JPH03132065A - Electrical connection structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical connection structure for connecting an electronic component such as a liquid crystal display device to a substrate using an IC module.

[Prior Art] Conventionally, as an electrical connection structure for connecting a liquid crystal display device and a driving circuit, there is a structure in which a wiring board on which a driving IC chip is mounted and a liquid crystal display device are directly connected. When the wiring density of a board increases, there is a problem that not only the circuit design becomes extremely complicated, but also the yield rate is poor.

Therefore, recently, as shown in FIG. 3, a structure has been proposed in which a plurality of IC modules 1 are used to connect the liquid crystal display device 2 and the wiring board 3.

In this case, the IC module 1 uses, for example, TAB (Tap).
e Automated Bonding) method, each insulating film 4 is equipped with a driving IC chip 5, and one end of each insulating film 1 (for example,
Connection pads 6... are arranged at one end (lower end), and connection pads 7... are arranged at the other end (lower end) opposing this.
It has an array structure. When connecting the liquid crystal display device 2 and the wiring board 3 using a plurality of IC modules (only two are shown in FIG. 3), the connection pads 6 on the upper end of each IC module 1, l... , 6... are connected to the liquid crystal display device 2, and the connection pads 7..., at the lower end are connected to the liquid crystal display device 2.
7... are arranged on the electrode terminals 8..., 8... of the kQ board 3.
(See Figure 4).

[Problems to be Solved by the Invention] However, in the connection structure described in
- Since the connection pads 6 and 7 are formed at both ends facing each other downward, the wiring board 3 has electrode terminals 8 and 7, as shown in FIG.・must be arranged in a row with the connection part of the liquid crystal display device 2,
Therefore, in order to connect any of the connection pads 7..., 7... of adjacent IC modules 1.1 to phase II:, wiring conductors 9... are formed on the upper and lower surfaces of the wiring board 3. For example, the wiring conductors 9 running in the width direction of the wiring board 3 are provided on the 1st side of the wiring board 3, and the wiring conductors 9 need to be routed so as not to cross each other. Wiring conductors 9 running in the longitudinal direction are provided on the lower surface of the wiring board 3. However, if the wiring conductors 9 are formed on the upper and lower surfaces of the wiring board 3 in this way, these upper and lower wiring conductors 9
. . . must be connected through the through holes 10 . . . Therefore, in such a connection structure, the wiring board 3 is a double-sided & Therefore, there is a problem that the cost is much higher than that of a single-sided wiring board.

In addition, in order to avoid such problems, it is recommended to form the wiring conductors 9 only on one side of the wiring board 3 as described in Section 3.1.
However, in order to make it a single-sided wiring board, the connection pads 7 of the IC module l connected to the wiring board 3...
must be arranged in a direction perpendicular to the arrangement direction of the connection pads 6 connected to the liquid crystal display device 2. Moreover, in order to route the wiring conductors 9 so that they do not cross each other, it may be necessary to run the wiring conductors 9 between the electrode terminals 8 of the wiring board 3. Therefore, the wiring conductor 9 is extremely complicated to route, which not only complicates the design of one circuit, but also increases the size of the entire wiring board 3.

The first objective of this IJI is to make the cost-effective single-sided wiring board n(n), and to make it easy to route the wiring conductors.
The object of the present invention is to provide an electrical connection structure that does not require a large substrate.

[Means for Solving the Problems 1] In order to achieve the above-mentioned object, the present invention connects an electronic component having connection terminals and a substrate on which wiring conductors connecting each electrode terminal are formed on at least one surface. Electrical connection a connecting two IC modules with IC chips
The pads of at least one IC module are arranged on both sides in a direction perpendicular to the connection terminals of the electronic component, and one set of pads is connected to the circuit electrode of the IC chip. , these pads are connected to different pads of another IC module by wiring conductors on the substrate, and another wiring conductor is formed between both wiring conductors.

[Function] In the electrical connection structure of the present invention, since the pads of the IC module are arranged on both sides of the direction perpendicular to the connection terminals of the electronic component, the electrode terminals of the board can be arranged in the same direction. Single-sided wiring board becomes possible. Also, IC
Connect one set of pads arranged on both sides of the module to an IC.
Since these pads are connected to the same electrode on the chip and connected to different pads on other IC modules by wiring conductors on the board, the wiring on the IC module should not cross the wiring conductors on the board. For this reason,
There is no need to route the wiring conductors formed on the board in a complicated manner, and the wiring conductors can be routed very easily even on one side, and other wiring conductors can be formed between the wiring conductors, so the overall board size can be reduced. This makes it possible to create a single-sided wiring board that is advantageous in terms of cost, making it inexpensive.

[Embodiment] An embodiment of the present invention will now be described with reference to FIGS. 1 and 2.

Figure 1 shows the liquid crystal display bag 2111 and the wiring board 12 connected to three I
The IC module 13, which shows the electrical connection structure connected by the C modules 13 to 15, is of the TAB type, and the liquid crystal display bag E!
IC with 111 drive and control circuits
A chip 17 is mounted, and connection pads 18 connected to the connection end f- (not shown) of the liquid crystal display device 11 are arranged at the upper end thereof, and at both left and right ends perpendicular to this, connection pads 18 are arranged. Connection bat P connected to wiring board 12 described later
~P6 and PI = Pl' are arranged. In this case, each of the connection pads P1 to P6 and PI"PI2 is a finger lead bridged to a slit-shaped opening 19.19 formed on both the left and right sides of the insulating film 16, and is insulated through the opening 19.19. sex film 16
The pads are exposed on the other surface (lower surface), and the pitch of the pads is very narrow (for example, about 0.25 m).

Of the connection pads P1 to P6 and P7 to P17, the bottom connection pad P1 on the right side and the bottom connection pad P1 on the left side? is I due to interconnected wiring 20
It is connected to the same electrode (not shown) of the C chip 17. In addition, the connection parameter F'P2 on the right side. P5, P6 and left connection pads PB, Pq, pH, P
I2 is connected to each electrode (not shown) of the IC chip 17 by a wiring 21, respectively. Furthermore, each connection pad P:l, P4. Each Pro is a tummy pad that is not connected to the IC chip 17. Although not shown, the connection pads 18 are connected to other electrodes of the IC chip 17, respectively.

The middle IC module 14 and the left IC module 15 are each equipped with an IC chip 22, 22 having a drive circuit for the liquid crystal display device 11.
It has a different arrangement of connection pads than the C module 13. That is, in the intermediate IC module 14, connection pads P13 to P2o are arranged on the right side, and one connection pad P7. only. Similarly, the IC module 15 on the left side also has connection pads P27 to P2 on the right side.
9 are arranged, and only the connection pad P30 is provided on the left side 1; Note that each of these connection pads PI3 to P
21 and P72 to F3G are all connected to each electrode of the IC chip 22, 22 by wiring 21....

No. 21-4 shows a wiring board 12. This wiring board 12 is a single-sided wiring board made of a strip-shaped insulating film, and has electrode terminals T1 to Too on only one side and an outer end -fs.
+ to S4 are arranged, and these are wiring conductors R1 to R1+
connected by.

゛The upper terminals T1 to T3o are connected to each IC module 13 to 15.
are arranged corresponding to the connection pads pH-P3o.

That is, the electrode terminals T1 to T6 of the first row correspond to the contacts P1 to P6 on the right side of the IC module 13, and the electrode terminals Ty"TB of the second row correspond to the contacts 49 of the IC module 13.
It corresponds to the connection pads P1 to P12 on the left side. Third
The electrode terminals Ti11 to T21 in the column correspond to the connection pads P23 to P21 on the right side of the IC module 14, and the electrode terminal T22 in the fourth column corresponds to the connection pad P22 on the left side of the IC module 14. Similarly, the fifth row of electrode terminals T2
3 to T29 are connection pads P on the right side of the IC module 15.
23 to F29, the electrode terminal T30 in the sixth row is an IC
It corresponds to the connection pad P30 on the left side of the module 15.

Also, although four external terminals 51 to S4 are arranged on the right end side, in reality, a large number are arranged6.For example, the lowest external terminal S1 is a power supply terminal (V oo), and the next external terminal S2 is a ground terminal. (GND), further outside? ! 6 terminal S3
are the liquid crystal drive terminals (Vl, C
D), and the external terminal S4 at the edge serves as a signal input terminal (CPU) into which control signals, data signals, etc. from a CPU (central processing unit) are input. Although there is only one external end fs4 in the figure, there are actually many external ends fs4.

Wiring conductors R1 to R1+ connecting each of these electrode terminals TI -T2O and external terminals S and -s are routed as follows. This wiring conductor R1 to R11
The routing state will be explained in order from the external terminals 51 to 54 side.

The external terminal S1 for power supply is connected to the electrode terminal T1 of the first row by the wiring conductor R1, and the external terminal -52 for ground is connected to the electrode end f T :l of the first row by the wiring conductor R1, and the external terminal S1 for the ground is connected to the electrode terminal f T :l of the first row by the wiring conductor R1. The external terminal S3 for signal is connected to the electrode terminal T4 of the first column by the wiring conductor R1, and the external terminal S4 for signal is connected to the electrode terminal rT6 of the first column by the wiring conductor R1. Further, among the electrode terminals T1 to T6 in the first row, the electrode end f-T1 is connected to the electrode terminal T13 in the third row by a wiring conductor R2, and the electrode terminal T2 is connected to the electrode terminal T in the third row by a wiring conductor R3. connected to the eyes. Electric J41
The end f-T3 is connected to the '1r electrode terminal TIO of the second row and the electrode terminal T15 of the third row by a wiring conductor R4 branched into two. The electrode terminal T4 is also connected to the electrode terminal Tll of the second row and the upper electrode terminal Tlq of the third row by a wiring conductor R5 branched into two. - The electrode terminal T5 is connected to the third row electrode terminal Too by a wiring conductor R6. Furthermore, among the electrode terminals TI”TI2 in the second row,
The electrode terminal T7 is connected to the third row electrode terminal T by the wiring conductor RI.
18, and the electrode terminal T8 is connected to the terminal end Y-T + l of the third column by the wiring conductor R8, and the electrode terminal T8
9 is connected to the third row electrode terminal TI6 by a wiring conductor R9, and the electrode terminal TIG is connected to the second row electrode terminal TI2 by a wiring conductor RIG. Furthermore, the electrode ends 1'-TI 3 to TI'l of the third row are each connected to a wiring conductor R.
1+... makes the fifth row electrode terminal T? '/~T2B, and the fourth column electrode terminal Tel is connected to the fifth column electrode end 1/-T 79 by a wiring conductor R1+.

By the way, -1- the remodeling of the routing of the wiring conductors R1 to R11 mentioned above is that not only do the wiring conductors R1 to R11 not intersect, but also the narrow pitch of the electrode terminals T1-
The goal is to avoid passing between T1. Therefore, from the first row of electrode terminals T1 to T6 to the third row of electrode terminals TI3
The wiring conductors R2 to T20 are routed as follows.

That is, the wiring conductor R2 connecting the lowest electrode terminal T1 of the first row and the upper electrode terminal T13 of the F-most part of the third column is as follows.
The electrode terminals TI and TI3 extend downward from the electrode terminals TI and TI3, are sufficiently spaced from the lower end of the second row of core tips f-Tr to TI2, and are formed along the lower edge of the wiring board 12. Also, the second
Electrode terminal T7 at the bottom of the row and (No. 3 from -) in the third row
The wiring conductor R1 connecting the first electrode terminal TI8 is formed substantially parallel to the wiring conductor R2 mentioned above and at a sufficient distance t from the wiring conductor R2. Therefore, even if the electrode terminals T2, T] are located on the 1- side of the electrode terminals T in the first row, the electrode terminals Ts, Tq are located above the electrode terminals TI in the second row. Also, these electrode terminals T:
, T3 , To , T9 and each electrode terminal T of the third column
) Wiring conductors R3, RaR5, Rq connecting 4 to Tll
are 11'lI& substantially parallel to each other between the wiring conductor R2 and the wiring conductor R) described above without intersecting with each other. In addition, the first row of electrode terminals T4 and the third row of electrode terminals T
Wiring conductor R5 connecting 19 and the first row electrode terminal T
The wiring conductors R6 connecting the electrode terminals T70 of the third row and the electrode terminals T70 of the third row respectively pass above the electrode terminals T7 to TI2 of the second row,
It is also formed along the upper edge of the wiring board 12 . As a result, the wiring conductors R2 to R9 do not intersect with each other, and are routed without passing between the electrode terminals T7 to TI2.

Note that the wiring board 12 is covered with an insulating film (not shown) except for the electrode terminals T1 to T3o and the external terminals 51 to S4.

Next, each connection pad P1-P of each IC module 13-15 is connected to each electrode terminal T-Too of the above-mentioned wiring board 12,
Explanation 11 will be given regarding the state of the wiring that connects the IO.

First, looking at the external terminal FS+, this external terminal S
t is connected to the first row of electrode terminals T1.t by the wiring conductor H on the wiring board 127. Each connection pad P1. P13 and P27 are connected to the 'Iv poles of each IC chip 17, 22, and 22, respectively.

In this case, the connection hat P1 of the IC module 13 on the right side
is connected to the connection pad Pi by a wiring 20 provided on the insulating film 16, and this connection parameter t''P
The electrode terminal TI of the second row to which r is connected is connected to the electrode end fT+8 of the third row by the wiring conductor R7, and is also connected to the electrode end fTx of the fifth row by the wiring conductor R1+. Each connection pad P18, P2t of the middle IC module 14 and the left IC module 15 connects each Icf.
- also connected to the other electrodes of the prongs 22.22, respectively.

That is, the external E r-5+ is connected to the connection pads P1 and Pr connected to one electrode (not shown) of the IC module 13.
By being directly connected to one of the
4.15 Two different connection pads P13, Pus, P22. P'; each I through 17
It is connected to two electrodes of the C-chip 22.22.

Next, looking at the external terminal f-52, this external terminal S
On the wiring board 12 Jl, the wiring conductor H connects the electrode terminal T3 of the first row, the wiring conductor R4 connects the electrode terminal TIO of the second row and the electrode terminal TI5 of the third row, and the wiring conductor RIG connects the electrode terminal 7JSZ. 'Top extreme fT+ of column
2 and the wiring conductor R1+ to connect the fifth terminal electrode end f-T 2
4, the connection para FP3. of the IC module 13 on the right side. Even if Pro is a tummy butt, each connection pad P12, PI of each IC module 13 to 15
8, connected to the electrodes of each IC chip 17.22.22 by P2r.

Also, regarding the external connection terminal S3, this external connection terminal S3 is connected to the first row'IL pole terminal T4. The wiring conductor R5 connects the second row electrode terminal T11 and the third row electrode terminal Tlq, and the wiring conductor RB connects the fifth row electrode terminal T.
Since it is connected to 2B, the IC module 13 on the right side
Even if the connection pad P11 is a gummy pad, each connection pad PI, PIq, P2 of each IC module 13-15
g to the electrodes of each IC chip 17, 22, 22.

Further, the external terminal S4 is connected to the first row of electrode terminals T6 by the wiring conductor R1, and is connected to the electrode of the IC chip 17 by the connection pad P6 of the IC module 13 on the right side. On the other hand, connection pads P2, P5P+, FB, and PQ are connected to this IC chip 17. And the contact point 2x F'P2 is the electrode terminal T? on the Mi distribution board I2? is connected to the third column Tft terminal TI4. by the wiring conductor R3. The fifth row electrode terminal T7 is connected to the wiring conductor R11.
3, each connection pad PI4, P' of the middle IC module 14 and the left IC module 15
3 to the electrodes of each IC chip 22.22.

The connection pad P5 connects the electrode end fT5 of the wiring board 12F to the third row electrode terminal To by the wiring conductor R6.

Therefore, it is connected to the electrode of the IC chip 22 by the connection pad P20 of the intermediate IC module 14. The connection pad PI is the upper terminal TJ of the wiring board 12h.
is connected to the third row electrode end rT! by the wiring conductor R1. 8. Since it is connected to the electrode end FT2r of the fifth column 1 by the wiring conductor R1+, the middle IC module 14 and the left IC
Each connection pad F'+s, P2J of the module 15 is connected to an electrode of each IC chip 2222. Similarly, connection pads P8 and PQ also connect to the intermediate IC module 14.
and each connection pad P+8, P? of the left IC module 15. 1 is connected to the electrode of each IC chip 22.22.

As described above, according to the electrical connection structure described in 1-, the jHM pads P to P6 and P7 to P12 of the right IC module 13 are arranged in the direction perpendicular to the contact t-ZG terminal of the liquid crystal display device 11. , each of the electrode terminals T1 to T30 can be arranged in the rotating direction, and one single-sided wiring board can be arranged in one direction. In particular, since the right connection rose F P + of the right IC module 13 and the left connection pad P1 are connected by the wiring 20 of the IC module l3J2, this wiring 20 is connected to the wiring conductors R2 to R9 of the wiring board 12L. can be crossed against. Therefore, these connection pads PI and PI are connected to the wiring conductor R2R/ of the wiring board 12.
, R1+ connect different connection pads P1 of the middle IC module 14 and the left IC module 15, respectively.
3, PI3, P22. It can be easily connected to P77 inside the cylinder. As a result, the wiring conductors R1 to R on the wiring board 12 are routed very closely in the cylinder. especially,
The above-mentioned connection pad P1 and connection puff)" P l 3
The wiring conductor R2 of the wiring board 12-L: which connects the wiring board 12-L:, and the wiring conductor R1 which connects the connection pad P7 and the connection puff (Pea) can be formed sufficiently apart from each other, so that these wiring conductors R;), R7 Between the other wiring conductors R:l,
Ra, Rs, and Rq can be routed. For this reason, the connection pads P1 to P of each IC module 13 to 15
30 in a direction perpendicular to the connection terminals of the liquid crystal display device 11, there is no need to route the wiring conductors R1, R4, Rs, and Rq between these connection puffs l''P+ to P30, so the wiring (The board 12 does not become large, high precision is not required, and the wiring board 12 can be easily manufactured.

Incidentally, in the above-mentioned electrical connection structure, the dummy connection pads P3Pa and Pro that are not connected to the IC chip 17 in the right IC module 13 are sunk, but the external terminals 52 for ground and liquid crystal drive are , S3
Since the wiring conductors R]R4, Rs, and Rho are formed on the wiring board 127, they are originally unnecessary. However, such dummy connection pads P3, Pa, Pea
If not provided, the corresponding electrode terminals T3, T
Since it is not possible to provide the wiring conductor R1 between the electrode terminals T1 to T6 and T7 to TI2, the pitch is narrow (actually extremely narrow, about 0.1■■).
, R4, Rs, R+o'J must be passed,
However, passing the wiring conductors R1, R4, R5, and R1o caps between the electrode terminals T1 and TI2 in this way not only requires high precision in manufacturing, but also requires protection by providing an insulating film on that part. Therefore, when soldering with a thermocompression jig, etc., the wiring conductors R+, R4, R5
, Rho are adjacent connection pads P7, P5 . 'P9
, P++, which causes problems in connection reliability. Note that if the pitch interval is increased, the entire IC module 13 will become larger. Therefore, by providing the above-mentioned connection puffs FP3, P4, and Pro for the tummy, the corresponding electrode terminals T3.
T4, Too can be provided, thereby eliminating the need to route wiring conductors between electrode terminals T1 to TI7.
Therefore, when bonding the IC module 13, the connection pad P
It is possible to prevent short circuits caused by 1 to PH, it is possible to join easily and reliably, and it is also possible to ensure connection reliability. In addition, such connection pads P3 and Pa for Tammy
, Pr.

By providing a
．． This also makes it easier to route the wiring conductors R1 to R+o.

Note that the present invention is not limited to the embodiments described above. For example, the IC modules 13 to 15 are not limited to the TAB method, but may be manufactured using the wire bonding method or the flip chip method. Moreover, the IC modules 13 to J5 are connected to each electrode terminal T1 to T of the wiring board 12.
As long as only 3G is covered with the insulation 1 pattern, each connection pad P to P30 and the wiring 20, 21... may be formed not only on the −F surface of the insulating film 16 but also on the lower surface. The wiring board 12 does not need to be an insulating film, and may be a hard board made of epoxy resin or the like, and the electronic components are not limited to the liquid crystal display device 11, but may be other components such as a thermal head.

Furthermore, the wiring board 12 may be mounted with a CPU chip.

[Effects of the Invention] As explained in detail above, according to the present invention, since the pads of the IC module are arranged on both sides in the direction perpendicular to the connection terminals of the electronic component, the pads of the IC module are arranged on both sides of the board in the same direction. Electrode terminals can be arranged, which enables a single-sided wiring board. Also, one set of pads arranged on both sides of the IC module is connected to the same electrode of the IC chip, and these pads are connected to different pads of the other IC module by the wiring conductor of the board. Because of this, the wiring on the IC module can be crossed with the wiring conductor on the board.Therefore, there is no need to route the wiring conductor formed on the board in a complicated manner, and even if the wiring conductor is routed on one side, it is very easy to route. Since the wiring conductor can be easily formed and other wiring conductors can be formed between the wiring conductors, the entire board does not need to be large.This makes it possible to create a single-sided wiring board that is advantageous in terms of cost, making it inexpensive.

[Brief explanation of the drawing]

FIG. 1 and FIG. 2 show one embodiment of the present invention.
The figure is a plan view showing the electrical connection structure, Fig. 2 is a plan view of the wiring board, Fig. 3 is a plan view of main parts showing the conventional electrical connection structure, and Fig. 4 is a plan view showing the wiring board. It is. 11...Liquid crystal display device δ, 12...Wiring board,! 3-15...IC module, 17.22...
...■ C chip, 20.21...Wiring, P1 to P30
......Connection barad, ~T30...Electrode terminal, ...Wiring conductor.

Claims (1)

[Claims] An electronic component having a connection terminal and at least one IC
It comprises two IC modules each having a chip, a substrate having electrode terminals connected to each pad of the IC module, and a wiring conductor connecting each electrode terminal formed on one side, and at least one IC module has the above-mentioned Pads are arranged on both sides in the direction orthogonal to the connection terminals of the electronic component, one set of these pads is connected to the same electrode of the IC chip, and these pads are connected to other ICs by wiring conductors on the board. An electrical connection structure characterized in that the wiring conductors are connected to different pads of a module, and another wiring conductor is formed between both wiring conductors.