CN119383838A - PCB cutting layout method and system - Google Patents

PCB cutting layout method and system Download PDF

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Publication number
CN119383838A
CN119383838A CN202411498641.4A CN202411498641A CN119383838A CN 119383838 A CN119383838 A CN 119383838A CN 202411498641 A CN202411498641 A CN 202411498641A CN 119383838 A CN119383838 A CN 119383838A
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pcb
integrity
preset
crack
layout
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CN119383838B (en
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刘丹
尹联群
刘冬梅
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Shenzhen Giant Change Supply Chain Co ltd
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Shenzhen Talian Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Image Processing (AREA)

Abstract

The invention relates to the technical field of PCBs (printed Circuit Board), and particularly discloses a PCB cutting typesetting method and a PCB cutting typesetting system. According to the invention, the quality index of the PCB is obtained according to the surface integrity and the side integrity of the PCB, so that whether the PCB has defects or not can be rapidly judged under the action of the quality index of the PCB, whether the quality index of the PCB is larger than the quality index of the preset PCB is judged, if the quality index of the PCB is not larger than the quality index of the preset PCB, the defects of the PCB are judged, the defect position information of the material plate is obtained according to the appearance characteristic information of the PCB, the area of the PCB with the defects marked is obtained according to the defect position information of the material plate, a plurality of preset division requirement areas and the area of the PCB with the defects marked are subjected to typesetting adaptation based on CAD, the PCB with the defects is subjected to cutting typesetting processing according to the adaption typesetting information, and the PCB with the defects after typesetting can be reused, and meanwhile, the problem of wasting a large number of material plates can be avoided.

Description

PCB cutting typesetting method and system
Technical Field
The invention relates to the technical field of PCBs (printed Circuit Board), in particular to a PCB cutting typesetting method and a PCB cutting typesetting system.
Background
A printed circuit board (Printed Circuit Board, abbreviated as PCB) is a substrate for electrical connection and support between electronic components, which is one of the most fundamental and important components in modern electronic devices, and the main function of the PCB is to provide a platform on which various electronic components (e.g., resistors, capacitors, transistors, integrated circuits, etc.) can be fixed and electrically connected through predesigned traces.
The typesetting is needed to be carried out on the material plates in the processing process of the PCB material plates, but the existing PCB material plates are usually typeset and divided on the dividing areas with uniform area specifications in the processing process, so that when the material plate defects are met, the preset dividing areas with the material plate defects are abandoned, a large amount of material plates are wasted, and therefore the PCB cutting typesetting method and system are needed to solve the problems that the preset dividing areas with the material plate defects are abandoned and a large amount of material plates are wasted.
Disclosure of Invention
The invention aims to provide a PCB cutting typesetting method and a system, which are used for solving the technical problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a PCB cutting typesetting method comprises the following steps:
obtaining segmentation feature information of a PCB material plate, wherein the segmentation feature information comprises material plate image information and a plurality of preset segmentation required areas;
Acquiring the surface area and the appearance characteristic information of the material plate according to the image information of the material plate, acquiring the surface integrity and the side integrity according to the appearance characteristic information of the material plate, and acquiring the quality index of the PCB according to the surface integrity and the side integrity;
judging whether the quality index of the PCB is larger than a preset quality index of the PCB or not;
If the quality index of the PCB is not greater than the preset quality index of the PCB, judging that the PCB has defects, obtaining the defect position information of the material plate according to the appearance characteristic information of the material plate, and marking the material plate area according to the defect position information of the material plate to obtain the defect marked PCB area;
Typesetting and adapting a plurality of preset division required areas and the PCB material plate surface of the defect mark based on CAD to obtain adapting typesetting information;
and cutting and typesetting the PCB material plate according to the adaptive typesetting information.
Preferably, the step of obtaining the surface integrity and the side integrity according to the material plate appearance characteristic information and obtaining the quality index of the PCB board according to the surface integrity and the side integrity includes:
Gray processing is carried out on the material plate image information to obtain black-and-white surface image information, the black-and-white surface image information is screened to obtain black stripes, coordinates are respectively set at two ends of the black stripes to obtain first coordinates and second coordinates, the outer surface crack length of the black stripes is calculated according to the first coordinates and the second coordinates, and corresponding first weight values are obtained according to the outer surface crack length;
Transmitting a plurality of sound wave pulse signals to the black stripe based on a sound wave scanner, receiving a plurality of rebound signals returned after the sound wave pulse signals strike the black stripe, acquiring the outer surface crack depth according to the rebound signals, and acquiring a corresponding second weight value according to the outer surface crack depth;
acquiring contour information of black stripes based on Canny edge detection, acquiring a plurality of crack widths among black stripe openings according to the contour information of the black stripes, sorting the crack widths in an incremental manner to obtain a crack width sorting table, taking the last crack width in the crack width sorting table as an appearance crack width, and acquiring a corresponding third weight value according to the appearance crack width;
Acquiring a preset crack length judgment threshold according to the outer surface crack length;
Acquiring a preset crack depth judgment threshold according to the outer surface crack depth;
acquiring a preset crack width judgment threshold according to the apparent crack width;
calculating the surface integrity according to the outer surface crack length, the outer surface crack depth, the outer surface crack width, the preset crack length judgment threshold, the preset crack depth judgment threshold, the preset crack width judgment threshold, the first weight value, the second weight value and the third weight value, wherein the calculation formula is as follows:
Wherein B (M) represents surface integrity, H (c) represents surface crack length, H(s) represents surface crack depth, H (k) represents surface crack width, Y (c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y (k) represents a preset crack width judgment threshold, d (Y) represents a first weight value, d (e) represents a second weight value, and d(s) represents a third weight value;
Acquiring first dark stripes and side flatness of the side face of the PCB according to the black-and-white surface image information, acquiring splitting width of the side stripes according to the first dark stripes, and acquiring side integrity according to the splitting width of the side stripes and the side flatness, wherein the side integrity is calculated in the same way as the surface integrity;
Acquiring a corresponding surface integrity weight value according to the surface integrity;
acquiring a corresponding side integrity weight value according to the side integrity;
And calculating the quality index of the PCB according to the surface integrity and the side integrity, wherein the calculation formula is as follows:
s(c)=[B(M)*a+C(D)*b]*100%;
Wherein s (C) represents a PCB board quality index, B (M) represents surface integrity, a represents a surface integrity weight value, C (D) represents side integrity, and B represents a side integrity weight value.
Preferably, the step of obtaining the material plate defect position information according to the material plate appearance characteristic information includes:
Acquiring a plurality of corresponding first edge fixed point coordinates according to the material plate area, and selecting one as a first origin coordinate according to the plurality of first edge fixed point coordinates;
acquiring a corresponding first center point according to the black stripes, and acquiring a first coordinate of the first center point according to the first origin coordinate and the first center point;
acquiring a plurality of corresponding second corner fixed point coordinates according to the side surface area, and selecting one as a second origin coordinate according to the second corner fixed point coordinates;
Acquiring a corresponding second center point according to the first dark stripe, and acquiring a second coordinate of the second center point according to a second origin coordinate and the second center point;
And taking the position information corresponding to the first coordinate and the second coordinate as the position information of the material plate defect.
Preferably, the step of marking the area of the PCB according to the position information of the defect of the PCB to obtain the area of the PCB with the defect mark comprises the following steps:
Obtaining the corresponding depth of the dark stripe according to the first dark stripe, and obtaining the area of the PCB with the side defect according to the depth of the dark stripe and the cracking width of the side stripe;
acquiring the surface defect PCB material plate area according to the second origin coordinates and the outer surface crack length, wherein the second origin coordinates are used as circle centers, and the outer surface crack length is used as a diameter;
And marking the side defect PCB material plate area and the surface defect PCB material plate area respectively to obtain the side defect marking PCB material plate area and the surface defect marking PCB material plate area, and taking the side defect marking PCB material plate area and the surface defect marking PCB material plate area as the defect marking PCB material plate area.
Preferably, the step of typesetting and adapting the preset division requirement areas and the area of the PCB material plate with the defect mark based on CAD to obtain the adapted typesetting information includes:
Acquiring the actual use area of the PCB according to the defect marked PCB;
Randomly arranging the preset partition required area as particles on an actual use area based on particle swarm optimization to obtain a plurality of typesetting layouts, wherein each particle represents one type of typesetting layout of the PCB;
Obtaining corresponding layout characteristic parameters according to a plurality of typesetting layouts, wherein the layout characteristic parameters comprise a plurality of cutting paths, a plurality of typesetting area utilization rates, a plurality of segmentation safety distances and a plurality of preset segmentation requirement area typesetting quantities, and sequentially calculating a plurality of fitness comprehensive values according to the plurality of cutting paths, the plurality of typesetting area utilization rates, the plurality of segmentation safety distances and the plurality of preset segmentation requirement area typesetting quantities, wherein a calculation formula is as follows:
S(i...n)＝[L(J)i*Ci+X(L)i*Di+J(L)i*Ei+S(L)i*Fi]i;...;
[L(J)n*Cn+X(L)n*Dn+J(L)n*En+S(L)n*Fn]n;
Wherein S (i..n) represents an i-th to n-th applicability integrated value, L (J) i represents an i-th cut path, C i represents an i-th cut path weight value, X (L) i represents an i-th layout area utilization rate, D i represents an i-th layout area utilization rate weight value, J (L) i represents an i-th division safety distance, E i represents an i-th division safety distance weight value, S (L) i represents an i-th preset division required area layout number, F i represents an i-th preset division required area layout number weight value, wherein i represents a count number, i=1, 2, 3..n;
And screening the plurality of applicability comprehensive values according to the maximum value to obtain a first screening applicability comprehensive value, taking the typesetting layout corresponding to the first screening applicability comprehensive value as an optimal typesetting scheme, and performing typesetting adaptation on the PCB based on CAD according to the typesetting layout corresponding to the first screening applicability comprehensive value to obtain adaptive typesetting information.
Preferably, the step of performing cutting typesetting processing on the PCB material board according to the adaptive typesetting information includes:
acquiring a plurality of corresponding first preset division requirement areas according to the adaptive typesetting information;
And acquiring corresponding first cutting paths according to the adaptive typesetting information, and cutting and typesetting the plurality of first preset cutting required areas on the PCB according to the first cutting paths.
The application also provides a PCB cutting typesetting system, which comprises:
The PCB material plate segmentation device comprises a first acquisition module, a second acquisition module and a segmentation module, wherein the first acquisition module is used for acquiring segmentation characteristic information of a PCB material plate, and the segmentation characteristic information comprises material plate image information and a plurality of preset segmentation required areas;
The second acquisition module is used for acquiring the surface area and the appearance characteristic information of the material plate according to the image information of the material plate, acquiring the surface integrity and the side integrity according to the appearance characteristic information of the material plate and acquiring the quality index of the PCB according to the surface integrity and the side integrity;
the first judging module is used for judging whether the quality index of the PCB is larger than a preset quality index of the PCB;
If the quality index of the PCB is not greater than the preset quality index of the PCB, judging that the PCB has defects, obtaining the defect position information of the material plate according to the appearance characteristic information of the material plate, and marking the material plate area according to the defect position information of the material plate to obtain the defect marked PCB area;
the first typesetting module is used for typesetting and adapting a plurality of preset division required areas and the area of the PCB material plate with the defect mark based on CAD to obtain adapting typesetting information;
And the first processing module is used for cutting and typesetting the PCB material plate according to the adaptive typesetting information.
Preferably, the second acquisition module includes:
The first acquisition unit is used for carrying out gray processing on the material plate image information to obtain black-and-white surface image information, screening the black-and-white surface image information to obtain black stripes, respectively setting coordinates at two ends of the black stripes to obtain first coordinates and second coordinates, calculating the outer crack length of the black stripes according to the first coordinates and the second coordinates, and acquiring corresponding first weight values according to the outer crack length;
The second acquisition unit is used for transmitting a plurality of sound wave pulse signals to the black stripe based on the sound wave scanner, receiving a plurality of rebound signals returned after the sound wave pulse signals strike the black stripe, acquiring the outer surface crack depth according to the rebound signals, and acquiring a corresponding second weight value according to the outer surface crack depth;
A third obtaining unit, configured to obtain contour information of black stripes based on Canny edge detection, obtain a plurality of crack widths between black stripe openings according to the contour information of the black stripes, sort the plurality of crack widths in an incremental manner, obtain a crack width sorting table, use a last crack width in the crack width sorting table as an external crack width, and obtain a corresponding third weight value according to the external crack width;
A fourth obtaining unit, configured to obtain a preset fracture length judgment threshold according to the outer surface fracture length;
A fifth obtaining unit, configured to obtain a preset fracture depth judgment threshold according to the outer surface fracture depth;
a sixth obtaining unit, configured to obtain a preset crack width judgment threshold according to the apparent crack width;
The first calculating unit is configured to calculate surface integrity according to the outer surface crack length, the outer surface crack depth, the outer surface crack width, the preset crack length judgment threshold, the preset crack depth judgment threshold, the preset crack width judgment threshold, the first weight value, the second weight value and the third weight value, where the calculating formula is as follows:
Wherein B (M) represents surface integrity, H (c) represents surface crack length, H(s) represents surface crack depth, H (k) represents surface crack width, Y (c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y (k) represents a preset crack width judgment threshold, d (Y) represents a first weight value, d (e) represents a second weight value, and d(s) represents a third weight value;
a seventh obtaining unit, configured to obtain a first dark stripe and a side flatness of a side surface of the PCB according to the black-and-white surface image information, obtain a splitting width of the side stripe according to the first dark stripe, and obtain a side integrity according to the splitting width of the side stripe and the side flatness, where a side integrity calculating manner is the same as a surface integrity calculating manner;
an eighth obtaining unit, configured to obtain a corresponding surface integrity weight value according to the surface integrity;
a ninth obtaining unit, configured to obtain a corresponding side integrity weight value according to the side integrity;
The second calculating unit is used for calculating the quality index of the PCB according to the surface integrity and the side integrity, wherein the calculating formula is as follows:
s(c)=[B(M)*a+C(D)*b]*100%;
Wherein s (C) represents a PCB board quality index, B (M) represents surface integrity, a represents a surface integrity weight value, C (D) represents side integrity, and B represents a side integrity weight value.
The application also provides a computer device comprising a memory storing a computer program and a processor implementing the steps of the above method when executing the computer program.
The application also provides a computer readable storage medium having stored thereon a computer program which when executed by a processor performs the steps of the above method.
The PCB layout method has the beneficial effects that the segmentation characteristic information of the PCB is firstly obtained, wherein the segmentation characteristic information comprises material plate image information and a plurality of preset segmentation requirement areas, then the material plate area and the material plate appearance characteristic information are obtained according to the material plate image information, so that basis can be provided for subsequent layout rearrangement after the material plate area and the material plate appearance characteristic information are obtained, meanwhile, the surface integrity and the side integrity can be obtained according to the material plate appearance characteristic information, the PCB plate quality index is obtained according to the surface integrity and the side integrity, thus the PCB plate quality index can be rapidly judged whether defects exist in the PCB plate under the action of the PCB plate quality index, and whether the PCB plate quality index is larger than the preset PCB plate quality index is judged, if the PCB plate quality index is not larger than the preset PCB plate quality index, the PCB plate defects are judged, and the material plate defect position information is obtained according to the material plate appearance characteristic information, so that the PCB plate areas are marked with defects can be obtained, the PCB can be avoided after the material plate areas with the defect marks are obtained, the PCB plate quality index is newly laid out, and meanwhile, the PCB plate quality index can be adapted to the PCB plate quality index is obtained, and the PCB layout can be further processed according to the PCB layout requirement information, and the PCB layout requirements can be further, and the PCB layout problem is greatly can be avoided.
Drawings
FIG. 1 is a flow chart of a method according to an embodiment of the application.
Fig. 2 is a schematic diagram of a system structure according to an embodiment of the application.
Fig. 3 is a schematic diagram illustrating an internal structure of a computer device according to an embodiment of the application.
Fig. 4 is a schematic diagram of a PCB panel according to an embodiment of the application.
The achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1-3, the present application provides a PCB cutting typesetting method applied to an earphone charging stand detection platform, including:
s1, obtaining segmentation feature information of a PCB material plate, wherein the segmentation feature information comprises material plate image information and a plurality of preset segmentation required areas;
s2, acquiring panel surface area and panel appearance characteristic information according to the panel image information, acquiring surface integrity and side integrity according to the panel appearance characteristic information, and acquiring a PCB (printed circuit board) quality index according to the surface integrity and the side integrity;
s3, judging whether the quality index of the PCB is larger than a preset quality index of the PCB or not;
If the quality index of the PCB is not greater than the preset quality index of the PCB, judging that the PCB has defects, obtaining the defect position information of the material plate according to the appearance characteristic information of the material plate, and marking the material plate area according to the defect position information of the material plate to obtain the defect marked PCB area;
S4, typesetting and adapting a plurality of preset division required areas and the PCB material plate surface of the defect mark based on CAD to obtain adapting typesetting information;
S5, cutting and typesetting processing is carried out on the PCB material plate according to the adaptive typesetting information.
As described in the above steps S1-S5, typesetting and dividing are required for the material plates in the process of processing the PCB material plates, but the existing PCB material plates are usually typeset and divided for dividing areas with uniform area specifications in the process of processing, so that when the material plates are defective, the preset dividing areas with the material plate defects are discarded, and a large amount of material plates are wasted, therefore, the invention firstly obtains the dividing characteristic information of the PCB material plates, wherein the dividing characteristic information comprises material plate image information and a plurality of preset dividing requirement areas, then obtains material plate surface area and material plate appearance characteristic information according to the material plate image information, can provide basis for subsequent typesetting after obtaining the material plate surface area and material plate appearance characteristic information, can simultaneously obtain surface integrity and side integrity according to the material plate appearance characteristic information, can rapidly judge whether the material plates have defects or not according to the surface integrity and side integrity, and judge whether the PCB material plates have defects or not, and can obtain a plurality of material plate appearance indexes according to the preset quality indexes, if the material plate surface area is not larger than the preset quality indexes, and can obtain a plurality of material plate appearance defect marks by matching the material plate according to the position of the material plate, and can obtain the material plate appearance defect area information by performing the step of typesetting after the material plate defect information, and the material plate appearance information is suitable for the material plate defect is obtained, and the material plate is obtained according to the position of the material plate defect information is printed by the material plate surface area and the material plate is printed by the material plate defect is obtained, and then cutting and typesetting the PCB according to the adaptive typesetting information, so that the PCB after typesetting can be reused, and the problem of waste of a large number of PCBs can be avoided.
In one embodiment, the step S2 of obtaining the surface integrity and the side integrity according to the material plate appearance characteristic information and obtaining the quality index of the PCB board according to the surface integrity and the side integrity includes:
S201, carrying out gray processing on the material plate image information to obtain black-and-white surface image information, screening the black-and-white surface image information to obtain black stripes, respectively setting coordinates at two ends of the black stripes to obtain first coordinates and second coordinates, calculating the outer surface crack length of the black stripes according to the first coordinates and the second coordinates, and obtaining corresponding first weight values according to the outer surface crack length;
S202, transmitting a plurality of sound wave pulse signals to a black stripe based on a sound wave scanner, receiving a plurality of rebound signals returned after the sound wave pulse signals strike the black stripe, acquiring the outer surface crack depth according to the rebound signals, and acquiring a corresponding second weight value according to the outer surface crack depth;
S203, acquiring contour information of black stripes based on Canny edge detection, acquiring a plurality of crack widths among black stripe openings according to the contour information of the black stripes, sorting the crack widths in an incremental manner to obtain a crack width sorting table, taking the last crack width in the crack width sorting table as an external crack width, and acquiring a corresponding third weight value according to the external crack width;
S204, acquiring a preset crack length judgment threshold according to the outer surface crack length;
S205, acquiring a preset crack depth judgment threshold according to the outer surface crack depth;
s206, acquiring a preset crack width judgment threshold according to the apparent crack width;
S207, calculating the surface integrity according to the outer surface crack length, the outer surface crack depth, the outer surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is as follows:
Wherein B (M) represents surface integrity, H (c) represents surface crack length, H(s) represents surface crack depth, H (k) represents surface crack width, Y (c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y (k) represents a preset crack width judgment threshold, d (Y) represents a first weight value, d (e) represents a second weight value, and d(s) represents a third weight value;
S208, acquiring first dark stripes and side flatness of the side face of the PCB according to the black-and-white surface image information, acquiring splitting widths of the side stripes according to the first dark stripes, and acquiring side integrity according to the splitting widths of the side stripes and the side flatness, wherein the side integrity is calculated in the same way as the surface integrity;
s209, acquiring a corresponding surface integrity weight value according to the surface integrity;
S2010, acquiring a corresponding side integrity weight value according to the side integrity;
s2011, calculating the quality index of the PCB according to the surface integrity and the side integrity, wherein the calculation formula is as follows:
s(c)=[B(M)*a+C(D)*b]*100%;
Wherein s (C) represents a PCB board quality index, B (M) represents surface integrity, a represents a surface integrity weight value, C (D) represents side integrity, and B represents a side integrity weight value.
As described in the above steps S201-S2011, since the defects of the PCB are usually side and surface cracks, it is necessary to find out the positions of the cracks of the PCB, and since the cracks are black or deep black in the image after gray processing, the invention firstly performs gray processing on the image information of the PCB to obtain black-and-white surface image information, and screens the black-and-white surface image information to obtain black stripes, so that the positions of the defects on the surface of the PCB can be determined by the black stripes, and since the lengths, widths and depths of the cracks all have a certain influence on the PCB, coordinates are set on both ends of the black stripes to obtain first coordinates and second coordinates, and the apparent crack lengths of the black stripes are calculated according to the first coordinates and the second coordinates, for example, one end of each crack is at coordinates (100, 200), the other end of each crack is at coordinates (300, 400), and the length unit mm can be calculated by the following formula: And obtaining a corresponding first weight value according to the outer crack length, thus being beneficial to evaluating the severity of cracks after obtaining the outer crack length, then transmitting a plurality of sound wave pulse signals to the black cracks based on a sound wave scanner, receiving a plurality of rebound signals returned after the sound wave pulse signals strike the black cracks, obtaining the outer crack depth according to the rebound signals, obtaining a corresponding second weight value according to the outer crack depth, obtaining the contour information of the black cracks based on Canny edge detection, obtaining a plurality of crack widths among the black crack openings according to the contour information of the black cracks, sorting the crack widths according to an incremental mode to obtain a crack width sorting table, taking the last crack width in the crack width sorting table as the outer crack width, the surface crack width is also an important parameter basis for judging the integrity of the PCB, a preset crack length judgment threshold value is obtained according to the surface crack length, a preset crack depth judgment threshold value is obtained according to the surface crack depth, a preset crack width judgment threshold value is obtained according to the surface crack width, and finally, the surface integrity is calculated according to the surface crack length, the surface crack depth, the surface crack width, the preset crack length judgment threshold value, the preset crack depth judgment threshold value, the preset crack width judgment threshold value, the first weight value, the second weight value and the third weight value, so that the integrity of the surface of the PCB can be judged through the surface integrity, the basis is provided for calculating the quality index of the PCB, and then the first dark color stripes and the side surface evenness of the PCB side surface are obtained according to the black-white surface image information, and obtaining a side surface stripe splitting width according to the first dark stripe, and obtaining a side surface integrity according to the side surface stripe splitting width and the side surface flatness, wherein the side surface integrity calculating mode is the same as the surface integrity calculating mode, so that the quality index of the PCB board can be obtained completely when the surface integrity and the side surface integrity are obtained, then a corresponding surface integrity weight value is obtained according to the surface integrity, then a corresponding side surface integrity weight value is obtained according to the side surface integrity, finally, the quality index of the PCB board is calculated according to the surface integrity and the side surface integrity, and thus the integrity of the PCB board can be known through the PCB board quality index, and an important basis is provided for judging the defects of the subsequent PCB board.
In one embodiment, the step S3 of obtaining the defect position information of the take-out plate according to the appearance characteristic information of the take-out plate includes:
S301, acquiring a plurality of corresponding first angular fixed point coordinates according to the material plate area, and selecting one as a first origin coordinate according to the plurality of first angular fixed point coordinates;
s302, acquiring a corresponding first center point according to the black stripe, and acquiring a first coordinate of the first center point according to a first origin coordinate and the first center point;
s303, acquiring a plurality of corresponding second corner fixed point coordinates according to the side surface area, and selecting one as a second origin coordinate according to the plurality of second corner fixed point coordinates;
Acquiring a corresponding second center point according to the first dark stripe, and acquiring a second coordinate of the second center point according to a second origin coordinate and the second center point;
S304, taking the position information corresponding to the first coordinate and the second coordinate as the position information of the material plate defect.
As described in the above steps S301-S304, after determining that the PCB panel has a defect, the defect position needs to be identified, and a basis is provided for re-cutting and typesetting of the subsequent PCB panel, so that a corresponding plurality of first corner fixed point coordinates are obtained according to the panel area, and one is selected as a first origin coordinate according to the plurality of first corner fixed point coordinates, so that a coordinate system can be established according to the first origin coordinate, so that subsequent calculation and positioning are facilitated, then a corresponding first center point is obtained according to the black stripe, and a first coordinate of the first center point is obtained according to the first origin coordinate and the first center point, then a corresponding plurality of second corner fixed point coordinates are obtained according to the side surface area, and one is selected as a second origin coordinate according to the plurality of second corner fixed point coordinates, so that a potential defect area can be deduced through the position of the black stripe, and a basis is provided for subsequent re-typesetting, and a corresponding second center point is obtained according to the first dark stripe, and a second coordinate is obtained according to the second origin coordinate (as shown in fig. 4) is obtained according to the second origin coordinate and the second center point, and the position of the second origin coordinate is obtained according to the second origin coordinate and the second center point, and the preset position of the subsequent panel is required to be cut and suitable for the subsequent layout.
In one embodiment, the step S3 of marking the area of the PCB board according to the location information of the defect of the board to obtain the area of the defect marked PCB board includes:
S301, obtaining corresponding dark stripe depth according to the first dark stripe, and obtaining the area of the PCB with the side defect according to the dark stripe depth and the side stripe splitting width;
S302, acquiring the surface defect PCB material plate area according to a second origin coordinate and an outer surface crack length, wherein the second origin coordinate is used as a circle center, and the outer surface crack length is used as a diameter;
S303, marking the area of the side defect PCB material plate and the area of the surface defect PCB material plate respectively to obtain the area of the side defect marking PCB material plate and the area of the surface defect marking PCB material plate, and taking the area of the side defect marking PCB material plate and the area of the surface defect marking PCB material plate as the area of the defect marking PCB material plate.
As described in the above steps S301-S303, since the position of the material plate defect affects the segmentation and typesetting of the PCB, the area corresponding to the position of the material plate defect needs to be marked, and then the data support is provided for the subsequent re-planning, on the basis of this, the invention obtains the corresponding depth of the dark stripe according to the first dark stripe, obtains the area of the PCB material plate with the side defect according to the depth of the dark stripe and the splitting width of the side stripe, because the surface of the PCB material plate needs to be cut when the defective part of the PCB material plate is rejected, the depth of the dark stripe represents the width in the surface, the splitting width of the side stripe represents the length in the surface (as shown in fig. 4), and the area of the PCB material plate with the side defect is the product of the depth of the dark stripe and the splitting width of the side stripe, and then obtaining the surface defect PCB material plate area according to the second origin coordinates and the outer crack length, wherein the second origin coordinates are used as the center of a circle, the outer crack length is used as the diameter (shown in figure 4), so that after the defects of the side and the surface are standardized, important basis (such as defect path avoidance) can be provided for subsequent rearrangement, then the side defect PCB material plate area and the surface defect PCB material plate area are marked respectively to obtain the side defect mark PCB material plate area and the surface defect mark PCB material plate area, the side defect mark PCB material plate area and the surface defect mark PCB material plate area are used as the defect mark PCB material plate area, after knowing the defect mark PCB material plate area, the basis can be provided for the rearrangement for scrapping of the PCB material plate due to the defects, so that a large amount of materials can be saved after the rearrangement, avoiding a great deal of waste.
In one embodiment, the step S4 of performing layout adaptation on the plurality of preset division requirement areas and the defect mark PCB panel surface based on CAD to obtain adapted layout information includes:
S401, acquiring the actual use area of the PCB according to the defect marked PCB;
s402, randomly arranging the preset partition required area as particles on an actual use area based on particle swarm optimization to obtain a plurality of typesetting layouts, wherein each particle represents one type of typesetting layout of the PCB;
S403, acquiring corresponding layout characteristic parameters according to the typesetting layout, wherein the layout characteristic parameters comprise a plurality of cutting paths, a plurality of typesetting area utilization rates, a plurality of segmentation safety distances and a plurality of preset segmentation requirement area typesetting quantities, and sequentially calculating a plurality of fitness comprehensive values according to the cutting paths, the plurality of typesetting area utilization rates, the plurality of segmentation safety distances and the plurality of preset segmentation requirement area typesetting quantities, wherein a calculation formula is as follows:
S(i...n)＝[L(J)i*Ci+X(L)i*Di+J(L)i*Ei+S(L)i*Fi]i;...;
[L(J)n*Cn+X(L)n*Dn+J(L)n*En+S(L)n*Fn]n;
Wherein S (i..n) represents an i-th to n-th applicability integrated value, L (J) i represents an i-th cut path, C i represents an i-th cut path weight value, X (L) i represents an i-th layout area utilization rate, D i represents an i-th layout area utilization rate weight value, J (L) i represents an i-th division safety distance, E i represents an i-th division safety distance weight value, S (L) i represents an i-th preset division required area layout number, F i represents an i-th preset division required area layout number weight value, wherein i represents a count number, i=1, 2, 3..n;
S404, screening the plurality of applicability comprehensive values according to the maximum value to obtain a first screening applicability comprehensive value, taking the typesetting layout corresponding to the first screening applicability comprehensive value as an optimal typesetting scheme, and typesetting and adapting the PCB material taking plate based on CAD according to the typesetting layout corresponding to the first screening applicability comprehensive value to obtain adapted typesetting information.
According to the invention, as described in the steps S401-S404, the actual use area of the PCB material plate is obtained according to the area of the defect marked PCB material plate, thus, the PCB material plate can be subjected to re-typesetting segmentation according to the actual use area, then the preset segmentation requirement area is randomly arranged on the actual use area as particles based on particle swarm optimization to obtain a plurality of typesetting layouts, wherein each particle represents a PCB layout, wherein the particle swarm optimization algorithm is an optimization method for simulating social behaviors, the optimal solution of problems is found through information exchange and cooperation among particles, the simplicity and the flexibility of the optimal solution are enabled to be effective tools for solving various complex optimization problems, and as a plurality of factors are needed to be considered in the re-typesetting process, each typesetting scheme simultaneously corresponds to a group of operation data, the common operation data comprises a cutting path, a typesetting area utilization rate, a segmentation safety distance and a preset segmentation requirement area typesetting quantity, so that only the optimal solution is needed to be found in the factors, and meanwhile, the optimal solution is evaluated through an application degree comprehensive value, therefore, the preset layout parameter is obtained, the preset layout parameter comprises a plurality of the preset layout parameter, the preset layout requirement distance is calculated, the multiple segmentation area is calculated, the multiple segmentation requirement area is divided by a plurality of the preset, and the preset segmentation requirement area is calculated according to the preset, the multiple layout requirement area is divided by the preset, and the multiple layout requirement area is calculated by the multiple application requirement area is calculated by the multiple factor to be obtained by the multiple segmentation requirement. And taking the typesetting layout corresponding to the first screening suitability comprehensive value as an optimal typesetting scheme, and typesetting and adapting the PCB material plate based on CAD according to the typesetting layout corresponding to the first screening suitability comprehensive value to obtain adaptive typesetting information, so that an optimal segmentation scheme can be provided for the PCB material plate through the adaptive typesetting information.
In one embodiment, the step S5 of performing cutting and typesetting processing on the PCB material board according to the adaptive typesetting information includes:
s501, acquiring a plurality of corresponding first preset division requirement areas according to the adaptive typesetting information;
S502, acquiring corresponding first cutting paths according to the adaptive typesetting information, and cutting and typesetting the plurality of first preset cutting required areas on the PCB according to the first cutting paths.
As described in the above steps S501-S502, the present invention obtains a plurality of corresponding first preset dividing required areas according to the adaptive typesetting information, then obtains a corresponding first cutting path according to the adaptive typesetting information, and performs cutting typesetting processing on the PCB material board according to the first cutting path on the plurality of first preset dividing required areas, so that the PCB material board after being typeset again can reuse the defective PCB material board, and meanwhile, the problem of wasting a large amount of material boards can be avoided.
The application also provides a PCB cutting typesetting system, which comprises:
The PCB material plate segmentation device comprises a first acquisition module, a second acquisition module and a segmentation module, wherein the first acquisition module is used for acquiring segmentation characteristic information of a PCB material plate, and the segmentation characteristic information comprises material plate image information and a plurality of preset segmentation required areas;
The second acquisition module is used for acquiring the surface area and the appearance characteristic information of the material plate according to the image information of the material plate, acquiring the surface integrity and the side integrity according to the appearance characteristic information of the material plate and acquiring the quality index of the PCB according to the surface integrity and the side integrity;
the first judging module is used for judging whether the quality index of the PCB is larger than a preset quality index of the PCB;
If the quality index of the PCB is not greater than the preset quality index of the PCB, judging that the PCB has defects, obtaining the defect position information of the material plate according to the appearance characteristic information of the material plate, and marking the material plate area according to the defect position information of the material plate to obtain the defect marked PCB area;
the first typesetting module is used for typesetting and adapting a plurality of preset division required areas and the area of the PCB material plate with the defect mark based on CAD to obtain adapting typesetting information;
And the first processing module is used for cutting and typesetting the PCB material plate according to the adaptive typesetting information.
In one embodiment, the second acquisition module includes:
The first acquisition unit is used for carrying out gray processing on the material plate image information to obtain black-and-white surface image information, screening the black-and-white surface image information to obtain black stripes, respectively setting coordinates at two ends of the black stripes to obtain first coordinates and second coordinates, calculating the outer crack length of the black stripes according to the first coordinates and the second coordinates, and acquiring corresponding first weight values according to the outer crack length;
The second acquisition unit is used for transmitting a plurality of sound wave pulse signals to the black stripe based on the sound wave scanner, receiving a plurality of rebound signals returned after the sound wave pulse signals strike the black stripe, acquiring the outer surface crack depth according to the rebound signals, and acquiring a corresponding second weight value according to the outer surface crack depth;
A third obtaining unit, configured to obtain contour information of black stripes based on Canny edge detection, obtain a plurality of crack widths between black stripe openings according to the contour information of the black stripes, sort the plurality of crack widths in an incremental manner, obtain a crack width sorting table, use a last crack width in the crack width sorting table as an external crack width, and obtain a corresponding third weight value according to the external crack width;
A fourth obtaining unit, configured to obtain a preset fracture length judgment threshold according to the outer surface fracture length;
A fifth obtaining unit, configured to obtain a preset fracture depth judgment threshold according to the outer surface fracture depth;
a sixth obtaining unit, configured to obtain a preset crack width judgment threshold according to the apparent crack width;
The first calculating unit is configured to calculate surface integrity according to the outer surface crack length, the outer surface crack depth, the outer surface crack width, the preset crack length judgment threshold, the preset crack depth judgment threshold, the preset crack width judgment threshold, the first weight value, the second weight value and the third weight value, where the calculating formula is as follows:
Wherein B (M) represents surface integrity, H (c) represents surface crack length, H(s) represents surface crack depth, H (k) represents surface crack width, Y (c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y (k) represents a preset crack width judgment threshold, d (Y) represents a first weight value, d (e) represents a second weight value, and d(s) represents a third weight value;
a seventh obtaining unit, configured to obtain a first dark stripe and a side flatness of a side surface of the PCB according to the black-and-white surface image information, obtain a splitting width of the side stripe according to the first dark stripe, and obtain a side integrity according to the splitting width of the side stripe and the side flatness, where a side integrity calculating manner is the same as a surface integrity calculating manner;
an eighth obtaining unit, configured to obtain a corresponding surface integrity weight value according to the surface integrity;
a ninth obtaining unit, configured to obtain a corresponding side integrity weight value according to the side integrity;
The second calculating unit is used for calculating the quality index of the PCB according to the surface integrity and the side integrity, wherein the calculating formula is as follows:
s(c)=[B(M)*a+C(D)*b]*100%;
Wherein s (C) represents a PCB board quality index, B (M) represents surface integrity, a represents a surface integrity weight value, C (D) represents side integrity, and B represents a side integrity weight value.
The present invention also provides a computer readable storage medium having stored thereon a computer program which when executed by a processor implements the steps for a PCB cutting typesetting method described above.
Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by hardware associated with a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium provided by the present application and used in embodiments may include non-volatile and/or volatile memory. The nonvolatile memory can include Read Only Memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual speed data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (SYNCHLINK) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), among others.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, apparatus, article, or method. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, apparatus, article, or method that comprises the element.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.

Claims (10)

1.一种PCB切割排版方法，其特征在于，包括：1. A PCB cutting and layout method, characterized by comprising: 获取PCB料板的分割特征信息，其中，分割特征信息包括料板图像信息、多个预设分割需求面积；Acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas; 根据所述料板图像信息获取料板面积和料板外观特征信息，并根据料板外观特征信息获取表面完整度和侧面完整度，根据所述表面完整度和侧面完整度获取PCB板材质量指数；Acquire the material board area and material board appearance feature information according to the material board image information, acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity; 判断所述PCB板材质量指数是否大于预设PCB板材质量指数；Determine whether the PCB board quality index is greater than a preset PCB board quality index; 若PCB板材质量指数不大于预设PCB板材质量指数，则判定PCB料板存在缺陷，并根据所述料板外观特征信息获取料板缺陷位置信息，根据所述料板缺陷位置信息对所述料板面积进行标记，得到缺陷标记PCB料板面积；If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area; 基于CAD将多个所述预设分割需求面积与缺陷标记PCB料板面积进行排版适配，得到适配排版信息；Based on CAD, multiple preset segmentation required areas are matched with defect-marked PCB material areas to obtain matching layout information; 根据所述适配排版信息对PCB料板进行切割排版加工。The PCB material board is cut and laid out according to the adapted layout information. 2.根据权利要求1所述的PCB切割排版方法，其特征在于，所述根据料板外观特征信息获取表面完整度和侧面完整度，根据所述表面完整度和侧面完整度获取PCB板材质量指数的步骤，包括：2. The PCB cutting and typesetting method according to claim 1, characterized in that the step of obtaining the surface integrity and the side integrity according to the appearance characteristic information of the material board, and obtaining the PCB board quality index according to the surface integrity and the side integrity comprises: 对所述料板图像信息进行灰度处理，得到黑白表面图像信息，并对所述黑白表面图像信息进行筛选，得到黑色条纹，对黑色条纹的两端分别设立坐标，得到第一坐标和第二坐标，并根据第一坐标和第二坐标计算黑色条纹的外表裂痕长度，并根据所述外表裂痕长度获取对应的第一权重值；Grayscale processing is performed on the image information of the material plate to obtain black and white surface image information, and the black and white surface image information is screened to obtain black stripes, coordinates are respectively set for both ends of the black stripes to obtain first coordinates and second coordinates, and the surface crack length of the black stripes is calculated according to the first coordinates and the second coordinates, and a corresponding first weight value is obtained according to the surface crack length; 基于声波扫描器向黑色条纹处发射多个声波脉冲信号，并接收多个所述声波脉冲信号撞击黑色条纹后返回的多个回弹信号，根据多个所述回弹信号获取外表裂痕深度，并根据所述外表裂痕深度获取对应的第二权重值；Based on the sonic scanner, a plurality of sonic pulse signals are emitted to the black stripes, and a plurality of rebound signals returned after the sonic pulse signals hit the black stripes are received, the surface crack depth is obtained according to the plurality of rebound signals, and the corresponding second weight value is obtained according to the surface crack depth; 基于Canny边缘检测获取黑色条纹的轮廓信息，并根据所述黑色条纹的轮廓信息获取黑色条纹开口之间的多个裂纹宽度，对多个所述裂纹宽度按照递增方式进行排序，得到裂纹宽度排序表，将所述裂纹宽度排序表中末位裂纹宽度作为外表裂纹宽度，并根据所述外表裂纹宽度获取对应的第三权重值；Acquire the contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between the openings of the black stripes according to the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, take the last crack width in the crack width sorting table as the appearance crack width, and acquire the corresponding third weight value according to the appearance crack width; 根据所述外表裂痕长度获取预设裂痕长度判断阈值；Obtaining a preset crack length judgment threshold according to the surface crack length; 根据所述外表裂痕深度获取预设裂痕深度判断阈值；Obtaining a preset crack depth judgment threshold according to the surface crack depth; 根据所述外表裂纹宽度获取预设裂纹宽度判断阈值；Obtaining a preset crack width judgment threshold according to the surface crack width; 根据所述外表裂痕长度、外表裂痕深度、外表裂纹宽度、预设裂痕长度判断阈值、预设裂痕深度判断阈值、预设裂纹宽度判断阈值、第一权重值、第二权重值和第三权重值计算表面完整度，其中，计算公式为：The surface integrity is calculated according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is: 其中，B(M)表示表面完整度，H(c)表示外表裂痕长度，H(s)表示外表裂痕深度，H(k)表示外表裂纹宽度，Y(c)表示预设裂痕长度判断阈值，Y(s)表示预设裂痕深度判断阈值，Y(k)表示预设裂纹宽度判断阈值，d(y)表示第一权重值，d(e)表示第二权重值，d(s)表示第三权重值；Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value; 根据所述黑白表面图像信息获取PCB侧面的第一深色条纹和侧面平整度，并根据所述第一深色条纹获取侧面条纹裂开宽度，根据所述侧面条纹裂开宽度和侧面平整度获取侧面完整度，其中，侧面完整度计算方式与表面完整度的计算方式相同；Acquire a first dark stripe and side flatness of the PCB side according to the black-and-white surface image information, acquire a side stripe crack width according to the first dark stripe, and acquire a side integrity according to the side stripe crack width and side flatness, wherein the side integrity is calculated in the same manner as the surface integrity; 根据所述表面完整度获取对应的表面完整度权重值；Acquire a corresponding surface integrity weight value according to the surface integrity; 根据所述侧面完整度获取对应的侧面完整度权重值；Acquire a corresponding aspect integrity weight value according to the aspect integrity; 根据所述表面完整度和侧面完整度计算PCB板材质量指数，其中，计算公式为：The PCB board quality index is calculated according to the surface integrity and the side integrity, wherein the calculation formula is: s(c)＝[B(M)*a+C(D)*b]*100％；s(c)=[B(M)*a+C(D)*b]*100%; 其中，s(c)表示PCB板材质量指数，B(M)表示表面完整度，a表示表面完整度权重值，C(D)表示侧面完整度，b表示侧面完整度权重值。Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value. 3.根据权利要求1所述的PCB切割排版方法，其特征在于，所述根据所述料板外观特征信息获取料板缺陷位置信息的步骤，包括：3. The PCB cutting and layout method according to claim 1, characterized in that the step of obtaining the defect position information of the material board according to the appearance feature information of the material board comprises: 根据所述料板面积获取对应的多个第一边角定点坐标，并根据多个所述第一边角定点坐标选取一个作为第一原点坐标；Acquire a plurality of first corner fixed-point coordinates corresponding to the sheet area, and select one of the plurality of first corner fixed-point coordinates as the first origin coordinate; 根据黑色条纹获取对应的第一中心点，并根据第一原点坐标和第一中心点获取第一中心点的第一坐标；Obtaining a corresponding first center point according to the black stripes, and obtaining a first coordinate of the first center point according to the first origin coordinates and the first center point; 根据侧表面面积获取对应的多个第二边角定点坐标，并根据多个所述第二边角定点坐标选取一个作为第二原点坐标；Acquire a plurality of corresponding second corner fixed point coordinates according to the side surface area, and select one of the plurality of second corner fixed point coordinates as the second origin coordinate; 根据第一深色条纹获取对应的第二中心点，并根据第二原点坐标和第二中心点获取第二中心点的第二坐标；Acquire a corresponding second center point according to the first dark stripe, and acquire a second coordinate of the second center point according to the second origin coordinates and the second center point; 将第一坐标和第二坐标对应的位置信息作为料板缺陷位置信息。The position information corresponding to the first coordinate and the second coordinate is used as the sheet material defect position information. 4.根据权利要求1所述的PCB切割排版方法，其特征在于，所述根据所述料板缺陷位置信息对所述料板面积进行标记，得到缺陷标记PCB料板面积的步骤，包括：4. The PCB cutting and layout method according to claim 1, characterized in that the step of marking the sheet area according to the sheet defect position information to obtain the defect marked PCB sheet area comprises: 根据第一深色条纹获取对应的深色条纹深度，根据深色条纹深度和侧面条纹裂开宽度获取侧面缺陷PCB料板面积；According to the first dark stripe, the corresponding dark stripe depth is obtained, and according to the dark stripe depth and the side stripe crack width, the side defective PCB material board area is obtained; 根据第二原点坐标和外表裂痕长度获取表面缺陷PCB料板面积，其中，将第二原点坐标作为圆心，外表裂痕长度作为直径；Obtain the surface defective PCB material board area according to the second origin coordinate and the surface crack length, wherein the second origin coordinate is used as the center of the circle and the surface crack length is used as the diameter; 分别对侧面缺陷PCB料板面积和表面缺陷PCB料板面积进行标记，得到侧面缺陷标记PCB料板面积和表面缺陷标记PCB料板面积，并将所述侧面缺陷标记PCB料板面积和表面缺陷标记PCB料板面积作为缺陷标记PCB料板面积。The side defect PCB material board area and the surface defect PCB material board area are marked respectively to obtain the side defect marked PCB material board area and the surface defect marked PCB material board area, and the side defect marked PCB material board area and the surface defect marked PCB material board area are used as the defect marked PCB material board area. 5.根据权利要求1所述的PCB切割排版方法，其特征在于，所述基于CAD将多个所述预设分割需求面积与缺陷标记PCB料板面积进行排版适配，得到适配排版信息的步骤，包括：5. The PCB cutting layout method according to claim 1, characterized in that the step of performing layout adaptation on the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain the adapted layout information comprises: 根据缺陷标记PCB料板面积获取PCB料板的实际使用面积；Obtain the actual use area of the PCB board according to the defect marked PCB board area; 基于粒子群优化将所述预设分割需求面积作为粒子随机排布在实际使用面积上，得到多个排版布局，其中，每个粒子代表一种PCB的排版布局；Based on particle swarm optimization, the preset segmentation required area is randomly arranged as particles on the actual use area to obtain multiple layouts, wherein each particle represents a layout of the PCB; 根据多个所述排版布局获取对应的布局特征参数，其中，布局特征参数包括多个切割路径、多个排版面积利用率、多个分割安全距离和多个预设分割需求面积排版数量，并根据多个所述切割路径、多个所述排版面积利用率、多个所述分割安全距离和多个所述预设分割需求面积排版数量依次计算多个适用度综合值，其中，计算公式为：According to the plurality of layout layouts, corresponding layout characteristic parameters are obtained, wherein the layout characteristic parameters include a plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, and according to the plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, a plurality of fitness comprehensive values are calculated in sequence, wherein the calculation formula is: S(i...n)＝[L(J)i*Ci+X(L)i*Di+J(L)i*Ei+S(L)i*Fi]i；...；S(i...n)=[L(J) i *C i +X(L) i *D i +J(L) i *E i +S(L) i *F i ] i ;.. .; [L(J)n*Cn+X(L)n*Dn+J(L)n*En+S(L)n*Fn]n；[L(J) n *C n +X(L) n *D n +J(L) n *E n +S(L) n *F n ] n ; 其中，S(i...n)表示第i个至第n个适用度综合值，L(J)i表示第i个切割路径，Ci表示第i个切割路径权重值，X(L)i表示第i个排版面积利用率，Di表示第i个排版面积利用率权重值，J(L)i表示第i个分割安全距离，Ei表示第i个分割安全距离权重值，S(L)i表示第i个预设分割需求面积排版数量，Fi表示第i个预设分割需求面积排版数量权重值，其中，i表示计数标号，i＝1、2、3...n；Wherein, S(i...n) represents the comprehensive value of suitability from the i-th to the n-th, L(J) i represents the i-th cutting path, Ci represents the i-th cutting path weight value, X(L) i represents the i-th layout area utilization rate, Di represents the i-th layout area utilization rate weight value, J(L) i represents the i-th segmentation safety distance, E i represents the i-th segmentation safety distance weight value, S(L) i represents the i-th preset segmentation required area layout quantity, F i represents the i-th preset segmentation required area layout quantity weight value, wherein i represents the counting number, i=1, 2, 3...n; 对多个所述适用度综合值按照最大数值进行筛选，得到第一筛选适用度综合值，将所述第一筛选适用度综合值对应的排版布局作为最优排版方案，并基于CAD根据所述第一筛选适用度综合值对应的排版布局对PCB料板进行排版适配，得到适配排版信息。The multiple comprehensive suitability values are screened according to the maximum value to obtain a first screening comprehensive suitability value, the layout corresponding to the first screening comprehensive suitability value is used as the optimal layout solution, and the PCB material board is layout-adapted based on the layout layout corresponding to the first screening comprehensive suitability value to obtain adapted layout information. 6.根据权利要求1所述的PCB切割排版方法，其特征在于，所述根据所述适配排版信息对PCB料板进行切割排版加工的步骤，包括：6. The PCB cutting and layout method according to claim 1, characterized in that the step of cutting and layout processing the PCB material board according to the adapted layout information comprises: 根据所述适配排版信息获取对应的多个第一预设分割需求面积；Acquire a plurality of corresponding first preset segmentation required areas according to the adaptive layout information; 根据所述适配排版信息获取对应的第一切割路径，并将多个所述第一预设分割需求面积按照第一切割路径在PCB料板上进行切割排版加工。A corresponding first cutting path is acquired according to the adaptation layout information, and a plurality of the first preset segmentation required areas are cut and laid out on the PCB material board according to the first cutting path. 7.一种PCB切割排版系统，其特征在于，包括：7. A PCB cutting and layout system, characterized by comprising: 第一获取模块，用于获取PCB料板的分割特征信息，其中，分割特征信息包括料板图像信息、多个预设分割需求面积；A first acquisition module is used to acquire segmentation feature information of a PCB material board, wherein the segmentation feature information includes material board image information and a plurality of preset segmentation required areas; 第二获取模块，用于根据所述料板图像信息获取料板面积和料板外观特征信息，并根据料板外观特征信息获取表面完整度和侧面完整度，根据所述表面完整度和侧面完整度获取PCB板材质量指数；A second acquisition module is used to acquire the material board area and material board appearance feature information according to the material board image information, and acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity; 第一判断模块，用于判断所述PCB板材质量指数是否大于预设PCB板材质量指数；A first judgment module is used to judge whether the PCB board quality index is greater than a preset PCB board quality index; 若PCB板材质量指数不大于预设PCB板材质量指数，则判定PCB料板存在缺陷，并根据所述料板外观特征信息获取料板缺陷位置信息，根据所述料板缺陷位置信息对所述料板面积进行标记，得到缺陷标记PCB料板面积；If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect position information is obtained according to the board appearance feature information, and the board area is marked according to the board defect position information to obtain the defect marked PCB board area; 第一排版模块，用于基于CAD将多个所述预设分割需求面积与缺陷标记PCB料板面积进行排版适配，得到适配排版信息；The first layout module is used to layout and adapt the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain adaptation layout information; 第一加工模块，用于根据所述适配排版信息对PCB料板进行切割排版加工。The first processing module is used to perform cutting and layout processing on the PCB material board according to the adapted layout information. 8.根据权利要求7所述的PCB切割排版系统，其特征在于，所述第二获取模块，包括：8. The PCB cutting and typesetting system according to claim 7, wherein the second acquisition module comprises: 第一获取单元，用于对所述料板图像信息进行灰度处理，得到黑白表面图像信息，并对所述黑白表面图像信息进行筛选，得到黑色条纹，对黑色条纹的两端分别设立坐标，得到第一坐标和第二坐标，并根据第一坐标和第二坐标计算黑色条纹的外表裂痕长度，并根据所述外表裂痕长度获取对应的第一权重值；a first acquisition unit, configured to grayscale the sheet image information to obtain black-and-white surface image information, filter the black-and-white surface image information to obtain black stripes, respectively set coordinates at both ends of the black stripes to obtain first coordinates and second coordinates, calculate the surface crack length of the black stripes according to the first coordinates and the second coordinates, and obtain a corresponding first weight value according to the surface crack length; 第二获取单元，用于基于声波扫描器向黑色条纹处发射多个声波脉冲信号，并接收多个所述声波脉冲信号撞击黑色条纹后返回的多个回弹信号，根据多个所述回弹信号获取外表裂痕深度，并根据所述外表裂痕深度获取对应的第二权重值；A second acquisition unit is used to transmit a plurality of acoustic wave pulse signals to the black stripes based on an acoustic wave scanner, and receive a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, acquire the surface crack depth according to the plurality of rebound signals, and acquire a corresponding second weight value according to the surface crack depth; 第三获取单元，用于基于Canny边缘检测获取黑色条纹的轮廓信息，并根据所述黑色条纹的轮廓信息获取黑色条纹开口之间的多个裂纹宽度，对多个所述裂纹宽度按照递增方式进行排序，得到裂纹宽度排序表，将所述裂纹宽度排序表中末位裂纹宽度作为外表裂纹宽度，并根据所述外表裂纹宽度获取对应的第三权重值；a third acquisition unit, configured to acquire contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between openings of the black stripes according to the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, take the last crack width in the crack width sorting table as the appearance crack width, and acquire a corresponding third weight value according to the appearance crack width; 第四获取单元，用于根据所述外表裂痕长度获取预设裂痕长度判断阈值；A fourth acquisition unit, configured to acquire a preset crack length judgment threshold according to the surface crack length; 第五获取单元，用于根据所述外表裂痕深度获取预设裂痕深度判断阈值；A fifth acquisition unit, configured to acquire a preset crack depth judgment threshold according to the surface crack depth; 第六获取单元，用于根据所述外表裂纹宽度获取预设裂纹宽度判断阈值；A sixth acquisition unit, configured to acquire a preset crack width judgment threshold according to the surface crack width; 第一计算单元，用于根据所述外表裂痕长度、外表裂痕深度、外表裂纹宽度、预设裂痕长度判断阈值、预设裂痕深度判断阈值、预设裂纹宽度判断阈值、第一权重值、第二权重值和第三权重值计算表面完整度，其中，计算公式为：A first calculation unit is used to calculate the surface integrity according to the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value and a third weight value, wherein the calculation formula is: 其中，B(M)表示表面完整度，H(c)表示外表裂痕长度，H(s)表示外表裂痕深度，H(k)表示外表裂纹宽度，Y(c)表示预设裂痕长度判断阈值，Y(s)表示预设裂痕深度判断阈值，Y(k)表示预设裂纹宽度判断阈值，d(y)表示第一权重值，d(e)表示第二权重值，d(s)表示第三权重值；Wherein, B(M) represents the surface integrity, H(c) represents the surface crack length, H(s) represents the surface crack depth, H(k) represents the surface crack width, Y(c) represents the preset crack length judgment threshold, Y(s) represents the preset crack depth judgment threshold, Y(k) represents the preset crack width judgment threshold, d(y) represents the first weight value, d(e) represents the second weight value, and d(s) represents the third weight value; 第七获取单元，用于根据所述黑白表面图像信息获取PCB侧面的第一深色条纹和侧面平整度，并根据所述第一深色条纹获取侧面条纹裂开宽度，根据所述侧面条纹裂开宽度和侧面平整度获取侧面完整度，其中，侧面完整度计算方式与表面完整度的计算方式相同；a seventh acquisition unit, configured to acquire a first dark stripe and a side flatness of a side surface of the PCB according to the black-and-white surface image information, acquire a side stripe crack width according to the first dark stripe, and acquire a side integrity according to the side stripe crack width and the side flatness, wherein a side integrity calculation method is the same as a surface integrity calculation method; 第八获取单元，用于根据所述表面完整度获取对应的表面完整度权重值；An eighth acquisition unit, configured to acquire a corresponding surface integrity weight value according to the surface integrity; 第九获取单元，用于根据所述侧面完整度获取对应的侧面完整度权重值；A ninth acquisition unit, configured to acquire a corresponding aspect integrity weight value according to the aspect integrity; 第二计算单元，用于根据所述表面完整度和侧面完整度计算PCB板材质量指数，其中，计算公式为：The second calculation unit is used to calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is: s(c)＝[B(M)*a+C(D)*b]*100％；s(c)=[B(M)*a+C(D)*b]*100%; 其中，s(c)表示PCB板材质量指数，B(M)表示表面完整度，a表示表面完整度权重值，C(D)表示侧面完整度，b表示侧面完整度权重值。Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value. 9.一种计算机设备，包括存储器和处理器，所述存储器存储有计算机程序，其特征在于，所述处理器执行所述计算机程序时实现权利要求1至6中任一项所述方法的步骤。9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein the processor implements the steps of the method according to any one of claims 1 to 6 when executing the computer program. 10.一种计算机可读存储介质，其上存储有计算机程序，其特征在于，所述计算机程序被处理器执行时实现权利要求1至6中任一项所述的方法的步骤。10. A computer-readable storage medium having a computer program stored thereon, wherein when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.
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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100627488B1 (en) * 2005-05-16 2006-09-25 주식회사 포스코 Method of Determination of Surface Quality of Steel Plate Using Surface Defect Information
US20080120585A1 (en) * 2006-11-21 2008-05-22 Kabushiki Kaisha Toshiba Delay fault test quality calculation apparatus, delay fault test quality calculation method, and delay fault test pattern generation apparatus
CN111410414A (en) * 2020-04-27 2020-07-14 江西财经大学 Implementation method of glass cutting optimization technology
CN114971186A (en) * 2022-04-25 2022-08-30 哈尔滨理工大学 Method for evaluating integrity of machined surface
CN116000474A (en) * 2023-03-08 2023-04-25 杭州乾瑭云科技有限公司 A method and system for nesting and typesetting mixed edge analysis based on laser cutting
CN117708608A (en) * 2023-12-13 2024-03-15 杭州杭叉精密制造有限公司 Typesetting method, typesetting device, typesetting equipment and typesetting medium for plate sleeve
CN117700090A (en) * 2023-12-28 2024-03-15 广东南亮艺术玻璃科技股份有限公司 Glass cutting typesetting method with high utilization rate
CN118013923A (en) * 2024-04-02 2024-05-10 江西理工大学 A PCB automatic layout result detection method based on OpenGL
CN118794962A (en) * 2024-06-19 2024-10-18 深圳市黄金坞贵金属精炼有限公司 A product quality detection method and system for enamel colored porcelain

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100627488B1 (en) * 2005-05-16 2006-09-25 주식회사 포스코 Method of Determination of Surface Quality of Steel Plate Using Surface Defect Information
US20080120585A1 (en) * 2006-11-21 2008-05-22 Kabushiki Kaisha Toshiba Delay fault test quality calculation apparatus, delay fault test quality calculation method, and delay fault test pattern generation apparatus
CN111410414A (en) * 2020-04-27 2020-07-14 江西财经大学 Implementation method of glass cutting optimization technology
CN114971186A (en) * 2022-04-25 2022-08-30 哈尔滨理工大学 Method for evaluating integrity of machined surface
CN116000474A (en) * 2023-03-08 2023-04-25 杭州乾瑭云科技有限公司 A method and system for nesting and typesetting mixed edge analysis based on laser cutting
CN117708608A (en) * 2023-12-13 2024-03-15 杭州杭叉精密制造有限公司 Typesetting method, typesetting device, typesetting equipment and typesetting medium for plate sleeve
CN117700090A (en) * 2023-12-28 2024-03-15 广东南亮艺术玻璃科技股份有限公司 Glass cutting typesetting method with high utilization rate
CN118013923A (en) * 2024-04-02 2024-05-10 江西理工大学 A PCB automatic layout result detection method based on OpenGL
CN118794962A (en) * 2024-06-19 2024-10-18 深圳市黄金坞贵金属精炼有限公司 A product quality detection method and system for enamel colored porcelain

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