CN105363505B - A kind of cell capture of three-dimensional structure and release chip and preparation method thereof - Google Patents
A kind of cell capture of three-dimensional structure and release chip and preparation method thereof Download PDFInfo
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Abstract
本发明涉及一种三维结构的细胞捕获及释放芯片,包括上部盖片和下部基片,上层盖片的背面刻蚀有微流沟道,盖片的微流沟道两端分别设置入口和出口,基片上有一层壳聚糖薄膜,盖片和基片通过粘合剂粘合,利用这种结构可以捕获和释放细胞/颗粒,将待测液通过微流控芯片的三维结构通道,通过这种三维结构的高度特性进行捕获特定大小的细胞/颗粒,在捕获完成后通过特定的方法增大三维芯片内部沟道的高度,最终将细胞/颗粒释放。这种细胞的捕获与释放的操作方法方便,响应迅速,对细胞无损害,适用于微米尺度的细胞和颗粒的捕获和释放。本发明的制备方法工艺简单,制备出来的三维结构芯片具有微型化的特点,可广泛的用于分析领域。
The invention relates to a cell capture and release chip with a three-dimensional structure, comprising an upper cover and a lower substrate, a microflow channel is etched on the back of the upper cover, and inlets and outlets are respectively set at both ends of the microflow channel of the cover , there is a layer of chitosan film on the substrate, and the cover sheet and the substrate are bonded by an adhesive. This structure can capture and release cells/particles, and pass the liquid to be tested through the three-dimensional structure channel of the microfluidic chip. Through this The height characteristics of this three-dimensional structure are used to capture cells/particles of a specific size, and after the capture is completed, the height of the internal channel of the three-dimensional chip is increased by a specific method, and the cells/particles are finally released. The operation method of capturing and releasing cells is convenient, responds quickly, does not damage cells, and is suitable for capturing and releasing cells and particles in the micron scale. The preparation method of the invention has simple process, and the prepared three-dimensional structure chip has the characteristics of miniaturization, and can be widely used in the field of analysis.
Description
技术领域technical field
本发明涉及微流控芯片的制备方法,具体的是一种三维结构的细胞捕获与释放芯片,及采用该芯片来捕获和释放细胞的方法,适用于微米尺度的细胞和颗粒的捕获和释放。The invention relates to a preparation method of a microfluidic chip, in particular to a three-dimensional structure cell capture and release chip, and a method for capturing and releasing cells by using the chip, which is suitable for the capture and release of micron-scale cells and particles.
背景技术Background technique
微流芯片是微分析系统的核心,微流芯片的发明及应用给化学、食品、环境、医学等科学领域提供了很大的便利,促使了一些分析的微型化、集成化、自动化及便捷化。大大的节省了一些化学反应对贵重化学试剂的消耗,也大大的提高了分析效率、降低了费用。The microfluidic chip is the core of the microanalysis system. The invention and application of the microfluidic chip has provided great convenience to the scientific fields such as chemistry, food, environment, and medicine, and promoted the miniaturization, integration, automation and convenience of some analyzes . It greatly saves the consumption of some chemical reactions on expensive chemical reagents, and also greatly improves the analysis efficiency and reduces the cost.
通常捕获细胞的微流芯片主要是运用机械分离法、电诱导分离法和磁操控分离法。目前运用机械分离法制作的微流芯片,捕获效率达97%,但是也具有本身的一些缺点,其缺点可以概括为制作工艺复杂,孔道容易堵塞,不能满足大批量的检测需求。Usually, microfluidic chips that capture cells mainly use mechanical separation methods, electrical induction separation methods, and magnetic manipulation separation methods. At present, the microfluidic chip produced by mechanical separation method has a capture efficiency of 97%, but it also has some shortcomings. The shortcomings can be summarized as complicated manufacturing process, easy to block the channel, and cannot meet the needs of mass detection.
目前制备的微流芯片主要采用光刻和化学刻蚀。主要使用的材料有石英、玻璃和高聚物等,使用高聚物制作的微流芯片多采用光刻制备的方法,刻蚀出来的微流芯片沟道形状规则,且光刻的工艺复杂成本高,不宜推广应用。在玻璃及石英等硅基介质制作出来的微流芯片主要采用化学刻蚀的方法来制备,其制作出来的微流芯片稳定性好,使用寿命长。但是传统的化学刻蚀的方法刻蚀出来的微流芯片的沟道都很规则,无法刻蚀出具有特殊形状的微流沟道的微流芯片。传统的刻蚀方法不能够刻蚀出特殊形状沟道的微流芯片。Currently, microfluidic chips are mainly prepared by photolithography and chemical etching. The main materials used are quartz, glass, and polymers. Microfluidic chips made of polymers are mostly prepared by photolithography. The etched microfluidic chip channels have regular shapes, and the photolithography process is complicated and costly. High, not suitable for promotion and application. The microfluidic chips made of silicon-based media such as glass and quartz are mainly prepared by chemical etching. The microfluidic chips produced by them have good stability and long service life. However, the channels of the microfluidic chip etched by the traditional chemical etching method are very regular, and it is impossible to etch a microfluidic chip with a microfluidic channel of a special shape. Traditional etching methods cannot etch microfluidic chips with special-shaped channels.
发明内容Contents of the invention
本发明的目的在于克服上述现有技术的不足,提供一种三维结构的细胞捕获及释放芯片及其制备方法,其特点包括加工简单,不堵塞,效率高,适合大批量生产与检测芯片,具有良好的化学稳定性。另一个目的在于提供一种基于三维结构的芯片进行捕获及释放细胞的方法,捕获效率高,释放出的细胞完整度好。The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art, and provide a three-dimensional cell capture and release chip and its preparation method, which is characterized by simple processing, no clogging, high efficiency, suitable for mass production and detection chips, and has Good chemical stability. Another object is to provide a method for capturing and releasing cells based on a three-dimensional structure chip, which has high capture efficiency and good integrity of released cells.
为了实现上述目的,本发明解决上述技术问题所采用的技术方案是:In order to achieve the above object, the technical solution adopted by the present invention to solve the above technical problems is:
一种三维结构的细胞捕获及释放芯片,包括上部盖片和下部基片,上层盖片的背面刻蚀有微流沟道,盖片的微流沟道两端分别设置入口和出口,基片上有一层壳聚糖薄膜,盖片和基片通过粘合剂粘合。A cell capture and release chip with a three-dimensional structure, including an upper cover and a lower substrate. A microfluidic channel is etched on the back of the upper cover. The two ends of the microfluidic channel of the cover are respectively provided with inlets and outlets. There is a layer of chitosan film, and the cover sheet and base sheet are bonded by adhesive.
上述三维结构的细胞捕获及释放芯片制备方法,其步骤如下:The method for preparing the cell capture and release chip with the above three-dimensional structure, the steps are as follows:
(1)芯片的制备:(1) Chip preparation:
(a)基底的选择及清洗:选取盖片和基片的材料可以是硅片、石英或玻璃等硬质材料且至少有一个材料是透明的,将选择好的盖片和基片进行清洗,去除表面的油污等杂质;(a) Selection and cleaning of the substrate: The material of the selected cover and substrate can be hard materials such as silicon wafers, quartz or glass, and at least one of the materials is transparent. Clean the selected cover and substrate, Remove surface oil and other impurities;
(b)刻蚀掩膜处理:对清洗好的盖片和基片在50℃~100℃的烘箱中进行烘干处理,烘干处理之后在盖片的上下表面粘附耐化学腐蚀性的掩膜,通过激光切割,把即将要刻蚀的区域部分切出来,除去切割出来的防腐蚀掩膜,得到要刻蚀的区域;(b) Etching mask treatment: Dry the cleaned cover and substrate in an oven at 50°C to 100°C. After drying, adhere a chemical corrosion-resistant mask to the upper and lower surfaces of the cover. Film, by laser cutting, partly cut out the area to be etched, remove the cut anti-corrosion mask, and obtain the area to be etched;
掩膜处理的目的在于裸露出需要进行刻蚀的基片的一部分,把不需要进行刻蚀的基片的其他部分保护起来。The purpose of the mask treatment is to expose a part of the substrate that needs to be etched, and protect other parts of the substrate that do not need to be etched.
(c)湿法刻蚀:将处理好的盖片,通过夹具按照0.01mm/min-1mm/min的速率垂直缓慢的放入到刻蚀液中进行刻蚀,因为进入刻蚀液有先后顺序,所以导致刻蚀的时间不相同,导致了刻蚀的深度不同,从而盖片上刻蚀出的微流沟道为锲形的三维结构;(c) Wet etching: put the processed cover sheet into the etching solution vertically and slowly through the fixture at a rate of 0.01mm/min-1mm/min for etching, because there is a sequence of entering the etching solution , so the etching time is different and the etching depth is different, so the microfluidic channel etched on the cover sheet is a wedge-shaped three-dimensional structure;
(d)打孔:去除掉盖片表面的刻蚀掩膜,使整个盖片完整的裸露出来,盖片进行清洗处理之后对盖片进行打孔,在盖片的至少两个不同等高面的区域打孔,两个孔分别为入口孔和出口孔;(d) Punching: Remove the etching mask on the surface of the cover, so that the entire cover is completely exposed. After the cover is cleaned, the cover is punched. At least two different contours of the cover The area is punched, and the two holes are the entrance hole and the exit hole;
(e)壳聚糖薄膜的制备:使用脱乙酰度60%-95%的壳聚糖,使0.3g-2.0g壳聚糖融入体积为10ml的0.1mol/L醋酸溶液中,经过1.5-2.5h的搅拌形成壳聚糖胶体;使用移液枪吸取1ml-5ml壳聚糖凝胶溶液滴至基片上,将基片放置在匀胶机上,转速依次为800r/min和1500r/min,各转15s,均匀铺设后静置,直至胶体成膜;(e) Preparation of chitosan film: use chitosan with a deacetylation degree of 60%-95%, dissolve 0.3g-2.0g chitosan into a 0.1mol/L acetic acid solution with a volume of 10ml, and pass through 1.5-2.5 h stirring to form chitosan colloid; use a pipette to suck 1ml-5ml chitosan gel solution and drop it on the substrate, place the substrate on the homogenizer, and the rotating speed is 800r/min and 1500r/min successively, each rotating 15s, after laying evenly, let it stand until the colloid forms a film;
(f)盖片与基片的组合:基片和盖片贴合后,在它们的边沿涂上PDMS(polydimethylsiloxane,聚二甲基硅氧烷胶),等待10-20min后放入马弗炉进行加热,加热温度范围为200-450℃,便得到了基于三维结构的细胞捕获及释放芯片。(f) Combination of the cover sheet and the substrate: After the substrate and the cover sheet are bonded, coat their edges with PDMS (polydimethylsiloxane, polydimethylsiloxane glue), wait for 10-20 minutes and put them into the muffle furnace After heating, the heating temperature range is 200-450° C., and a cell capture and release chip based on a three-dimensional structure is obtained.
一种基于三维结构的芯片进行捕获及释放细胞的方法,其步骤如下:A method for capturing and releasing cells based on a chip with a three-dimensional structure, the steps of which are as follows:
(1)细胞的捕获:(1) Capture of cells:
(a)将待检测含有细胞的液体样本通过注射泵以0.01ul/min-1ul/min的速率从入口孔注入到键合完全的芯片中;(a) Inject the liquid sample containing cells to be detected into the fully bonded chip through the syringe pump at a rate of 0.01ul/min-1ul/min from the inlet hole;
(b)继续在入口注入磷酸盐缓冲溶液(即PBS溶液),以50-100ul/min的速度注入进行清洗;(b) Continue to inject phosphate buffer solution (i.e. PBS solution) at the inlet, and inject at a speed of 50-100ul/min for cleaning;
(c)在入口注入示踪物质(如:染细胞核的荧光染料如DAPI或者Hoechst染料)或加入免疫试剂,对目标细胞进行识别;(c) Inject tracer substances (such as: fluorescent dyes such as DAPI or Hoechst dyes that stain the nucleus) or add immune reagents at the entrance to identify target cells;
(d)再次在入口注入磷酸盐缓冲溶液进行清洗,将芯片放置在显微镜下观察捕获的目标细胞;(d) Inject phosphate buffer solution at the inlet again for cleaning, and place the chip under a microscope to observe the captured target cells;
(2)细胞的释放:(2) Release of cells:
(a)芯片捕获到特定捕获大小的细胞卡在相应的位置,其他的细胞由出口流出芯片;(a) The chip captures cells with a specific capture size stuck in the corresponding position, and other cells flow out of the chip through the outlet;
(b)在芯片入口注入体积分数为3%-5%的醋酸溶液,通入速度为50ul/min-80ul/min;(b) Inject an acetic acid solution with a volume fraction of 3%-5% at the inlet of the chip at a rate of 50ul/min-80ul/min;
(c)继续在入口注入磷酸盐缓冲溶液(即PBS溶液),以50-100ul/min的速度注入进行清洗,芯片中壳聚糖薄膜被溶解掉,芯片内部高度变大,被捕获住的细胞有芯片的出口处被冲出来。(c) Continue to inject phosphate buffer solution (ie PBS solution) at the inlet, inject at a speed of 50-100ul/min for cleaning, the chitosan film in the chip is dissolved, the height inside the chip becomes larger, and the captured cells There were chips flushed out at the exit.
由于采用了以上技术方案,本发明改变了以往只针对不同细胞尺寸制作不同芯片的情况且该情况经常发生阻塞。本发明的制备方法,加工工艺简单,制备出来捕获和释放细胞/颗粒的芯片具有微型化结构的特点,捕获时间短且效率高,可广泛的用于分析领域。Due to the adoption of the above technical solution, the present invention changes the previous situation where different chips are only made for different cell sizes and blockages often occur in this situation. The preparation method of the present invention has simple processing technology, and the prepared chip for capturing and releasing cells/particles has the characteristics of miniaturized structure, short capturing time and high efficiency, and can be widely used in the field of analysis.
附图说明Description of drawings
图1.芯片的俯视图。Figure 1. Top view of the chip.
图2.芯片的剖视图。Figure 2. Cross-sectional view of the chip.
图3.芯片捕获细胞后的剖视图。Figure 3. Cross-sectional view of the chip after capturing cells.
图4.芯片捕获细胞后的俯视图。Figure 4. The top view of the chip after capturing cells.
图5.芯片细胞释放剖视图。Figure 5. Cross-sectional view of chip cell release.
图6.芯片细胞释放俯视图。Figure 6. Top view of chip cell release.
其中:1-盖片,2-基底,3-入口,4-微流沟道,5-出口,6-壳聚糖薄膜,7-ctc循环肿瘤细胞。Among them: 1-cover sheet, 2-substrate, 3-inlet, 4-microfluidic channel, 5-outlet, 6-chitosan film, 7-ctc circulating tumor cells.
具体实施方式detailed description
下面结合实施实例对本发明进行进一步说明。The present invention will be further described below in conjunction with implementation examples.
实施例1:Example 1:
如图1-2所示,一种三维结构的细胞捕获及释放芯片,包括上部盖片1和下部基片2,上层盖片1的背面刻蚀有微流沟道4,盖片1的微流沟道4两端分别设置入口3和出口4,基片2上有一层壳聚糖薄膜6,盖片1和基片2通过粘合剂粘合。As shown in Figure 1-2, a cell capture and release chip with a three-dimensional structure includes an upper cover 1 and a lower substrate 2, the back of the upper cover 1 is etched with a microfluidic channel 4, and the microfluidic channel 4 of the cover 1 An inlet 3 and an outlet 4 are respectively arranged at both ends of the flow channel 4 , a layer of chitosan film 6 is provided on the substrate 2 , and the cover sheet 1 and the substrate 2 are bonded by an adhesive.
上述三维结构的细胞捕获及释放芯片的制备方法,步骤如下:The preparation method of the cell capture and release chip with the above three-dimensional structure, the steps are as follows:
(a)选取盖片和基片的材料玻璃或者硅片或者石英,将选择好的盖片和基片进行清洗,去除表面的油污等杂质;(a) Select glass, silicon wafer or quartz as the material of the cover and substrate, and clean the selected cover and substrate to remove impurities such as oil on the surface;
(b)对清洗好的盖片和基片在50℃~100℃的烘箱中进行烘干处理,烘干处理之后在盖片的上下表面粘附耐化学腐蚀性的掩膜,通过激光切割,把即将要刻蚀的区域部分切出来,除去切割出来的防腐蚀掩膜,得到要刻蚀的区域;(b) Dry the cleaned cover and substrate in an oven at 50°C to 100°C. After drying, adhere a chemical-resistant mask to the upper and lower surfaces of the cover, and cut it by laser. Cut out part of the area to be etched, remove the anti-corrosion mask cut out, and obtain the area to be etched;
(c)将处理好的盖片,通过夹具按照或0.5mm/min的速率垂直缓慢的放入到刻蚀液中进行刻蚀,从盖片进入刻蚀液到刻蚀完成,总共耗时为1小时,因为进入刻蚀液有先后顺序,所以导致刻蚀的时间不相同,导致了刻蚀的深度不同,从而盖片上刻蚀出的微流沟道为锲形的三维结构;(c) Put the processed cover sheet into the etchant vertically and slowly at a rate of 0.5mm/min through the fixture for etching. From the cover sheet entering the etching solution to the completion of etching, the total time-consuming is 1 hour, because there is a sequence of entering the etching solution, the etching time is different, resulting in different etching depths, so the microfluidic channel etched on the cover sheet is a wedge-shaped three-dimensional structure;
所述的刻蚀液为典型的缓冲氧化硅蚀刻液,其中含氟化铵,(BOE: Buffer OxideEtcher)与去离子水按1:10的质量比例勾兑而成。The etching solution is a typical buffered silicon oxide etching solution, which contains ammonium fluoride (BOE: Buffer OxideEtcher) and deionized water in a mass ratio of 1:10.
(d)去除掉盖片表面的刻蚀掩膜,使整个盖片和基片完整的裸露出来,对盖片和基片进行清洗处理之后,对盖片进行打孔,在盖片的至少两个不同等高面的区域打孔,直径为0.6mm,两个孔分别为入口孔和出口孔;(d) Remove the etching mask on the surface of the cover sheet, so that the entire cover sheet and the substrate are completely exposed. After cleaning the cover sheet and the substrate, punch holes in the cover sheet. Drill holes in areas with different contours, with a diameter of 0.6mm, and the two holes are the entrance hole and the exit hole;
(e)使用脱乙酰度60%-95%的壳聚糖,使0.3g壳聚糖融入体积为10ml的0.1mol/L醋酸溶液中,经过2h的搅拌形成壳聚糖胶体;使用移液枪吸取1ml-5ml壳聚糖凝胶溶液滴至下片上,将下片放置在匀胶机上,转速依次为800r/min和1500r/min,各转15s,均匀铺设后静置,直至胶体成膜;(e) Use chitosan with a deacetylation degree of 60%-95%, dissolve 0.3g chitosan into a 0.1mol/L acetic acid solution with a volume of 10ml, and stir for 2 hours to form a chitosan colloid; use a pipette gun Draw 1ml-5ml of chitosan gel solution and drop it on the lower piece, place the lower piece on the glue homogenizer, the rotation speed is 800r/min and 1500r/min, each turn for 15s, lay it evenly and let it stand until the colloid forms a film;
(f)基片和盖片贴合后,在它们的边沿涂上PDMS(polydimethylsiloxane,聚二甲基硅氧烷胶),等待15min后放入马弗炉进行加热,加热温度范围为300℃处理,便得到了基于三维结构的细胞捕获及释放芯片。(f) After the substrate and the cover are bonded, coat their edges with PDMS (polydimethylsiloxane, polydimethylsiloxane glue), wait for 15 minutes and put them into the muffle furnace for heating. The heating temperature range is 300°C. , the cell capture and release chip based on the three-dimensional structure was obtained.
实施例2:Example 2:
一种三维结构的细胞捕获及释放芯片的制备方法,步骤如下:A method for preparing a three-dimensional cell capture and release chip, the steps are as follows:
(a)选取盖片和基片的材料或玻璃为玻璃或者硅片或者石英,将选择好的盖片和基片进行清洗,去除表面的油污等杂质;(a) Select the material or glass of the cover and substrate as glass, silicon wafer or quartz, and clean the selected cover and substrate to remove impurities such as oil stains on the surface;
(b)对清洗好的盖片和基片在50℃~100℃的烘箱中进行烘干处理,烘干处理之后在盖片的上下表面粘附耐化学腐蚀性的掩膜,通过激光切割,把即将要刻蚀的区域部分切出来,除去切割出来的防腐蚀掩膜,得到要刻蚀的区域;(b) Dry the cleaned cover and substrate in an oven at 50°C to 100°C. After drying, stick a chemical-resistant mask on the upper and lower surfaces of the cover, and cut it by laser. Cut out part of the area to be etched, remove the anti-corrosion mask cut out, and obtain the area to be etched;
(c)将处理好的盖片,通过夹具按照0.01mm/min或0.1mm/min或0.25mm/min或0.75mm/min或1mm/min的速率垂直缓慢的放入到刻蚀液中进行刻蚀,刻蚀1小时,因为进入刻蚀液有先后顺序,所以导致刻蚀的时间不相同,导致了刻蚀的深度不同,从而盖片上刻蚀出的微流沟道为锲形的三维结构;(c) Put the processed cover sheet into the etching solution vertically and slowly at the rate of 0.01mm/min or 0.1mm/min or 0.25mm/min or 0.75mm/min or 1mm/min through the fixture for etching Etching, etch for 1 hour, because there is a sequence of entering the etching solution, so the etching time is different, resulting in different etching depths, so the microfluidic channel etched on the cover sheet is a wedge-shaped three-dimensional structure ;
所述的刻蚀液为典型的缓冲氧化硅蚀刻液,其中含氟化铵,(BOE: Buffer OxideEtcher)与去离子水按1:10的质量比例勾兑而成。The etching solution is a typical buffered silicon oxide etching solution, which contains ammonium fluoride (BOE: Buffer OxideEtcher) and deionized water in a mass ratio of 1:10.
(d)去除掉盖片表面的刻蚀掩膜,使整个盖片和基片完整的裸露出来,对盖片和基片进行清洗处理之后,对盖片进行打孔,在盖片的至少两个不同等高面的区域打孔,直径为0.6mm,两个孔分别为入口孔和出口孔;(d) Remove the etching mask on the surface of the cover sheet, so that the entire cover sheet and the substrate are completely exposed. After cleaning the cover sheet and the substrate, punch holes in the cover sheet. Drill holes in areas with different contours, with a diameter of 0.6mm, and the two holes are the entrance hole and the exit hole;
(e)使用脱乙酰度60%-95%的壳聚糖,使0.5g或0.8g或1g或1.5g或2g壳聚糖融入体积为10ml的0.1mol/L醋酸溶液中,经过1.5或2.5h的搅拌形成壳聚糖胶体;使用移液枪吸取1ml-5ml壳聚糖凝胶溶液滴至下片上,将下片放置在匀胶机上,转速依次为800r/min和1500r/min,各转15s,均匀铺设后静置,直至胶体成膜;(e) Using chitosan with a deacetylation degree of 60%-95%, dissolve 0.5g or 0.8g or 1g or 1.5g or 2g of chitosan into a volume of 10ml of 0.1mol/L acetic acid solution, after 1.5 or 2.5 h stirring to form chitosan colloid; use a pipette to suck 1ml-5ml chitosan gel solution and drop it on the lower piece, place the lower piece on the glue homogenizer, the rotating speed is 800r/min and 1500r/min successively, each turn 15s, after laying evenly, let it stand until the colloid forms a film;
(f)基片和盖片贴合后,在它们的边沿涂上PDMS(polydimethylsiloxane,聚二甲基硅氧烷胶),等待100min或20min后放入马弗炉进行加热,加热温度范围为200℃或350℃或400℃或450℃处理,便得到了基于三维结构的细胞捕获及释放芯片。(f) After the substrate and the cover are attached, coat their edges with PDMS (polydimethylsiloxane, polydimethylsiloxane glue), wait for 100min or 20min and put them into the muffle furnace for heating. The heating temperature range is 200 °C or 350 °C or 400 °C or 450 °C, the cell capture and release chip based on the three-dimensional structure is obtained.
实施例3:Example 3:
一种基于三维结构的芯片进行捕获及释放细胞的方法,其步骤如下:A method for capturing and releasing cells based on a chip with a three-dimensional structure, the steps of which are as follows:
(1)如图3-4所示,细胞的捕获:(1) As shown in Figure 3-4, the capture of cells:
(a)将待检测含有ctc循环肿瘤细胞的液体样本通过注射泵以0.51ul/min的速率从入口孔注入到实施例1的芯片中;(a) inject the liquid sample containing ctc circulating tumor cells to be detected into the chip of Example 1 through the syringe pump at a rate of 0.51ul/min from the inlet hole;
(b)继续在入口注入磷酸盐缓冲溶液(即PBS溶液),以50ul/min的速度注入进行清洗;(b) Continue to inject phosphate buffer solution (i.e. PBS solution) at the inlet, and inject at a speed of 50ul/min for cleaning;
(c)在入口注入示踪物质(如:染细胞核的荧光染料如DAPI或者Hoechst染料),对目标细胞进行识别;(c) Inject tracer substances (such as: fluorescent dyes such as DAPI or Hoechst dyes that stain the nucleus) at the entrance to identify target cells;
(d)再次在入口注入磷酸盐缓冲溶液进行清洗,将芯片放置在显微镜下观察捕获的目标细胞;(d) Inject phosphate buffer solution at the inlet again for cleaning, and place the chip under a microscope to observe the captured target cells;
(2)如图5-6所示,细胞的释放:(2) As shown in Figure 5-6, the release of cells:
(a)芯片捕获到特定捕获大小的细胞卡在相应的位置,其他的细胞由出口流出芯片;(a) The chip captures cells with a specific capture size stuck in the corresponding position, and other cells flow out of the chip through the outlet;
(b)在芯片入口注入体积分数为3%的醋酸溶液,通入速度为50ul/min;(b) Inject an acetic acid solution with a volume fraction of 3% at the inlet of the chip at a rate of 50ul/min;
(c)继续在入口注入磷酸盐缓冲溶液(即PBS溶液),以50ul/min的速度注入进行清洗,芯片中壳聚糖薄膜被溶解掉,芯片内部高度变大,被捕获住的细胞有芯片的出口处被冲出来。(c) Continue to inject phosphate buffer solution (i.e. PBS solution) at the inlet, and inject it at a speed of 50ul/min for cleaning. The chitosan film in the chip is dissolved, the height inside the chip becomes larger, and the captured cells have the chip The exit was flushed out.
捕获效率最高达到96%,通过将上述方法捕捉到的细胞通过显微镜进行观察,发现捕获到的细胞结构完整,无破损现象。采用的细胞捕获效率是通过最后停留在芯片中的细胞数量与实验开始时注入的与捕获细胞相同大小的细胞数量的比值来计算细胞的捕获效率的。The capture efficiency can reach up to 96%. By observing the cells captured by the above method through a microscope, it is found that the captured cells have a complete structure and no damage. The cell capture efficiency used was calculated as the ratio of the number of cells that ended up in the chip to the number of cells injected at the beginning of the experiment that were the same size as the captured cells.
实施例4:Example 4:
一种基于三维结构的芯片进行捕获及释放细胞的方法,其步骤如下:A method for capturing and releasing cells based on a chip with a three-dimensional structure, the steps of which are as follows:
(1)细胞的捕获:(1) Capture of cells:
(a)将待检测含有ctc循环肿瘤细胞的液体样本,通过注射泵以0.01ul/min或0.11ul/min或0.51ul/min或0.81ul/min或1ul/min的速率从入口孔注入到键合完全的芯片中;(a) The liquid sample containing ctc circulating tumor cells to be detected is injected into the key through the inlet hole at a rate of 0.01ul/min or 0.11ul/min or 0.51ul/min or 0.81ul/min or 1ul/min integrated into a complete chip;
(b)继续在入口注入磷酸盐缓冲溶液(即PBS溶液),以100ul/min的速度注入进行清洗;(b) Continue to inject phosphate buffer solution (i.e. PBS solution) at the inlet, and inject at a speed of 100ul/min for cleaning;
(c)在入口注入示踪物质(如:染细胞核的荧光染料如DAPI或者Hoechst染料),对目标细胞进行识别;(c) Inject tracer substances (such as: fluorescent dyes such as DAPI or Hoechst dyes that stain the nucleus) at the entrance to identify target cells;
(d)再次在入口注入磷酸盐缓冲溶液进行清洗,将芯片放置在显微镜下观察捕获的目标细胞;(d) Inject phosphate buffer solution at the inlet again for cleaning, and place the chip under a microscope to observe the captured target cells;
(2)细胞的释放:(2) Release of cells:
(a)芯片捕获到特定捕获大小的细胞卡在相应的位置,其他的细胞由出口流出芯片;(a) The chip captures cells with a specific capture size stuck in the corresponding position, and other cells flow out of the chip through the outlet;
(b)在芯片入口注入体积分数为4%或5%的醋酸溶液,通入速度为80ul/min;(b) Inject an acetic acid solution with a volume fraction of 4% or 5% at the inlet of the chip at a rate of 80ul/min;
(c)继续在入口注入磷酸盐缓冲溶液(即PBS溶液),以100ul/min的速度注入进行清洗,芯片中壳聚糖薄膜被溶解掉,芯片内部高度变大,被捕获住的细胞有芯片的出口处被冲出来。(c) Continue to inject phosphate buffer solution (i.e. PBS solution) at the inlet, and inject it at a speed of 100ul/min for cleaning. The chitosan film in the chip is dissolved, the height inside the chip becomes larger, and the captured cells have the chip The exit was flushed out.
捕获效率最高达到90%,通过将上述方法捕捉到的细胞通过显微镜进行观察,发现捕获到的细胞结构完整,无破损现象。采用的细胞捕获效率是通过最后停留在芯片中的细胞数量与实验开始时注入的与捕获细胞相同大小的细胞数量的比值来计算细胞的捕获效率的。The capture efficiency can reach up to 90%. By observing the cells captured by the above method through a microscope, it is found that the captured cells have a complete structure and no damage. The cell capture efficiency used was calculated as the ratio of the number of cells that ended up in the chip to the number of cells injected at the beginning of the experiment that were the same size as the captured cells.
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