AU2003214818A1 - Method for laser machining a workpiece with laser spot enlargement - Google Patents

Method for laser machining a workpiece with laser spot enlargement

Info

Publication number
AU2003214818A1
AU2003214818A1 AU2003214818A AU2003214818A AU2003214818A1 AU 2003214818 A1 AU2003214818 A1 AU 2003214818A1 AU 2003214818 A AU2003214818 A AU 2003214818A AU 2003214818 A AU2003214818 A AU 2003214818A AU 2003214818 A1 AU2003214818 A1 AU 2003214818A1
Authority
AU
Australia
Prior art keywords
laser
workpiece
spot enlargement
machining
laser spot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003214818A
Inventor
Donald R. Cutler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of AU2003214818A1 publication Critical patent/AU2003214818A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
AU2003214818A 2002-01-11 2003-01-10 Method for laser machining a workpiece with laser spot enlargement Abandoned AU2003214818A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34861302P 2002-01-11 2002-01-11
US60/348,613 2002-01-11
PCT/US2003/000686 WO2003059568A1 (en) 2002-01-11 2003-01-10 Method for laser machining a workpiece with laser spot enlargement

Publications (1)

Publication Number Publication Date
AU2003214818A1 true AU2003214818A1 (en) 2003-07-30

Family

ID=23368777

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003214818A Abandoned AU2003214818A1 (en) 2002-01-11 2003-01-10 Method for laser machining a workpiece with laser spot enlargement

Country Status (9)

Country Link
JP (1) JP4340745B2 (en)
KR (1) KR100982677B1 (en)
CN (1) CN1299873C (en)
AU (1) AU2003214818A1 (en)
CA (1) CA2469520A1 (en)
DE (1) DE10392185T5 (en)
GB (1) GB2397545B (en)
TW (1) TW564196B (en)
WO (1) WO2003059568A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109579690A (en) * 2018-12-04 2019-04-05 天津津航技术物理研究所 A kind of high-precision angular displacement detecting device for fast anti-mirror image stabilization system

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DE102004059721A1 (en) * 2004-12-11 2006-05-04 Carl Baasel Lasertechnik Gmbh & Co. Kg Irrigation hose has several longitudinal discharge openings formed by sectional grooves in hose wall whereby flow limiter is arranged at inside portion of hose
CN100462181C (en) * 2006-10-30 2009-02-18 西安交通大学 Femtosecond laser true three-dimensional micro-nano machining center
US7663269B2 (en) * 2006-12-13 2010-02-16 A-Tech Corporation High bandwidth linear actuator for steering mirror applications
DE102007012815B4 (en) * 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Method and device for forming a die
US20090312859A1 (en) * 2008-06-16 2009-12-17 Electro Scientific Industries, Inc. Modifying entry angles associated with circular tooling actions to improve throughput in part machining
TWI594828B (en) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method
DE102009044316B4 (en) 2009-10-22 2015-04-30 Ewag Ag Method for producing a surface and / or edge on a blank and laser processing device for carrying out the method
US8338745B2 (en) * 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
CN110039173B (en) * 2010-10-22 2021-03-23 伊雷克托科学工业股份有限公司 Laser machining system and method for beam dithering and skiving
CN102069298A (en) * 2010-12-20 2011-05-25 珠海市铭语自动化设备有限公司 Laser cutting system for plates and cutting processing method thereof
CN102566590B (en) * 2011-03-14 2014-03-26 北京国科世纪激光技术有限公司 Intelligent adjusting system and method for optical element
CN103100797B (en) * 2013-01-23 2015-09-09 刘茂珍 Based on laser assisted microprocessing equipment and the method for adaptive optics
WO2014126020A1 (en) * 2013-02-13 2014-08-21 住友化学株式会社 Laser irradiation device and method of manufacturing laminate optical member
GB2511064A (en) 2013-02-21 2014-08-27 M Solv Ltd Method of forming electrode structure for capacitive touch sensor
GB2514084B (en) 2013-02-21 2016-07-27 M-Solv Ltd Method of forming an electrode structure for capacitive touch sensor
JP2016516584A (en) * 2013-03-15 2016-06-09 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Linking beam angle and workpiece movement for taper control
IT201600070259A1 (en) * 2016-07-06 2018-01-06 Adige Spa Process of laser processing of a metal material with control of the position of the optical axis of the laser with respect to a flow of assistance gas, as well as a machine and computer program for carrying out such a process.
CN107876981B (en) * 2017-11-20 2019-08-20 张家港初恒激光科技有限公司 A kind of follow-on laser welding machining workstation
CN112122776A (en) * 2020-09-23 2020-12-25 苏州科韵激光科技有限公司 Nonlinear shape processing system and method based on high-speed rotating reflector
KR102497645B1 (en) * 2021-06-23 2023-02-08 인하대학교 산학협력단 Method of laser machine the mold surface
EP4137263A1 (en) * 2021-08-20 2023-02-22 Bystronic Laser AG Support for a transmissive optical element, laser processing device with such support, and process of adjusting the position of a transmissive optical element using such support
CN113897608A (en) * 2021-10-23 2022-01-07 河南省锅炉压力容器安全检测研究院 A laser surface strengthening processing equipment for valve sealing surface

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JPS54116356A (en) * 1978-03-03 1979-09-10 Hitachi Ltd Welding method by laser
FR2577052B1 (en) * 1985-02-05 1988-09-09 Bertin & Cie METHOD AND DEVICE FOR MOVING THE POINT OF IMPACT OF A LASER BEAM ON A WORKPIECE
ATE152387T1 (en) * 1991-01-17 1997-05-15 United Distillers Plc DYNAMIC LASER MARKING
JPH05209731A (en) * 1992-01-31 1993-08-20 Fanuc Ltd Optical-axis adjusting method for laser robot
JP3060813B2 (en) * 1993-12-28 2000-07-10 トヨタ自動車株式会社 Laser processing equipment
JPH0885866A (en) * 1994-09-16 1996-04-02 Sumitomo Metal Mining Co Ltd Method for manufacturing ITO sintered body
US5751585A (en) * 1995-03-20 1998-05-12 Electro Scientific Industries, Inc. High speed, high accuracy multi-stage tool positioning system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
US6407363B2 (en) * 2000-03-30 2002-06-18 Electro Scientific Industries, Inc. Laser system and method for single press micromachining of multilayer workpieces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109579690A (en) * 2018-12-04 2019-04-05 天津津航技术物理研究所 A kind of high-precision angular displacement detecting device for fast anti-mirror image stabilization system

Also Published As

Publication number Publication date
JP2005532908A (en) 2005-11-04
TW564196B (en) 2003-12-01
TW200301718A (en) 2003-07-16
GB2397545A (en) 2004-07-28
CA2469520A1 (en) 2003-07-24
KR20040073542A (en) 2004-08-19
DE10392185T5 (en) 2004-12-02
GB2397545B (en) 2005-05-11
WO2003059568A1 (en) 2003-07-24
GB0412827D0 (en) 2004-07-14
CN1612793A (en) 2005-05-04
KR100982677B1 (en) 2010-09-17
CN1299873C (en) 2007-02-14
JP4340745B2 (en) 2009-10-07

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase