CN101080135A - Damp-proof structure of circuit board - Google Patents

Damp-proof structure of circuit board Download PDF

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Publication number
CN101080135A
CN101080135A CN 200710049331 CN200710049331A CN101080135A CN 101080135 A CN101080135 A CN 101080135A CN 200710049331 CN200710049331 CN 200710049331 CN 200710049331 A CN200710049331 A CN 200710049331A CN 101080135 A CN101080135 A CN 101080135A
Authority
CN
China
Prior art keywords
circuit board
damp
proof
proof structure
electric elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200710049331
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Chinese (zh)
Inventor
曹宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Yuzhongmei Science and Technology Co Ltd
Original Assignee
Chengdu Yuzhongmei Science and Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Yuzhongmei Science and Technology Co Ltd filed Critical Chengdu Yuzhongmei Science and Technology Co Ltd
Priority to CN 200710049331 priority Critical patent/CN101080135A/en
Publication of CN101080135A publication Critical patent/CN101080135A/en
Pending legal-status Critical Current

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Abstract

This invention discloses a moisture-proof structure of a CB, in which, a layer of fine silica sand or glass powder is set and adhered on the surfaces of the CB and electric elements to form a solid isolation layer.

Description

Damp-proof structure of circuit board
Technical field the present invention relates to a kind of circuit board, especially has the circuit board of moisture-proof construction.
The background technology circuit board is a part that often uses in various electrical equipment, the equipment.Circuit board is normally exposed, therefore can be short-circuited under high temperature, high humidity or salt mist environment condition, accident such as electric leakage, causes electrical equipment, device damage, may cause the personal security accident when serious.
Chinese patent CN2165580 number disclosed " bathroom moisture proof telephone " patent (application number: 93211198.X), be the film that is coated with one deck sealing and moistureproof usefulness on the electronical elements surface on the circuit board in the phone support; Can be under any abominable wet environment, guarantee speech quality, and do not influence the normal use of its machine with its machine and time spent.The weak point of this patent is: cover the film of moistureproof usefulness on the electronical elements surface, can only solve problems such as electronic component and electronic component, electronic component and circuit board are short-circuited, electric leakage, can't solve problems such as circuit board is short-circuited, electric leakage.
Chinese patent CN2836067 number disclosed " the LonWorks network intelligence controller of high temperature resistance high humidity, salt air corrosion " patent (application number: 200620070831.7), comprise casing and be arranged on interior circuit board of casing and the electric elements that are arranged on the circuit board, it is characterized in that on the outer surface of casing, being provided with one deck military green acrylic baking paint overcoat, be provided with one deck DJB-823 solid film protective agent overcoat on the surface of circuit board and electric elements; Being provided with of overcoat guaranteed that circuit board has good moisture proof, anti-salt fog and mould proof performance.The weak point of this patent is: the DJB-823 solid film has good Corrosion Protection greasy property and electric property, but inflammable, has therefore increased fire risk.
Summary of the invention purpose of the present invention is exactly that a kind of damp-proof structure of circuit board simple in structure will be provided, and is guaranteeing that circuit board has on the basis of good moisture proof, anti-salt fog and mould proof property, increases fire-retardant fail safe.
In order to achieve the above object, damp-proof structure of circuit board provided by the invention has moisture-proof construction, promptly is provided with thin quartz sand of one deck or glass powder on the surface of circuit board and electric elements; Thin quartz sand or glass powder are bonded in the surface of circuit board and electric elements and form the solid separator.
Damp-proof structure of circuit board provided by the invention compared with prior art has positive effect: thin quartz sand or glass powder are bonded in the surface of circuit board and electric elements and form the solid separator, and be simple in structure, takies volume and the space is little; Guaranteeing that circuit board has on the basis of good moisture proof, anti-salt fog and mould proof property, increase high temperature resistant and fire resistance, be applicable to all circuit boards.
Description of drawings the present invention will be further described in conjunction with the accompanying drawings, please referring to accompanying drawing:
Accompanying drawing 1 expression schematic diagram of the present invention.
Structure shown in the accompanying drawing 1 comprises: electric elements (1), moisture-proof construction (2), circuit board (3).
Embodiment damp-proof structure of circuit board provided by the invention has moisture-proof construction 2, promptly is provided with thin quartz sand of one deck or glass powder on the surface of circuit board 3 and electric elements 1; Thin quartz sand or glass powder are bonded in the surface of circuit board 3 and electric elements 1 and form the solid separator.
Protection range of the present invention relates to all changes form recited above.

Claims (1)

1, a kind of damp-proof structure of circuit board is characterized in that: have moisture-proof construction (2), promptly be provided with thin quartz sand of one deck or glass powder on the surface of circuit board (3) and electric elements (1); Thin quartz sand or glass powder are bonded in the surface of circuit board (3) and electric elements (1) and form the solid separator.
CN 200710049331 2007-06-17 2007-06-17 Damp-proof structure of circuit board Pending CN101080135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200710049331 CN101080135A (en) 2007-06-17 2007-06-17 Damp-proof structure of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200710049331 CN101080135A (en) 2007-06-17 2007-06-17 Damp-proof structure of circuit board

Publications (1)

Publication Number Publication Date
CN101080135A true CN101080135A (en) 2007-11-28

Family

ID=38907286

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200710049331 Pending CN101080135A (en) 2007-06-17 2007-06-17 Damp-proof structure of circuit board

Country Status (1)

Country Link
CN (1) CN101080135A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105361816A (en) * 2014-08-06 2016-03-02 沃维克股份有限公司 Vacuum cleaner with an electric motor for generating suction air and a circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105361816A (en) * 2014-08-06 2016-03-02 沃维克股份有限公司 Vacuum cleaner with an electric motor for generating suction air and a circuit board
CN105361816B (en) * 2014-08-06 2019-11-15 沃维克股份有限公司 Vacuum cleaner with electric motor for generating suction air and circuit board

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication