AU2502300A - Micromachined device and method of forming the micromachined device - Google Patents

Micromachined device and method of forming the micromachined device

Info

Publication number
AU2502300A
AU2502300A AU25023/00A AU2502300A AU2502300A AU 2502300 A AU2502300 A AU 2502300A AU 25023/00 A AU25023/00 A AU 25023/00A AU 2502300 A AU2502300 A AU 2502300A AU 2502300 A AU2502300 A AU 2502300A
Authority
AU
Australia
Prior art keywords
micromachined device
forming
micromachined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU25023/00A
Inventor
Robert W. Steenberge
William P. Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne Technologies Inc
Original Assignee
Teledyne Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teledyne Industries Inc filed Critical Teledyne Industries Inc
Publication of AU2502300A publication Critical patent/AU2502300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
AU25023/00A 1999-01-12 2000-01-11 Micromachined device and method of forming the micromachined device Abandoned AU2502300A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22838899A 1999-01-12 1999-01-12
US09228388 1999-01-12
PCT/US2000/000670 WO2000042636A2 (en) 1999-01-12 2000-01-11 Micromachined device and method of forming the micromachined device

Publications (1)

Publication Number Publication Date
AU2502300A true AU2502300A (en) 2000-08-01

Family

ID=22856981

Family Applications (1)

Application Number Title Priority Date Filing Date
AU25023/00A Abandoned AU2502300A (en) 1999-01-12 2000-01-11 Micromachined device and method of forming the micromachined device

Country Status (2)

Country Link
AU (1) AU2502300A (en)
WO (1) WO2000042636A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8623709B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of top port surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6465280B1 (en) * 2001-03-07 2002-10-15 Analog Devices, Inc. In-situ cap and method of fabricating same for an integrated circuit device
EP2774390A4 (en) 2011-11-04 2015-07-22 Knowles Electronics Llc INTEGRATED DIELECTRIC MEMBRANE FOR SERVING A BARRIER IN AN ACOUSTIC DEVICE, AND METHOD FOR MANUFACTURING THE SAME
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495597B1 (en) * 1969-10-17 1974-02-07
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
US4352119A (en) * 1979-09-17 1982-09-28 Beckman Instruments, Inc. Electrical device and method for particle entrapment device for an electrical component
US5438305A (en) * 1991-08-12 1995-08-01 Hitachi, Ltd. High frequency module including a flexible substrate
US5422615A (en) * 1992-09-14 1995-06-06 Hitachi, Ltd. High frequency circuit device
CN1166912A (en) * 1995-03-02 1997-12-03 电路元件股份有限公司 A low cost, high performance package for microwave circuits in the up to 90 GHZ frequency range
US5847631A (en) * 1995-10-10 1998-12-08 Georgia Tech Research Corporation Magnetic relay system and method capable of microfabrication production
US5767447A (en) * 1995-12-05 1998-06-16 Lucent Technologies Inc. Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
JP3432982B2 (en) * 1995-12-13 2003-08-04 沖電気工業株式会社 Method for manufacturing surface mount semiconductor device
JP3638173B2 (en) * 1996-03-27 2005-04-13 本田技研工業株式会社 Package for microwave circuit
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package

Also Published As

Publication number Publication date
WO2000042636A3 (en) 2000-09-28
WO2000042636A2 (en) 2000-07-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase