this index is two kinds of common similar anti-metal products on market twice more than.The present invention is pasting metal surface, is embedded into the maximum read distance after different depth as shown in Figure 5.Due to the singularity of antenna tag structure, the present invention can overturn 180 ° of uses, and the reading distance that do not have the greatest impact, meanwhile, after upset, can also label chip be protected.
Although the foregoing describe the specific embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, under the prerequisite not deviating from principle of the present invention and essence, various changes or modifications can be made to these embodiments.Therefore, protection scope of the present invention is defined by the appended claims.
Claims (8)
1. an embedded anti-metallic radio frequency identification label, it is characterized in that, it comprises the first matrix, first conductor layer, second matrix, second conductor layer, 3rd conductor layer, label chip, via hole, 4th conductor layer, first matrix is above the second matrix, first conductor layer is attached to the upper surface of the first matrix, second conductor layer and the 3rd conductor layer are attached to the upper surface of the second matrix and are positioned at the below of the first matrix, second conductor layer and the 3rd conductor layer are in same plane, label chip is between the second conductor layer and the 3rd conductor layer, second conductor layer, 3rd conductor layer is connected with the 4th conductor layer by via hole, 4th conductor layer is attached to the lower surface of the second matrix.
2. embedded anti-metallic radio frequency identification label as claimed in claim 1, it is characterized in that, the shape of described first conductor layer, the second conductor layer, the 3rd conductor layer and the 4th conductor layer is all any one in circular, oval, polygon and irregular figure.
3. embedded anti-metallic radio frequency identification label as claimed in claim 1, is characterized in that, the material of described first conductor layer, the second conductor layer, the 3rd conductor layer and the 4th conductor layer is all good conductor, comprises any one in silver, copper, aluminium.
4. embedded anti-metallic radio frequency identification label as claimed in claim 1, is characterized in that, described first matrix and the second matrix adopt the pcb board material of specific inductive capacity between 1 ~ 150.
5. embedded anti-metallic radio frequency identification label as claimed in claim 1, it is characterized in that, the face that described first conductor layer forms with the second conductor layer, the 3rd conductor layer is separated by the first matrix, is separated between the face that the 4th conductor layer and the second conductor layer, the 3rd conductor layer form by the second matrix.
6. embedded anti-metallic radio frequency identification label as claimed in claim 1, it is characterized in that, described via hole is positioned at one end of the second conductor layer and one end of the 3rd conductor layer.
7. embedded anti-metallic radio frequency identification label as claimed in claim 1, it is characterized in that, described via hole is positioned at one end of the second conductor layer or one end of the 3rd conductor layer.
8. embedded anti-metallic radio frequency identification label as claimed in claim 1, it is characterized in that, described via hole is the cylindric through hole that inwall scribbles conducting metal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010245405.3A CN102346867B (en) | 2010-07-30 | 2010-07-30 | Embedded anti-metallic radio frequency identification label |
| PCT/CN2011/075858 WO2012013097A1 (en) | 2010-07-30 | 2011-06-17 | Embedded anti-metal radio frequency identification label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010245405.3A CN102346867B (en) | 2010-07-30 | 2010-07-30 | Embedded anti-metallic radio frequency identification label |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102346867A CN102346867A (en) | 2012-02-08 |
| CN102346867B true CN102346867B (en) | 2015-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010245405.3A Active CN102346867B (en) | 2010-07-30 | 2010-07-30 | Embedded anti-metallic radio frequency identification label |
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| CN (1) | CN102346867B (en) |
| WO (1) | WO2012013097A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104939872B (en) * | 2014-03-31 | 2021-02-02 | 上海数斐信息科技有限公司 | a surgical instrument |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2056239A1 (en) * | 2007-10-29 | 2009-05-06 | China Steel Corporation | Radio frequency identification TAG device for metallic products |
| CN101593866A (en) * | 2009-06-30 | 2009-12-02 | 华南理工大学 | Dielectric Resonant UHF RFID Tag Antenna with T-Type Matching Network |
| CN101777693A (en) * | 2010-03-12 | 2010-07-14 | 浙江大学 | Ultrahigh frequency radio frequency identification anti-metal tag antenna with plane structure |
| CN101785145A (en) * | 2007-09-04 | 2010-07-21 | 三菱电机株式会社 | RFID tags |
-
2010
- 2010-07-30 CN CN201010245405.3A patent/CN102346867B/en active Active
-
2011
- 2011-06-17 WO PCT/CN2011/075858 patent/WO2012013097A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101785145A (en) * | 2007-09-04 | 2010-07-21 | 三菱电机株式会社 | RFID tags |
| EP2056239A1 (en) * | 2007-10-29 | 2009-05-06 | China Steel Corporation | Radio frequency identification TAG device for metallic products |
| CN101593866A (en) * | 2009-06-30 | 2009-12-02 | 华南理工大学 | Dielectric Resonant UHF RFID Tag Antenna with T-Type Matching Network |
| CN101777693A (en) * | 2010-03-12 | 2010-07-14 | 浙江大学 | Ultrahigh frequency radio frequency identification anti-metal tag antenna with plane structure |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012013097A1 (en) | 2012-02-02 |
| CN102346867A (en) | 2012-02-08 |
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Effective date of registration: 20170607 Address after: 200336 room 21, building 641, 3 Tian Shan Road, Shanghai, Changning District, 403 Patentee after: Shanghai Fei Mdt InfoTech Ltd Address before: 200336, room 1, building 198, Lane 813, Tian Shan Road, Shanghai, Changning District Patentee before: Liu Zhijia |
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Effective date of registration: 20180129 Address after: 226000 east side of floor fourth, No. 9, building No. 4, new East Road, Nantong economic and Technological Development Zone, Jiangsu Patentee after: Sai Phi information technology (Nantong) Co., Ltd. Address before: 200336 room 21, building 641, 3 Tian Shan Road, Shanghai, Changning District, 403 Patentee before: Shanghai Fei Mdt InfoTech Ltd |
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