JP2000216544A - Method of manufacturing multilayer shield plate for metal core BVH - Google Patents

Abstract

(57) [Summary] [Problem] The process is complicated and time-consuming, and the product is expensive, for example, it is necessary to repeat twice a mechanism process of positioning and stacking components while stacking the components. It becomes something. SOLUTION: A step of obtaining a metal core, a step of processing a double-sided copper-clad laminate to obtain a plurality of types of BVH inner layers with a single-sided circuit, and stacking the first prepreg for an insulating layer on both sides of the metal core while positioning, Further layer the second prepreg,
Further, the method includes a step of forming a mechanical product formed by stacking the BVH inner layer plates, and a process of obtaining a multilayer shield plate for a metal core BVH by laminating and forming the mechanical product.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a multilayer shield plate for a metal core BVH (blind via hole) used for mounting an LED display or the like.

[0002]

2. Description of the Related Art A conventional method of manufacturing a multi-layer shield plate for BVH will be described step by step, taking a four-layer shield plate as an example, though not shown. The conventional process is as follows (A)
(A) to (f) in this order.

(A) A metal core is produced by forming through holes for through holes in a later step in a metal plate having both surfaces treated.

(A) Using the above-mentioned metal core, a process is performed according to the following procedures (A) to (A) to obtain a metal core double-sided insulating plate. (A-) A primary structure product is prepared in which copper foil is laminated on both surfaces of the metal core via an inner prepreg for an insulating layer. (A-) The above-mentioned primary structure is heated, pressed and laminated by a press machine to produce a metal core double-sided copper-clad laminate. (A-): After positioning holes are formed through the metal core double-sided copper-clad laminate, the copper foil on both sides of the metal core double-sided copper-clad laminate is removed using a ferric chloride solution. Is prepared.

According to the above (a) and (a),
After preparing the metal core double-sided copper-clad laminate, the copper foil is removed to make it a metal core double-sided insulating plate.This is because after removing the copper foil, the unevenness due to the copper foil remains on the surface of the insulating layer of the metal core double-sided copper-clad laminate. This unevenness is to enhance the adhesion between the metal core double-sided insulating plate and the prepreg in a future laminating step.

(C): Positioning holes are formed in two separately procured double-sided copper-clad laminates in accordance with the positioning holes formed in (a) above, and the holes are different from each other. Through holes for BVH.

(D) One-layer and two-layer BVH holes are plated on each of the two double-sided copper-clad laminates and subjected to desired circuit processing only on one side. A BVH inner layer plate with a single-sided circuit and a BVH inner layer plate with a single-sided circuit for three and four layers are produced. That is, the circuit processing is performed on the second and third layers.

(E): With the metal core double-sided insulating plate prepared in (A) above as a core, outer prepregs for an insulating layer are disposed on both sides thereof, and the one layer prepared in (D) above is further provided outside.・ Inner board for BVH with single-sided circuit for two layers and three layers
A BVH inner layer plate with a single-sided circuit for four layers is arranged so that the circuit processing surface faces inward, and a second mechanism product is positioned which is positioned through a positioning member in a positioning hole of each component.

(F) heating and pressurizing the secondary mechanism product;
Lamination molding is performed to obtain a metal core BVH four-layer shield plate.

[0010]

However, in the above-mentioned prior art, the first mechanism step (a),
There is a lamination process of the primary mechanism product of (a), a secondary mechanism process of (e), and a lamination process of the secondary mechanism product of (f). It is repeated twice, and further, after the lamination process of the primary structure product of (a), the copper foil on both sides of the laminate product is removed in (a), the process is complicated, and the labor and time are There is a problem that the product becomes expensive.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems.
A method of manufacturing a multilayer shield plate for VH is based on a method of manufacturing a BVH (blind via-hole) on an outer surface of a metal plate via a synthetic resin insulating layer.
Metal core BVH formed by laminating inner layers for holes
(1) obtaining a metal core in which a first hole for positioning and a second hole for a through-hole are formed through a metal plate whose both surfaces are surface-treated; 2) A third hole for positioning is formed through the plurality of double-sided copper-clad laminates, and a fourth hole for BVH is formed through the copper-plated laminates to perform a copper plating process, and one side of the plurality of double-sided copper-clad laminates A step of obtaining a plurality of BVH inner layers with a single-sided circuit by forming a circuit pattern only on the surface and performing a surface treatment; and (3) a plurality of first insulating layers for a plurality of insulating layers formed through fifth holes for positioning. A step of obtaining a prepreg and a plurality of second prepregs for an insulating layer also formed through the sixth hole for positioning; (4) the first, third and fifth holes for positioning; And the sixth hole and the positioning member The first prepreg is in contact with the metal core on both surfaces of the metal core, the second prepreg is further overlapped outside the first prepreg, and the circuit pattern forming surface is further contacted outside the second prepreg. The method is characterized by comprising a step of forming a mechanical product formed by laminating BVH inner layer plates with a single-sided circuit, and (5) a process of laminating and forming the mechanical product to obtain a multilayer shield plate for a metal core BVH.

[0012] Further, the present invention provides a mechanical product, wherein an additional prepreg for the insulating layer of the same material as the second prepreg is provided between the first prepreg for the insulating layer and the second prepreg for the insulating layer of the mechanical product. It may be a layered structure product in which a pair of layered portions, with the inner layer plate for BVH with a circuit outside, are layered in pairs.

Further, in the present invention, the metal core may be any of aluminum, aluminum alloy, copper or copper alloy.

Further, according to the present invention, the first prepreg for an insulating layer comprises:
Epoxy resin, polyimide resin or modified polyimide resin or any of the above resins containing talc, mica or alumina containing an inorganic filler may be impregnated into a glass cloth. .

Further, in the present invention, the resin amount of the first prepreg for the insulating layer may be 50 to 75% by weight.

[0016] Further, the present invention provides a second prepreg for an insulating layer,
Epoxy resin, polyimide resin or modified polyimide resin or any of the above resins containing talc, mica or alumina containing an inorganic filler may be impregnated into a glass cloth. .

Further, in the present invention, the resin amount of the second prepreg for an insulating layer may be 40 to 75% by weight.

Further, the present invention provides a double-sided copper-clad laminate having an insulating layer,
A glass cloth impregnated with any one of an epoxy resin, a polyimide resin, and a modified polyimide resin may be used.

Further, in the present invention, the resin of the first prepreg for the insulating layer, the second prepreg for the insulating layer and the resin of the insulating layer of the double-sided copper-clad laminate may be the same resin.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a multilayer shield plate for a metal core BVH (blind via hole) according to the present invention will be described in detail with reference to FIGS. FIG. 1 is a sectional view of a metal core used in the present invention, and FIG. 2 is a sectional view of a double-sided copper-clad laminate with a BVH used in the present invention.
FIG. 3 is a cross-sectional view of a BVH inner layer plate with a single-sided circuit processed from that of FIG. 2, FIG. 4 is a schematic cross-sectional view showing a first example of a mechanical product used in the present invention, and FIG. FIG. 6 is a cross-sectional view of a multilayer shield plate for a metal core BVH obtained by laminating No. 4 and FIG. 6 is a schematic cross-sectional view showing a second example of a mechanical product used in the present invention, and FIG. It is sectional drawing of the metal core BVH multilayer shielding board obtained by doing.

The manufacturing method of the present invention will be described below in the order of [Step 1] to [Step 7] with reference to the drawings.

[Step 1]... As shown in FIG.
1 is subjected to a surface treatment, and a through-hole 12 and positioning holes 13, 1
3 is formed to form a metal core 10.

Here, the material of the metal core 10 is preferably any of aluminum, aluminum alloy, copper and copper alloy, and the thickness is preferably 0.2 mm to 1.2 mm.

[Step 2] A plurality of double-sided copper-clad laminates (not shown) are procured. This double-sided copper-clad laminate has a copper foil laminated on both sides of a resin insulating layer.

Here, it is preferable that the resin insulation layer is formed by impregnating a glass cloth with any one of epoxy resin, polyimide resin and modified polyimide resin. The thickness of the copper foil is preferably from 12 μm to 35 μm, and the thickness of the double-sided copper-clad laminate is preferably from 0.1 mm to 0.5 mm.

As shown in FIG. 2, positioning holes 23A, 23A are formed through the double-sided copper-clad laminate so as to match the positioning holes 13, 13 of the metal core 10, and B
A copper plating process is performed on the through-hole formed through the hole 24A serving as the VH to produce the double-sided copper-clad laminate 20A with the BVH. In FIG. 2, 21A is an insulating layer, and 22A is a copper plating portion.

As shown in FIG. 3, for example, the aforementioned BVH
A predetermined circuit pattern 22B is formed on only one side of the double-sided copper-clad laminate 20A, and a surface treatment is further performed to produce a BVH inner layer board 20B with a single-sided circuit. In FIG. 3, 2
3B and 23B are positioning holes, and 21B is a surface-treated insulating layer.

In the following steps, for the sake of simplicity, the BVH inner layer board with a single-sided circuit is not the one shown in FIG. 3 but two kinds of BVH inner layer with a single-sided circuit as shown in FIG. Description will be given using the plates 20C and 20D.

[Step 3] Next, as shown in FIG. 4, a plurality of sets of inner prepregs 30 for insulating layers and a plurality of sets of outer prepregs 40 for insulating layers are prepared. Positioning holes 13, 13 of metal core 10, B with one-sided circuit
Positioning holes 23C, 23C and B of VH inner layer plate 20C
Positioning holes 33, 33 are formed in the insulating layer inner prepregs 30, 30 in conformity with the positioning holes 23D, 23D of the VH inner layer plate 20D, and positioning holes 43 are formed in the insulating layer outer prepregs 40, 40. , 43 are formed.

The inner prepregs 30, 30 and the outer prepregs 40, 40 are preferably made by impregnating a glass cloth with any one of epoxy resin, polyimide resin and modified polyimide resin. It is also preferable that a glass cloth impregnated with one of the above resins containing an inorganic filler of talc, mica or alumina, and furthermore, the inner prepreg 30,
30 preferably has a resin amount of 50 to 75% by weight, and the outer prepregs 40 and 40 preferably have a resin amount of 40 to 75% by weight.

Further, the insulating layer 21C of the BVH inner layer plate 20C with a single-sided circuit, the insulating layer 21D of the BVH inner layer plate 20D with a single-sided circuit, the resin of the inner prepregs 30, 30 and the resin of the outer prepregs 40, 40 are all the same resin. It would be best.

[Step 4] FIG. 4 will be described. Inner prepregs 30 for an insulating layer are overlapped on both surfaces of the metal core 10 in contact with the metal core 10, and outer prepregs 40, 40 for an insulating layer are further provided outside the inner prepregs 30.
, And the BVH inner layer plates 20C, 20D with single-sided circuits are superposed on the outside of the outer prepregs 40, 40 to prepare a mechanical product 50. Here, BVH inner layer plate 2 with single-sided circuit
0C, 20D circuit pattern surface is the outer prepreg 40,
Arrange so that it touches 40.

The mechanical work includes positioning holes 13 and 13 of metal core 10, positioning holes 33 and 33 of BVH inner layer plate 20C with a single-sided circuit, and BVH inner layer plate 2 with a single-sided circuit.
0D positioning holes 43, 43 and inner repregs 30, 30
The positioning pins 33 (not shown in FIG. 4 and indicated by 61 in FIG. 5) are passed through the positioning holes 33, 33 and the positioning holes 43, 43 of the outer prepregs 40, 40 so as to be overlapped.

Here, the thickness of the inner prepregs 30 is preferably 0.05 mm to 0.2 mm.
The thickness of the outer prepregs 40 and 40 alone is 0.05 mm.
It is preferable that the thickness of each prepreg is different from that of the prepreg alone or in the case of using one to three sheets of the same thickness. A plurality of objects may be used by overlapping.

[Step 5] Structured product 5 as shown in FIG.
0 is heated and pressed to form a metal core B as shown in FIG.
The VH four-layer shield plate 60 is formed, and the method of manufacturing the metal core BVH multilayer shield plate of the present invention is completed. Here, the heating and pressing conditions are as follows: the ambient pressure is 100 torr or less in vacuum, the pressing temperature is 160 ° C. to 200 ° C., and the pressing pressure is 1
0-100kg / cm ² , Pressing time 30min-1
80 minutes is preferred. Metal core B thus formed
The thickness of the VH multilayer shield plate 60 is 1.0 mm to 3.0 mm.
mm is preferred.

As another example of the present invention, an eight-layer shield plate 80 for a metal core BVH as shown in FIG. 7 may be formed by heating and pressing an eight-layer structure component 70 as shown in FIG. it can. That is, it is possible to increase the number of layers.

The mechanical product 7 for eight layers shown in FIGS. 6 and 7
The features of the eight-layer shield plate 80 for the metal core BVH are shown in FIG. 4 between the inner prepreg 30 and the outer prepreg 40 disposed on the upper side of the four-layer structure component 50 in FIG. An element for layer increase may be sandwiched between the inner prepreg 30 and the outer prepreg 40 arranged on the lower side.

The upper layering element is composed of a pair of a layering prepreg 40A having the same composition as that of the outer prepreg 40 and a BVH inner layer plate 20E with a double-sided circuit having both surfaces subjected to circuit processing and surface treatment. The layering element on the lower side is composed of a layering prepreg 40A having the same composition as the outer prepreg 40 and a BVH inner layer plate 20F with a double-sided circuit having both surfaces subjected to circuit processing and surface treatment. It is a pair. In this case, the prepregs 40A, 40A for layer increase are arranged inside, and the BVH inner layer plates 20E, 20F with double-sided circuits are provided.
Are sandwiched between the layers.

In this way, the eight-layer structure component 70 shown in FIG. 6 is prepared, and this is laminated and formed to form an eight-layer shield plate 80 for a metal core BVH as shown in FIG.

As a layering element, a layering prepreg 40
If A and a BVH inner layer plate with a double-sided circuit are formed in two pairs, a 12-layer shield plate for a metal core BVH can be obtained. In this way, it is possible to further increase the number of layers as needed.

Hereinafter, referring to the figures used above,
Examples will be described in detail according to the steps (a) to (d). (A) ... Bore processing, electrolytic etching processing, and silane coupling processing in order to enhance the adhesion with the resin for the insulating layer by drilling holes in an aluminum plate with a thickness of about 0.8 mm with -0.02% correction. To prepare an aluminum core (corresponding to FIG. 1).

(B) Two copper-epoxy double-sided copper-clad boards having a copper foil thickness of 35 μm and a total thickness of 0.1 mm are procured.
After processing a pin guide hole for positioning at the same location as the aluminum core of this glass epoxy double-sided copper clad board, +0.10
BVH hole processing and copper plating with% correction (Fig. 2
After that, one-sided wiring processing is performed, and this wiring processed surface is subjected to black oxidation treatment in order to enhance the adhesion to the resin for the insulating layer. And an inner layer plate for three layers and four layers was prepared (corresponding to FIG. 3).
Here, each inner layer plate is used in a state where only the second and third layers are subjected to wiring processing.

(C) The aluminum core of (a) (1 in FIG. 4)
0), the thickness is 0.1 mm and the resin amount is about 6
An inner prepreg (corresponding to 30 and 30 in FIG. 4) in which two sheets of 0% glass epoxy prepreg are stacked is disposed, and the outer side has a thickness of 0.1 mm and a resin amount of about 50%.
Is disposed as an outer prepreg (corresponding to 40 and 40 in FIG. 4), and on each of the outer prepregs, an inner layer plate (corresponding to 20C in FIG. 4) and a three-layer inner layer plate (corresponding to 20C in FIG. 4) 4) An inner layer plate (corresponding to 20D in FIG. 4) was overlaid, and the position was fixed with a positioning pin (corresponding to 61 in FIG. 4) to prepare a mechanical product (corresponding to 50 in FIG. 4). Here, the circuit pattern surface of each inner layer plate was arranged so as to contact the outer insulating layer (corresponding to 40 in FIG. 4).

(D) A release film is set on both outer surfaces of the mechanical product (corresponding to 50 in FIG. 4) obtained in the above (a) to (c), and the molding condition is adjusted to a degree of vacuum of 10 torr by a vacuum press machine.
r, a laminate temperature of 200 ° C. × 80 minutes and a press pressure of 50 kg / cm ² were laminated and pressed to obtain a 4-layer shield plate for aluminum core BVH having a thickness of about 1.85 mm (corresponding to 60 in FIG. 5). Obtained.

[0045]

As described above, according to the present invention, the steps of positioning and stacking the components before lamination and the subsequent step of heating and pressurizing and laminating the components can be performed only once. Is simplified, and the cost of the product is reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view of a metal core used in the present invention.

FIG. 2 is a sectional view of a double-sided copper-clad laminate with a BVH used in the present invention.

FIG. 3 is a BV with a one-sided circuit obtained by processing the one shown in FIG. 2;
It is sectional drawing of the inner layer board for H.

FIG. 4 is a schematic cross-sectional view showing a first example of a mechanical product used in the present invention.

FIG. 5 is a diagram showing a metal core BV obtained by laminating FIG.
It is sectional drawing of the multilayer shield board for H.

FIG. 6 is a schematic cross-sectional view showing a second example of a mechanical product used in the present invention.

7 is a metal core BV obtained by laminating FIG. 6;
It is sectional drawing of the multilayer shield board for H.

[Explanation of symbols]

Reference Signs List 10 metal core 11 metal plate 12 hole for through hole 13 positioning hole 20A double-sided copper-clad laminate with BVH 20B, 20C, 20D inner layer plate for BVH with single-sided circuit 30, 30 inner prepreg 40, 40 outer prepreg 50 Structured product (for 4 layers) ) 60 4-layer shield plate for metal core BVH 70 Structured product (for 8-layer) 80 8-layer shield plate for metal core BVH 61, 81 Locating pin

Claims (9)

[Claims] 1. A method of manufacturing a multilayer shield plate for a metal core BVH, comprising laminating and molding an inner layer plate for a blind via hole (BVH) on an outer surface of a metal plate via a synthetic resin insulating layer. A) obtaining a metal core in which a first hole for positioning and a second hole for through-hole are formed through a metal plate whose both surfaces are surface-treated; and (2) a step of positioning a metal core on a plurality of double-sided copper-clad laminates. A third hole is formed through and a fourth hole for BVH is formed through, and a copper plating process is performed. A circuit pattern is formed on only one side of the plurality of double-sided copper-clad laminates, and a surface process is performed. Obtaining a plurality of BVH inner layers with single-sided circuits, and (3) penetrating through a plurality of first prepregs for insulating layers formed through a fifth hole for positioning, and also through a sixth hole for positioning. For multiple insulating layers formed A step of obtaining the two prepreg,
(4) Positioning the first hole, the third hole, the fifth hole, and the sixth hole for positioning by penetrating a positioning member, and contacting the metal core on both surfaces of the metal core to form the first hole. A mechanism product in which a prepreg is stacked, the second prepreg is further stacked outside the first prepreg, and a circuit pattern forming surface is further contacted outside the second prepreg, and the BVH inner layer plate with a single-sided circuit is stacked. Forming a metal core B
Obtaining a multilayer shield plate for a metal core BVH. 2. A structure product having a double-sided circuit between a first prepreg for an insulation layer and a second prepreg for an insulation layer of the structure product, with an additional prepreg for the insulation layer of the same material as the second prepreg inside. 2. The method for manufacturing a multilayer shield plate for a metal core BVH according to claim 1, wherein the product is a layered structure product in which a pair of layered portions, with the inner layer plate for the BVH being on the outside, are sandwiched in pairs. 3. The method for manufacturing a multilayer shield plate for a metal core BVH according to claim 1, wherein the metal core is made of any one of aluminum, aluminum alloy, copper and copper alloy. 4. The first prepreg for an insulating layer is made of epoxy resin, polyimide resin, modified polyimide resin, or any of the above resins containing an inorganic filler of talc, mica or alumina. Characterized by being impregnated in a glass cloth.
4. The method for producing a multilayer shield plate for a metal core BVH according to any one of the above items 3. 5. The resin content of the first prepreg for an insulating layer is 50 to 50.
The method for producing a multilayer shield plate for a metal core BVH according to claim 4, wherein the amount is 75% by weight. 6. The second prepreg for an insulating layer is made of epoxy resin, polyimide resin or modified polyimide resin or a resin containing any one of talc, mica and alumina. Characterized by being impregnated in a glass cloth.
4. The method for producing a multilayer shield plate for a metal core BVH according to any one of the above items 3. 7. The resin amount of the second prepreg for the insulating layer is 40 to 40.
The method for producing a multilayer shield plate for a metal core BVH according to claim 6, wherein the content is 75% by weight. 8. The insulating layer of the double-sided copper-clad laminate is made of epoxy resin,
The method for producing a multilayer shield plate for a metal core BVH according to any one of claims 1 to 3, wherein the glass cloth is impregnated with either a polyimide resin or a modified polyimide resin. 9. The resin of the first prepreg for the insulating layer, the second prepreg for the insulating layer and the insulating layer of the double-sided copper-clad laminate are made of the same resin. 9. The method for producing a multilayer shield plate for a metal core BVH according to any one of 8.