CN100514619C - Integrated circuit using under-bonding to define die functionality and method of making the same - Google Patents

Abstract

The present invention discloses an integrated circuit and a manufacturing method thereof for defining the function of a die by welding below. The integrated circuit comprises: a die, a substrate, a package and a plurality of pins. The die comprises at least a first function and a second function, and has a plurality of signal bonding pads and at least one switching bonding pad. The die inputs and outputs signals through the signal bonding pads, and the switching bonding pads are used to switch the function of the die. The substrate is used to support the die. The package is used to cover the die and the substrate. One end of the plurality of pins is located in the package and coupled to the signal bonding pad, and the other end is exposed outside the package. The signal bonding pad is connected to the circuit outside the integrated circuit through the pins.

Description

Integrated circuit using underside soldering to define die function and method of making same

technical field

The invention relates to an integrated circuit and a manufacturing method thereof, in particular to an integrated circuit and a method for defining the function of crystal grains by using bottom welding.

Background technique

Referring to FIG. 1 , FIG. 1 is a top view of a semiconductor die. The die 100 contains complex electronic circuits inside, which are used to realize the functions of the die 100 . There are many bonding pads on the surface of the die 100, and the bonding pads 111-122 are connected to the internal electronic circuit, so external signals can be input into the die 100 through the bonding pads 111-122, and the signals generated by the internal electronic circuit can also be Output from bonding pads 111-122. Sometimes, certain bond pads of die 100 are used to define the function of die 100, for example, when bond pad 116 is connected to a low potential, die 10C has the first function, and when bond pad 116 is connected to a high potential , the die 100 has the second function. Such bonding pads are referred to as switching bonding pads herein, so the functions of the die 100 can be defined by inputting different signals to the switching bonding pads.

Referring to FIG. 2 , FIG. 2 is a side view of an integrated circuit (IC). The integrated circuit 200 includes a die 100 , an encapsulation 210 , a substrate 220 , pins 230 , 240 and interconnects 250 , 260 . The substrate 220 is used to support the die 100, and the bonding pads 116, 117 on the die 100 are respectively connected to the pins 240, 230 by interconnectors 260, 250, that is, the die 100 can be connected to the pins 240, 230 Circuitry external to integrated circuit 200 communicates data. As shown in FIG. 1 , in addition to the bonding pads 116 and 117, the die 100 also includes many other bonding pads, and the bonding pads 111-115 and 118-122 are also respectively connected to other pins through other interconnects. . The covering body 210 is used to cover the upper half of the die 100 , the substrate 220 , the interconnectors 250 , 260 and the pins 230 , 240 , and the lower half of the pins 230 , 240 are exposed from the covering body 210 . In some applications, some of the bonding pads 111-122 of the die 100 are used to input and output signals, and some are used to receive control signals, so that the die 100 can generate different functions. For example, assuming that the die 100 has multiple functions, switching between functions is controlled by a control signal, and assuming that the bonding pad 116 is a bonding pad receiving the control signal, and since the bonding pad 116 is connected to the external through the pin 240 Therefore, the control signal can be input to the bonding pad 116 through the pin 240 to define the function of the die 100 . Generally, when the bonding pad 116 receives a low-level voltage signal and a high-level voltage signal, the die 100 will have different functions, and in most cases, after the application circuit of the die 100 is determined, it will not Too much will change, that is, the pin 240 will be connected to a fixed voltage level. However, the number of pins is the key to affecting the packaging cost. If more pins can be saved, the manufacturing cost of the integrated circuit can be reduced.

Contents of the invention

The technical problem to be solved by the present invention is to provide an integrated circuit and its manufacturing method which utilizes the bottom soldering to define the function of the grain.

To achieve the above objectives, the present invention discloses an integrated circuit (IC) that uses down-bond to define the function of a die. The integrated circuit includes: a crystal grain, a base, a covering body and a plurality of pins. The chip includes at least a first function and a second function, and has a plurality of signal bonding pads and at least one switching bonding pad, the chip inputs and outputs signals through the signal bonding pads, and the switching bonding pads are used for switching The function of the die; the base is used to support the die; the encapsulation is used to cover the die and the base; and one end of the plurality of pins is located in the encapsulation and coupled to the signal joint pad, and the other end is exposed outside the encapsulation body, and the signal bonding pad is connected with the circuit outside the integrated circuit through the pin.

The present invention also discloses a manufacturing method of an integrated circuit using soldering below to define the function of a grain, including: providing a base; using the base to carry a die, and the die includes at least a first function and a second function function, and has a plurality of signal bonding pads and at least one switching bonding pad, the chip inputs and outputs signals through the signal bonding pad, and the switching bonding pad is used to switch the function of the chip; connect the signal bonding pad to multiple One end of a pin through which the signal bonding pad is connected to an external circuit of the integrated circuit; a covering body is used to cover the substrate, the die and one end of the pin connected to the signal bonding pad, The other end of the pin is exposed to the covering body.

The bonding pad on the chip of the present invention may not be connected to any pin to define the chip in the first function, and when another function is to be selected, only the bonding pad of the chip needs to be connected using the soldering line below To the substrate, therefore, at least one pin can be saved when the integrated circuit is packaged, reducing the overall cost.

Description of drawings

Fig. 1 is the top view of a semiconductor grain;

Fig. 2 is a side view of an integrated circuit;

Fig. 3 is a side view of the first embodiment of the integrated circuit of the present invention;

FIG. 4 is a side view of a second embodiment of the integrated circuit of the present invention.

100: grain

111～122: Bonding pads

200, 300, 400: integrated circuits

210, 310: cladding body

220: base

230, 240, 340: pins

250, 260, 330: Inline connection

320: Bottom welding connection

Detailed ways

Certain terms are used in the specification and following claims to refer to particular elements. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. This description and the subsequent claims do not use the difference in name as the way to distinguish components, but use the difference in function of the components as the criterion for distinguishing. [Includes] mentioned in the entire specification and subsequent claims is an open term, so it should be interpreted as [includes but not limited to]. In addition, the word [coupling] includes any direct and indirect means of electrical connection. Therefore, if it is described that a first device is coupled to a second device, it means that the first device may be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connection means.

Referring to FIG. 3 , FIG. 3 is a side view of the first embodiment of the integrated circuit of the present invention. The integrated circuit 300 includes a die 100 , an encapsulation 310 , a substrate 220 , pins 340 , an internal wire 330 and a down bond wire 320 . The die 100 is also adhered to the substrate 220. It is assumed that the die 100 has multiple functions, including at least the first function and the second function, and the bonding pads 111-115 and 117-122 on it are used to output signals and The signal bonding pads are used to receive input signals, and the bonding pads 116 are switching bonding pads used to receive control signals to define the functions of the chip 100 . As shown in the figure, the signal bonding pad 117 is connected to the pin 340 of the integrated circuit 300 by the interconnection 330. Through the pin 340, the bonding pad 117 can output the signal generated by the die 100, and can also receive the external signal transmitted to the die. 100 signals. The bonding pads 111-115 and 118-122 are also respectively connected to other pins through other interconnects. The bonding pad 116 is connected to the substrate 220 through the lower solder connection 320 , so that the bonding pad 116 achieves the effect of grounding, so the bonding pad 116 is equivalently connected to a low voltage level. The bonding pad 116 receiving the control signal of the low voltage level means that the die 100 works at the first function, that is, the bonding pad 116 does not need to receive the control signal through a pin. When the user decides the function of the integrated circuit 300 , the function of the die 100 can be defined by connecting the bonding pad 116 to the substrate 220 with the lower bonding wire 320 , so that the packaging pins of the integrated circuit 300 can be saved to reduce the cost. The covering body 310 is used to cover the die 100 , the substrate 220 , the interconnection 330 , the soldering connection 320 below and the upper half of the pin 340 , and the lower half of the pin 340 is exposed from the covering body 310 . In a preferred embodiment of the present invention, the covering body 310 may be a thermosetting plastic sealant or a plastic casing.

Referring to FIG. 4 , FIG. 4 is a side view of the second embodiment of the integrated circuit of the present invention. In the integrated circuit 400, the bonding pad 116 of the die 100 is not connected to any pin or substrate, which means that the voltage level on the bonding pad 116 exhibits a high level state, so that the die 100 works on the second function. .

To sum up, the chip with multiple functions originally needs to receive the control signal through the pin to determine the function of the chip. In the present invention, the bonding pad on the chip can not be connected to any pin to connect the chip The first function is defined, and when another function is selected, it is only necessary to connect the bonding pad of the die to the substrate using the soldering wire below. Therefore, at least one pin can be saved when the integrated circuit is packaged, reducing the overall cost.

Certainly, the present invention also can have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these Corresponding changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (6)

1. An integrated circuit utilizing soldering below to define grain functions, characterized in that it comprises: a base; A chip, disposed on the substrate, at least includes a first function and a second function, the chip has a plurality of signal bonding pads and at least one function defining bonding pad, and the chip is input and connected through the signal bonding pads outputting signals, the function defining bonding pads connected to the substrate via an under-bonding wire, enabling the die to operate in the first function; a coating body, used to cover the die and the substrate; and A plurality of pins, one end of which is located in the encapsulation and coupled to the signal bonding pad, and the other end is exposed outside the encapsulation, the signal bonding pad is connected to the circuit outside the integrated circuit through the pins. 2. The integrated circuit according to claim 1, wherein the encapsulation is a thermosetting plastic encapsulant. 3. The integrated circuit according to claim 1, wherein the covering body is a plastic shell. 4. A method of manufacturing an integrated circuit that utilizes soldering below to define a grain function, characterized in that it includes: provide a base; The substrate is used to carry a chip, the chip includes at least a first function and a second function, and has a plurality of signal bonding pads and at least one function defining bonding pad, and the chip is input and connected through the signal bonding pads. outputting signals, the function defining bonding pads connected to the substrate using an under-bonding wire, enabling the die to operate at the first function; connecting the signal bonding pad to one end of a plurality of pins through which the signal bonding pad is connected to a circuit outside the integrated circuit; A wrapping body is used to cover the substrate, the crystal grain, and one end of the pin connected to the signal pad, so that the other end of the pin is exposed to the wrapping body. 5. The method according to claim 4, wherein the covering body is a thermosetting plastic sealant. 6. The method according to claim 4, wherein the covering body is a plastic casing.

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