CN207200834U - Optical module - Google Patents

Abstract

The utility model provides an optical module, including a circuit board, a packaging unit and a lens assembly. The packaging unit includes a substrate, an optical element and a packaging colloid, wherein the substrate is arranged on the circuit board, the optical element is arranged on the substrate, the packaging colloid is arranged on the substrate and packages the optical element. The lens assembly is arranged on the substrate and covers the optical element and the packaging colloid.

Description

optical module

technical field

The utility model relates to an optical module, in particular to an optical module including a lens assembly.

Background technique

Image acquisition devices (such as mobile phones, digital cameras, panoramic cameras, three-dimensional cameras, etc.) usually have optical sensing elements (such as complementary metal-oxide semiconductor (Complementary Metal-Oxide Semiconductor, CMOS) sensing elements) corresponding to lenses, and use to sense light incident from the lens.

In some image capturing devices, the optical sensing element is bonded to the circuit board by Surface-Mount Technology (SMT), and the lens assembly is also disposed on the circuit board and covers the optical sensing element. In this design, the solder between the optical sensing element and the circuit board will cause the optical sensing element to tilt relative to the lens assembly, thereby affecting the quality of the image acquisition device.

Utility model content

The utility model provides an optical module, which can prevent the optical element from tilting relative to the lens assembly.

The optical module of the utility model includes a circuit board, a packaging unit and a lens assembly. The encapsulation unit includes a substrate, an optical element and an encapsulation compound, wherein the base plate is disposed on the circuit board, the optical element is disposed on the substrate, and the encapsulation compound is disposed on the substrate and encapsulates the optical element. The lens assembly is disposed on the substrate and covers the optical element and the encapsulant.

In an embodiment of the present invention, the above-mentioned lens assembly is separated from the circuit board.

In an embodiment of the present invention, the width of the substrate along a direction perpendicular to the optical axis of the lens assembly is greater than the width of the encapsulant along the direction.

In an embodiment of the present invention, the above-mentioned substrate has a central area and a peripheral area, the peripheral area surrounds the central area, the optical elements are arranged in the central area, and the peripheral area carries the lens assembly.

In an embodiment of the present invention, the above-mentioned lens assembly has a main body and a supporting part, the main body is positioned opposite to the optical element, and the supporting part is connected to the main body and bonded to the substrate.

In an embodiment of the present utility model, the above-mentioned lens assembly includes a lens, and the lens is disposed on the main body.

In an embodiment of the present invention, the above-mentioned substrate has a first surface and a second surface opposite to each other, the optical element, the encapsulant and the lens assembly are arranged on the first surface, and the second surface faces the circuit board.

In an embodiment of the present invention, the packaging unit includes a transparent cover, the encapsulant has an opening exposing the optical element, and the transparent cover is disposed on the encapsulant and covers the opening.

In an embodiment of the present invention, the above-mentioned optical element is electrically connected to the circuit board through the substrate.

Based on the above, in the optical module of the present invention, in addition to disposing the optical element on the substrate of the packaging unit, the lens assembly is also disposed on the substrate of the packaging unit instead of disposing the lens assembly on the circuit board. In this way, when the substrate of the package unit is bonded to the circuit board by Surface-Mount Technology (SMT), even if the solder between the substrate and the circuit board causes the package unit to tilt relative to the circuit board, the package unit is disposed on the substrate. Therefore, the optical elements on the substrate and the lens components arranged on the substrate will not be relatively tilted. Therefore, the yield rate of the optical module can be improved.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with accompanying drawings.

Description of drawings

FIG. 1 is a schematic side view of an optical module according to an embodiment of the present invention.

FIG. 2 is a schematic top view of the packaging unit in FIG. 1 .

FIG. 3 is a schematic side view of an optical module according to another embodiment of the present invention.

Explanation of reference signs

100, 200: optical module

110, 210: circuit board

120, 220: package unit

122, 222: Substrate

122a, 222a: first surface

122b, 222b: second surface

124, 224: Optical components

126, 226: encapsulation colloid

126a, 226a: opening

128, 228: transparent cover

130, 230: lens assembly

130a, 230a: Lens

132, 232: main body

134, 234: support part

L, L': light

R1: central area

R2: surrounding area

S, S': Solder

X, Y, Z: direction

Detailed ways

FIG. 1 is a schematic side view of an optical module according to an embodiment of the present invention. Please refer to FIG. 1 , the optical module 100 of this embodiment includes a circuit board 110 , a packaging unit 120 and a lens assembly 130 . The encapsulation unit 120 includes a substrate 122 , an optical element 124 and an encapsulant 126 . The substrate 122 is disposed on the circuit board 110 , the optical element 124 is disposed on the substrate 122 and electrically connected to the circuit board 110 through the substrate 122 , and the encapsulant 126 is disposed on the substrate 122 and encapsulates the optical element 124 . The lens assembly 130 is disposed on the substrate 122 and separated from the circuit board 110 , and the lens assembly 130 covers the optical element 124 and the encapsulant 126 .

Under the above arrangement, in addition to disposing the optical element 124 on the substrate 122 of the packaging unit 120 , the lens assembly 130 is also arranged on the substrate 122 of the packaging unit 120 instead of disposing the lens assembly 130 on the circuit board 110 . Thus, when the substrate 122 of the package unit 120 is bonded to the circuit board 110 by surface-mount technology (Surface-Mount Technology, SMT), even if the solder S between the substrate 122 and the circuit board 110 causes the package unit 120 to The circuit board 110 is inclined, so that the optical element 124 disposed on the substrate 122 and the lens assembly 130 disposed on the substrate 122 will not be relatively inclined. Therefore, the yield of the optical module 100 can be improved.

In detail, the substrate 122 of this embodiment has opposite first surface 122a and second surface 122b, the optical element 124, the encapsulant 126 and the lens assembly 130 are disposed on the first surface 122a of the substrate 122, and the second surface of the substrate 122 The surface 122b faces the circuit board 110 . That is, the optical element 124 , the encapsulant 126 and the lens assembly 130 are located above the substrate 122 with the first surface 122 a as their common reference plane, and the circuit board 110 is located below the substrate 122 .

FIG. 2 is a schematic top view of the packaging unit in FIG. 1 . The substrate 122 of the present embodiment has a central region R1 and a surrounding region R2 as shown in FIG. 2 . The central region R1 and the surrounding region R2 are distinguished by dotted lines in FIG. 2 . The peripheral area R2 surrounds the central area R1, the optical element 124 and the encapsulant 126 are disposed in the central area R1, and the peripheral area R2 carries the lens assembly 130 shown in FIG. 1 . More specifically, the width W1 (indicated in FIG. 2 ) of the substrate 122 along the direction X is greater than the width W2 (indicated in FIG. 2 ) of the encapsulant 126 along the direction X, and the width W3 (indicated in FIG. 2 ) of the substrate 122 along the direction Y. 2 ) is greater than the width W4 (marked in FIG. 2 ) of the encapsulant 126 along the direction Y, so that there is enough space on the substrate 122 to dispose the optical element 124 , the encapsulant 126 and the lens assembly 130 . Wherein, both the direction X and the direction Y are perpendicular to the optical axis of the lens assembly 130 (ie coincident with the axis of the light L, which is parallel to the direction Z). FIG. 2 shows both the encapsulant 126 and the substrate 122 as squares, but this is only for illustration, and the encapsulant 126 and the substrate 122 may actually have other suitable shapes.

In this embodiment, the lens assembly 130 has a main body portion 132 and a support portion 134 as shown in FIG. 1 . The main body 132 is opposite to the optical element 124 , the lens 130 a of the lens assembly 130 is disposed on the main body 132 , and the supporting portion 134 is connected to the main body 132 and bonded to the substrate 122 . In other embodiments, the lens assembly 130 may have other shapes and be disposed on the substrate 122 , which is not limited by the present invention.

In addition, the encapsulant 126 of this embodiment has an opening 126a, and the opening 126a exposes the optical element 124 so that the optical element 124 can receive light L through the opening 126a. In addition, the packaging unit 120 further includes a light-transmitting cover 128 disposed on the encapsulant 126 and covering the opening 126 a to protect the optical element 124 .

In this embodiment, the optical module 100 is, for example, applied to an image acquisition device, and the optical element 124 is, for example, a complementary metal-oxide semiconductor (Complementary Metal-Oxide Semiconductor, CMOS) sensing element or other types of optical sensing elements for The incident light L transmitted through the lens assembly 130 is received. In other embodiments, the optical module 100 can be applied to other types of optical devices, and the optical element 124 can be correspondingly other types of elements, which is not limited by the present invention. This is exemplified below by means of the accompanying drawings.

Fig. 3 is a schematic side view of an optical module according to another embodiment of the present invention. In the optical module 200 of FIG. 3 , the circuit board 210, the substrate 222, the first surface 222a, the second surface 222b, the encapsulant 226, the opening 226a, the transparent cover 228, the lens assembly 230, the lens 230a, the main body 232, The arrangement of the supporting part 234 and the solder S' is similar to that of the circuit board 110, the substrate 122, the first surface 122a, the second surface 122b, the encapsulant 126, the opening 126a, the light-transmitting cover 128, the lens assembly 130, and the lens 130a in FIG. 1 , the arrangement of the main body portion 132 , the support portion 134 , and the solder S will not be repeated here. The difference between the optical module 200 and the optical module 100 is that the optical element 224 of the packaging unit 220 is not an optical sensing element like the aforementioned optical element 124, but the optical element 224 is a light emitting element (such as a light emitting diode element) and is used to emit light L', the light L' is transmitted through the lens 230a.

To sum up, in the optical module of the present invention, in addition to disposing the optical elements on the substrate of the packaging unit, the lens assembly is also disposed on the substrate of the packaging unit instead of disposing the lens assembly on the circuit board. In this way, when the substrate of the package unit is bonded to the circuit board by Surface-Mount Technology (SMT), even if the solder between the substrate and the circuit board causes the package unit to tilt relative to the circuit board, the package unit is disposed on the substrate. Therefore, the optical elements on the substrate and the lens components arranged on the substrate will not be relatively tilted. Therefore, the yield rate of the optical module can be improved.

Although the present utility model has been disclosed above with the embodiments, it is not intended to limit the present utility model. Any person skilled in the art may make some modifications and modifications without departing from the spirit and scope of the present utility model. , so the scope of protection of the present utility model should be as defined by the claims.

Claims (9)

1. An optical module, characterized in that, comprising: circuit board; The packaging unit includes a substrate, an optical element, and an encapsulant, wherein the substrate is disposed on the circuit board, the optical element is disposed on the substrate, and the encapsulant is disposed on the substrate and encapsulates the optical components; and The lens component is configured on the substrate and covers the optical element and the encapsulation compound. 2. The optical module according to claim 1, wherein the lens assembly is separated from the circuit board. 3 . The optical module according to claim 1 , wherein a width of the substrate along a direction perpendicular to the optical axis of the lens assembly is greater than a width of the encapsulant along the direction. 4 . 4. The optical module according to claim 1, wherein the substrate has a central area and a surrounding area, the surrounding area surrounds the central area, the optical element is arranged in the central area, and the surrounding area The area carries the lens assembly. 5. The optical module according to claim 1, wherein the lens assembly has a main body and a support portion, the main body is opposite to the optical element, the support is connected to the main body and engaged on the substrate. 6 . The optical module according to claim 5 , wherein the lens assembly comprises a lens, and the lens is configured on the main body. 7. The optical module according to claim 1, wherein the substrate has a first surface and a second surface opposite to each other, and the optical element, the encapsulant, and the lens assembly are disposed on the first surface. surface, the second surface faces the circuit board. 8. The optical module according to claim 1, wherein the encapsulation unit comprises a light-transmitting cover, the encapsulant has an opening, the opening exposes the optical element, and the light-transmitting cover is disposed on The packaging colloid is on and covers the opening. 9. The optical module according to claim 1, wherein the optical element is electrically connected to the circuit board through the substrate.