AU1331001A - Method control system and apparatus for ablating high-density array of vias or indentation in surface of object - Google Patents

Method control system and apparatus for ablating high-density array of vias or indentation in surface of object

Info

Publication number
AU1331001A
AU1331001A AU13310/01A AU1331001A AU1331001A AU 1331001 A AU1331001 A AU 1331001A AU 13310/01 A AU13310/01 A AU 13310/01A AU 1331001 A AU1331001 A AU 1331001A AU 1331001 A AU1331001 A AU 1331001A
Authority
AU
Australia
Prior art keywords
vias
indentation
control system
method control
density array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU13310/01A
Inventor
Todd E. Lizotte
Orest Ohar
Sunny Collar Waters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NanoVia LP
Original Assignee
NanoVia LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/514,084 external-priority patent/US6310701B1/en
Priority claimed from US09/540,366 external-priority patent/US6420675B1/en
Priority claimed from US09/540,367 external-priority patent/US6256121B1/en
Application filed by NanoVia LP filed Critical NanoVia LP
Publication of AU1331001A publication Critical patent/AU1331001A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
AU13310/01A 1999-10-08 2000-10-06 Method control system and apparatus for ablating high-density array of vias or indentation in surface of object Abandoned AU1331001A (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US15847899P 1999-10-08 1999-10-08
US60158478 1999-10-08
US09/514,084 US6310701B1 (en) 1999-10-08 2000-02-28 Method and apparatus for ablating high-density array of vias or indentation in surface of object
US09514084 2000-02-28
US09540367 2000-03-31
US09/540,366 US6420675B1 (en) 1999-10-08 2000-03-31 Control system for ablating high-density array of vias or indentation in surface of object
US09/540,367 US6256121B1 (en) 1999-10-08 2000-03-31 Apparatus for ablating high-density array of vias or indentation in surface of object
US09540366 2000-03-31
PCT/US2000/027896 WO2001027665A1 (en) 1999-10-08 2000-10-06 Method control system and apparatus for ablating high-density array of vias or indentation in surface of object

Publications (1)

Publication Number Publication Date
AU1331001A true AU1331001A (en) 2001-04-23

Family

ID=27496339

Family Applications (1)

Application Number Title Priority Date Filing Date
AU13310/01A Abandoned AU1331001A (en) 1999-10-08 2000-10-06 Method control system and apparatus for ablating high-density array of vias or indentation in surface of object

Country Status (2)

Country Link
AU (1) AU1331001A (en)
WO (1) WO2001027665A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003299532A1 (en) * 2002-08-29 2004-06-03 Identification Dynamics, Llc Method and apparatus for reading firearm microstamping
GB0724057D0 (en) * 2007-12-10 2008-01-23 Gsi Group Ltd Laser processing
CN107252979B (en) * 2017-06-19 2019-07-26 重庆百钰顺科技有限公司 A kind of Complex Different Shape multiposition laser marking device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5293025A (en) * 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
FR2695234B1 (en) * 1992-08-26 1994-11-04 Gemplus Card Int Method of marking a smart card.
US5481407A (en) * 1993-09-14 1996-01-02 Litel Instruments Apparatus and process for using Fresnel zone plate array for processing materials
US5571429A (en) * 1994-02-25 1996-11-05 Litel Instruments Apparatus and process for high speed laminate processing with computer generated holograms
US5509553A (en) * 1994-04-22 1996-04-23 Litel Instruments Direct etch processes for the manufacture of high density multichip modules
US5523543A (en) * 1994-09-09 1996-06-04 Litel Instruments Laser ablation control system and method
US5702662A (en) * 1995-09-29 1997-12-30 Litel Instruments, Inc. Process for ablating high density vias in flexible substrate

Also Published As

Publication number Publication date
WO2001027665A1 (en) 2001-04-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase