CN104536266B - A kind of dry film photoresist layered product - Google Patents

Abstract

The invention discloses a dry film resist laminate, comprising a support layer, a first resist layer coated on the support layer, and a second resist layer coated on the first resist layer ; The acid value of the first resist layer is 80-400 mgKOH/g, and the acid value of the second resist layer is 2-41.2 mgKOH/g higher than the acid value of the first resist layer. The present invention adopts resists of double-layer structure with different acid values, and after exposure and development of the resists, a good pattern side profile is formed, and the unexposed pattern adhesive layer can be better removed. It can be used as a dry film resist laminate material for etching or plating in the fields of the manufacture of printed circuit boards, lead frames, etc., the manufacture of semiconductor packages, etc. After that, it has a very good shape of the side of the graphic line.

Description

A kind of dry film resist laminated body

technical field

The present invention relates to a dry film resist laminate that can be developed with an alkaline solution.

Background technique

Dry film resist laminates are widely used in processes such as etching and plating in the manufacture of printed circuit boards, lead frames, semiconductor packages, etc., and in the packaging of BGA (Ball Grid Array), CPS (Chip Size Package), etc. resist material. For example, when manufacturing a printed circuit board, first, a dry film resist laminate is laminated on a copper substrate, and the dry film resist laminate is covered with a patterned mask to expose it. After the pattern exposure, use The developer removes the unexposed parts, and then implements etching or electroplating to form a pattern, and finally removes the cured part with a remover, so as to realize pattern transfer.

In recent years, with the development of electronic equipment in the direction of lightness, thinness and shortness, the line size of printed circuit boards, lead frames and other graphics mounted on it has become smaller and smaller, and the contact area between the substrate and the resin composition that has been patterned is also decreasing. In order to manufacture such narrow-pitch circuit patterns with a higher yield rate, it is required that the dry film resist laminate has good resolution and side profile.

However, in the existing technology, after the pattern exposure and development, the unexposed pattern is close to the side root of the exposed part, due to reasons such as the dead angle of washing caused by the thin line, it is easy to have residual glue that cannot be washed away by lye. Subsequent etching or electroplating, and when the cured resist is finally removed, correspondingly, the copper lines form convex burrs and metal pits that are concave inward from the plating. When the gap between the graphic lines is narrower, the residual glue is more serious. In extreme cases, the glue surface between the lines has been removed, but there is still a thin layer of residual glue on the metal surface between the lines, and the resolution cannot be improved. . Although some improvements can be obtained by increasing the acid value of the resist layer and reducing the molecular weight of the alkali-soluble resin in the resist, the use of these methods also makes the side morphology of the graphic lines after development worse and becomes unsightly. Alkali washing resistance, the edges and corners of the lines become unclear.

Contents of the invention

The object of the present invention is to address the deficiencies in the prior art, and to provide a dry film resist laminate, which can be used in the fields of manufacture of printed circuit boards, lead frames, etc., semiconductor packaging, etc., metal precision machining, etc. As a dry film resist laminate material for etching or plating, after pattern exposure and development, it has very good pattern line side morphology.

The object of the present invention is achieved by the following technical solutions: a dry film resist laminate comprising a support layer, a first resist layer coated on the support layer and a first resist layer coated on the first resist layer The second resist layer above; the acid value of the first resist layer is 80-400mgKOH/g, the acid value of the second resist layer is 82-441.2mgKOH/g, and the second resist The acid value of the resist layer is 2-41.2 mgKOH/g higher than the acid value of the first resist layer.

Further, the thickness of the first resist layer is 5-50 microns, and the thickness of the second resist layer is 1-10 microns.

Further, the first resist layer and the second resist layer are composed of a carboxyl-containing alkali-soluble polymer with a mass fraction of 45-70%, a mass fraction of 15-45% of an alkali-soluble polymer containing at least one polymerizable The composition comprises a saturated bond monomer, a photoinitiator with a mass fraction of 0.5-10%, and an additive with a mass fraction of 0.01-5%.

Further, the carboxyl-containing alkali-soluble polymer is obtained by copolymerizing one or more carboxyl-containing comonomer monomers and one or more carboxyl-free comonomer monomers according to any ratio; The carboxyl group-containing copolymerization unit monomer is selected from itaconic acid, crotonic acid, acrylic acid, methacrylic acid, maleic acid half ester, maleic acid, fumaric acid, vinyl acetic acid and anhydride thereof, etc.; The copolymerization unit monomer not containing carboxyl group is selected from methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylate ) n-butyl acrylate, isobutyl (meth)acrylate, isooctyl (meth)acrylate, lauryl (meth)acrylate, octadecyl (meth)acrylate, 2-hydroxyl (meth)acrylate Ethyl ester, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, ( Meth)acrylonitrile, glycidyl (meth)acrylate, N,N-ethyl (meth)acrylate, N,N-diethyl (meth)acrylate, N,N-diethyl (meth)acrylate Propyl meth(meth)acrylate, N,N-diethyl(meth)propyl acrylate, N,N-dimethyl(meth)butyl acrylate, N,N-diethyl(meth)acrylate ) butyl acrylate, (meth)acrylamide, N-methylol-acrylamide, N-butoxymethyl-acrylamide, styrene, benzyl (meth)acrylate, phenoxyethyl (meth)acrylamide base) acrylate, (alkoxylated) nonylphenol (meth)acrylate, etc.

Further, the weight average molecular weight of the carboxyl-containing alkali-soluble polymer is 10,000-200,000, more preferably 10,000-120,000.

Further, the monomer containing at least one polymerizable unsaturated bond is selected from trimethylolpropane triacrylate, (ethoxy) propoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate, Pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, ethoxylated bisphenol A diacrylate, propoxylated Hydroxylated bisphenol A diacrylate, glycerol tripropionate.

Further, the photoinitiator is 2,4,5-triaryl imidazole dimer or a derivative of 2,4,5-triaryl imidazole dimer.

Further, the photoinitiator is formed by mixing initiator auxiliary agent and 2,4,5-triaryl imidazole dimer or derivatives of 2,4,5-triaryl imidazole dimer in any ratio; The initiator auxiliary agent is one or more of aromatic ketones, quinones, benzoin compounds, benzil derivatives, acridine derivatives, N-phenylaminoacetic acid derivatives, coumarin compounds, and oxazole compounds. A variety of components are mixed in any ratio.

Further, the additives are composed of dyes, photocouplers, color-forming heat stabilizers, plasticizers, pigments, fillers, defoamers, flame retardants, stabilizers, leveling agents, peeling accelerators, antioxidants, spices, One or more of the imaging agent and the thermal crosslinking agent are mixed according to any proportion.

The beneficial effect of the present invention is that: the present invention adopts the resist of double-layer structure with different acid values, and after the resist is exposed and developed, a good graphic side profile is formed, and the unexposed graphic adhesive layer can be better removed .

Detailed ways

A dry film resist laminate of the present invention comprises a support layer, a first resist layer coated above the support layer, and a second resist layer coated above the first resist layer; The acid value of the first resist layer is 80-400mgKOH/g, the acid value of the second resist layer is 82-441.2mgKOH/g, and the acid value of the second resist layer is higher than that of the first resist The acid value of the agent layer is 2-41.2mgKOH/g higher.

The present invention adopts resists of double-layer structure with different acid values, so that after the resist is exposed and developed, it can form a good pattern side shape, and the unexposed pattern adhesive layer can be removed better.

The thickness of the first resist layer is 5-50 microns, and the thickness of the second resist layer is 1-10 microns.

The above-mentioned first resist layer and the second resist layer are composed of carboxyl-containing alkali-soluble polymer (A), containing at least one polymerizable unsaturated bond monomer (B), photoinitiator (C), additive ( D) Composition.

1. the consumption of described carboxyl-containing alkali-soluble polymer (A) accounts for 45-70% of total resist weight; In the first resist layer and the second resist layer, due to carboxyl-containing alkali-soluble polymer The amount of the substance is different or the acid value of the carboxyl-containing alkali-soluble polymer is different, resulting in a difference in the acid value of the two. The acid value of the two layers can be controlled by increasing or decreasing the amount of A; or when synthesizing A, increasing or decreasing the amount of carboxyl-containing monomers. Carboxyl-containing alkali-soluble polymers are obtained by copolymerization of one or more carboxyl-containing comonomer monomers and one or more carboxyl-free comonomer monomers in any proportion; its preparation method can be obtained by known Preparation methods, such as solution polymerization, suspension polymerization, etc. Wherein, the copolymerization unit monomer containing carboxyl group is selected from itaconic acid, crotonic acid, acrylic acid, methacrylic acid, maleic acid half ester, maleic acid, fumaric acid, vinyl acetic acid and its anhydride, etc.; The copolymerization unit monomer not containing carboxyl group is selected from methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylate ) n-butyl acrylate, isobutyl (meth)acrylate, isooctyl (meth)acrylate, lauryl (meth)acrylate, octadecyl (meth)acrylate, 2-hydroxyl (meth)acrylate Ethyl ester, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, ( Meth)acrylonitrile, glycidyl (meth)acrylate, N,N-ethyl (meth)acrylate, N,N-diethyl (meth)acrylate, N,N-diethyl (meth)acrylate Propyl meth(meth)acrylate, N,N-diethyl(meth)propyl acrylate, N,N-dimethyl(meth)butyl acrylate, N,N-diethyl(meth)acrylate ) butyl acrylate, (meth)acrylamide, N-methylol-acrylamide, N-butoxymethyl-acrylamide, styrene, benzyl (meth)acrylate, phenoxyethyl (meth)acrylamide base) acrylate, (alkoxylated) nonylphenol (meth)acrylate, etc.

The weight-average molecular weight of the carboxyl-containing alkali-soluble polymer is preferably 10,000-200,000, more preferably 120,000 or less in terms of developability, and preferably 10,000 or more in terms of improving resistance to edge and side corrosion.

In order to ensure that the acid value of the second resist layer is 2-41.2mgKOH/g higher than that of the first resist layer, the following two methods are all feasible: increase the amount of alkali-soluble polymer A in the second resist layer ; Or when synthesizing A used in the second resist layer, increase the amount of carboxyl-containing monomer.

2. The amount of the above-mentioned monomer B containing at least one polymerizable unsaturated bond is preferably 15% or more of the weight of the resist from the perspective of improving the photosensitivity, and is preferably 15% or more of the resist weight from the perspective of the final alkali wash-off film. 45% or less of the weight of the etchant. Containing at least one polymerizable unsaturated bond monomer selected from trimethylolpropane triacrylate, (ethoxy) propoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, di Pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, ethoxylated bisphenol A diacrylate, propoxylated bisphenol A diacrylate Acrylates, Tripropionate. From the viewpoint of development and resolution, (ethoxy)propoxylated trimethylolpropane triacrylate, (ethoxy)propoxylated bisphenol A diacrylate, and polyethylene glycol diacrylate are preferable. Alternative commercial monomers can be selected, for example, Sartomer brand SR454, CD542, SR602, SR541, SR480, SR252, SR644, etc.

The types and amounts of monomers containing at least one polymerizable unsaturated bond used in the first resist layer and the second resist layer may be the same or different.

3. The amount of the above-mentioned photoinitiator C is 0.5-10% of the weight of the resist. When the amount of the photoinitiator is lower than 0.5%, its photosensitivity becomes poor; when the amount of the photoinitiator is higher than 10%, it may cause photosensitivity Dry film resolution is reduced. The photoinitiator is 2,4,5-triaryl imidazole dimer or a derivative of 2,4,5-triaryl imidazole dimer. For example, 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis(methoxyphenyl)imidazole dimer , 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methyl Oxyphenyl)-4,5-diphenylimidazole dimer, etc.

The initiator can also contain initiator auxiliary agent, initiator auxiliary agent can be listed, thioxanthone, benzoin phenyl ether, diphenmethanone, benzoin methyl ether, N,N'-tetra Methyl-4,4'-diaminobenzophenone (Michler's ketone), N,N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'- Dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-methyl-1-[4-(methyl Aromatic ketones such as thio)phenyl]-2-morpholino-acetone-1, 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2- Benzoanthraquinone, 2,3-Benzoanthraquinone, 2-Phenylanthraquinone, 2,3-Diphenylanthraquinone, 1-Chloroanthraquinone, 2-Methylanthraquinone, 1,4-Naphthoquinone , 9,10-phenanthrene quinone, 2-methyl 1,4-naphthoquinone, 2,3-dimethyl anthraquinone and other quinones, benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether and other benzoin ether compounds, benzoin , methyl benzoin, ethyl benzoin and other benzoin compounds, benzil derivatives such as benzil dimethyl ketal, 9-phenylacridine, 1,7-bis(9,9'-acridine) heptane Acridine derivatives, N-phenylaminoacetic acid derivatives such as N-phenylaminoacetic acid, coumarin-based compounds, oxazole-based compounds, etc.

The types and amounts of initiators used in the first resist layer and the second resist layer may be the same or different.

4. In addition to the above ingredients, additive D can be added as needed. Additive D accounts for 0.01-5% by weight of the resist. Additives are dyes such as malachite green, light couplers such as colorless crystal violet, color forming heat stabilizers, plasticizers, pigments, fillers, defoamers, flame retardants, stabilizers, leveling agents, peeling accelerators, anti-foaming agents, etc. A mixture formed by mixing one or more of oxidizing agents, fragrances, imaging agents, thermal crosslinking agents, etc. in any proportion.

The types and amounts of additives used in the first resist layer and the second resist layer may be the same or different.

In the dry film resist laminate of the present invention, the carboxyl-containing alkali-soluble polymer, the monomer containing at least one polymerizable unsaturated bond, the photoinitiator, and the additive can be dissolved in methanol, ethanol, isopropyl Alcohol, acetone, butanone, methyl cellosolve, toluene, N,N-dimethylformamide, propylene glycol methyl ether, propylene glycol methyl ether acetate and other solvents or mixed solvents of these solvents, with a solid content of 10-80 % solution state use.

The dry film resist laminate of the present invention can be obtained by the following methods: for example, prepare the solution of the first resist layer and the solution of the second resist layer respectively, and coat the second resist layer on a colorless support with a certain thickness. a resist layer solution and dry it. After drying, continue to coat the solution of the second resist layer on the first resist layer and dry it.

As the coating method, known coating methods such as bar coater coating, reverse roll coater, gravure coater, comma coater, and curtain coater can be used. The drying method can adopt drying methods such as infrared drying and hot air drying. The drying temperature is 50-120°C for 1-30 minutes.

The above-mentioned solution for the first resist layer and the solution for the second resist layer may be applied at once by multilayer slide extrusion coating.

The above-mentioned colorless and transparent support can be low-density polyethylene, high-density polyethylene, polypropylene, polyester, polyethylene terephthalate, polycarbonate, polyarylate, and other films. For dry film resist laminates, polyethylene terephthalate, polyethylene, and polypropylene films are preferred as the support film in order to prevent moisture from affecting its properties and coating conditions.

The colorless transparent support is a polyethylene terephthalate film with a thickness of 10-100 μm, preferably 15-80 μm, more preferably 15-40 μm.

Next, a polymer cover film for protecting the dry film resist laminate is laminated on the above-mentioned coated dry film resist laminate to finally obtain a dry film. Like the transparent support film, the cover film is preferably a resin film with low moisture permeability and easy peeling, but may be transparent or opaque. The cover film is preferably a resin film such as polyethylene terephthalate, polyethylene, and polypropylene having a thickness of 5 to 100 μm.

The present invention will be further described below in conjunction with embodiment.

Embodiment (embodiment 1-5, comparative example 1-3)

(1) The following carboxylic acid-containing alkali-soluble polymer resin (A) was prepared.

Under a nitrogen atmosphere, add 120 milliliters of methyl ethyl ketone to a 500 milliliter four-necked flask equipped with a heating device, a stirring paddle, a serpentine condenser, a constant pressure dropping funnel and a thermometer, and add all the monomers used in the polymer formula. body, turn on the stirring device, and raise the temperature of the heating device to 80°C. Next, under a nitrogen atmosphere, a solution of 0.8 g of azobisisobutyronitrile in 30 ml of butanone was slowly added dropwise to the reaction flask, and the dropping process lasted for about 1.5 hours. After the dropwise addition was completed, the insulation was continued for 4 hours.

Then, 0.6g of azobisisobutyronitrile was dissolved in 40 milliliters of butanone, and was added dropwise to the reaction solution twice, each time of adding was 15 minutes. Just carry out the second dropwise addition. After the dropwise addition, continue to keep warm for 2 hours. Heating and stirring were stopped, cooled to room temperature, and the reaction solution was taken out to obtain an alkali-soluble polymer resin solution (A-1). The weight-average molecular weight of the alkali-soluble polymer resin was 110,000, and its solid content was measured to be 40.1%.

The same method was used to synthesize the alkali-soluble polymer resins A-2 to A-5. The mass ratio of the monomers used in the polymers, the weight-average molecular weight and solid content of the polymers obtained are shown in Table 1.

Table 1

(2) Prepare the following monomer (B) containing at least one polymerizable unsaturated bond:

B-1: Ethoxylated trimethylolpropane triacrylate (Sartomer monomer SR454, the number of ethoxy units is 3)

B-2: Ethoxylated bisphenol A diacrylate (Sartomer monomer SR602, the number of ethoxy units is 10)

B-3: Polyethylene glycol (600) diacrylate (Sartomer monomer SR252)

(3) Prepare the following photoinitiator (C)

C-1: 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer

C-2: 4,4'-bis(diethylamino)benzophenone

C-3: 2-Isopropylthioxanthone

(4) Prepare the following additive (D):

D-1: colorless crystal violet

D-2: Basic green pigment

D-3: Brilliant Green Pigment

D-4: Tribromomethyl sulfone

(5) Prepare the following solvent (E):

E-1: butanone

(6) Preparation of resist solution, as shown in Table 2.

Table 2

(7) After mixing evenly according to the ratio in Table 2, fully stir, mix, and defoam, respectively, and apply according to the coating method in Table 3.

table 3

Coating Use a bar coater to evenly coat the first resist layer solution on the surface of a polyethylene terephthalate film with a thickness of 18 μm as a support, and dry it in a blast drying oven at 90°C for 2 minutes. Then take it out to form a first resist layer with a thickness of about 20 μm, continue to use a bar coater to evenly coat the second resist layer solution on the surface of the resist composition 1 coating, and dry it in a blast drying oven at 90 ° C. Dry for another 2 minutes to finally form the second resist layer. The total thickness of the dry film resist layer is 25 μm (the thickness of the first resist layer is 20 μm, and the thickness of the second resist layer is 5 μm). Next, a 25-μm-thick polyethylene film was bonded to the surface of the resist layer as a protective layer to obtain a dry film resist laminate.

(8) Performance evaluation

1. Processing of the substrate surface: The substrate for photosensitivity and adhesion evaluation is carried out by wet polishing roller polishing on the surface of the copper-clad laminate with a thickness of 1.5mm and laminated with 35μm rolled copper foil, and then performing jet cleaning and polishing (jet cleaning) The pressure is 0.2MPa).

2. Lamination: At a roll temperature of 105°C, while peeling off the protective film of the dry film resist laminate, the resist is laminated on the surface processed and preheated to 60°C with a hot roll laminator. Copper-plated laminate. The pressure is controlled at 0.3Mpa, and the lamination speed is 1.5 m/min.

3. Exposure: Place the film with circuit graphics on the support, press it tightly, and use an ultra-high pressure mercury lamp to expose, and adjust the exposure energy until the 8th grid is exposed with a 21-grid exposure ruler (Stouffer Graphic Arts Equipment Co., Ltd.) .

4. Development: After peeling off the support above the above-mentioned exposed resist, spray 1.2% by mass sodium carbonate aqueous solution at 30° C. for a predetermined time to dissolve and remove the unexposed portion of the resist layer. The minimum time required for the complete dissolution of the resist layer in the unexposed part is taken as the minimum development time.

5. Evaluation of resolution: After removing the PE film of the produced photosensitive dry film resist laminate, a dry film was laminated on a copper plate with a heated press roll. Here, exposure is performed using a mask having a wiring pattern with a width of 1:1 between the exposed portion and the unexposed portion, and after developing at 1.5 times the minimum developing time, the minimum mask width at which the cured resist line is normally formed as a value for resolution.

◎: The resolution value is less than or equal to 15μm;

○: The resolution value is greater than 15 μm and less than or equal to 20 μm

△: resolution value greater than 20μm

6. Evaluation of pattern side profile: After removing the PE film of the manufactured photosensitive dry film resist laminate, a dry film was laminated on a copper plate using a heated press roll. Here, exposure was performed using a mask having a wiring pattern with a width of 15 μm in both the exposed portion and the unexposed portion. After developing at 1.5 times the minimum developing time, lines of the cured resist were normally formed, and observed through a microscope. Whether to remove the exposed part of the line. The width of the residual glue perpendicular to the line and parallel to the surface of the copper foil is evaluated, and the maximum width of the residual glue is found along the line. The smaller the maximum width of the residual glue, the better the performance.

◎: The size of residual glue is less than or equal to 0.5μm;

○: The size of the residual glue is greater than 0.5 μm and less than or equal to 2 μm;

△: The size of the residual glue is greater than 2 μm;

The evaluation results are shown in Table 4.

From the above test results, it can be seen that the present invention can provide a photosensitive dry film resist laminate, which can be used as a corrosion resist in the fields of printed circuit boards, lead frames, semiconductor packaging, photovoltaic cells, and metal precision processing. Agent materials, especially for narrow-pitch graphic circuits, can obtain better graphic side morphology after development, which is conducive to the improvement of resolution.

Claims (7)

1. a kind of dry film photoresist layered product, which is characterized in that including supporting layer, coated on the first resist above supporting layer Layer and coated on the second resist layer above the first resist layer；The acid value of first resist layer be 105.2 ~ 128.6 mgKOH/g, the acid value of the second resist layer are 115.2 ~ 154.4mgKOH/g, also, the acid value of the second resist layer It is higher 2 ~ 41.2mgKOH/g than the first resist layer acid value；

The first resist layer thickness is 5 ~ 50 microns, and the second resist layer thickness is 1-10 microns；

Carboxylic alkali-soluble polymer that first resist layer and the second resist layer are 45 ~ 70% by mass fraction, Mass fraction be 15 ~ 45% containing at least one polymerizable unsaturated bond monomer, mass fraction be 0.5 ~ 10% it is light-initiated Agent, the additive that mass fraction is 0.01 ~ 5% form.

2. dry film photoresist layered product according to claim 1, which is characterized in that the carboxylic alkali-soluble polymerization Object by the copolymerization units monomer of one or more carboxylic copolymerization units monomers and one or more not carboxyl groups according to Arbitrary proportioning is copolymerized and obtains；The carboxylic copolymerization units monomer be selected from itaconic acid, crotonic acid, acrylic acid, methacrylic acid, Maleic acid half ester, maleic acid, fumaric acid, vinyl acetic acid and its acid anhydrides；The copolymerization list of the not carboxyl group First monomer is selected from（Methyl）Methyl acrylate,（Methyl）Ethyl acrylate,（Methyl）Propyl acrylate,（Methyl）Acrylic acid isopropyl Ester,（Methyl）N-butyl acrylate,（Methyl）Isobutyl acrylate,（Methyl）Isooctyl acrylate monomer,（Methyl）Lauryl Ester,（Methyl）Octadecyl acrylate,（Methyl）2-Hydroxy ethyl acrylate,（Methyl）2-hydroxypropyl acrylate,（Methyl） Acrylic acid -4- hydroxybutyls, polyethyleneglycol（Methyl）Acrylate, polypropylene glycol list（Methyl）Acrylate,（Methyl）Third Alkene nitrile,（Methyl）Glycidyl acrylate, N, N- dimethyl（Methyl）Ethyl acrylate, N, N- diethyl（Methyl）Acrylic acid Ethyl ester, N, N- dimethyl（Methyl）Propyl acrylate, N, N- diethyl（Methyl）Propyl acrylate, N, N- dimethyl（Methyl）Third Olefin(e) acid butyl ester, N, N- diethyl（Methyl）Butyl acrylate,（Methyl）Acrylamide, N- methylols-acrylamide, N- butoxy Methyl-propen amide, styrene,（Methyl）Benzyl acrylate, Phenoxyethyl（Methyl）Acrylate, nonyl phenol（Methyl） Acrylate.

3. dry film photoresist layered product according to claim 2, which is characterized in that the carboxylic alkali-soluble polymerization The weight average molecular weight of object is 10000-200000.

4. dry film photoresist layered product according to claim 1, which is characterized in that described containing at least one polymerizable Unsaturated bond monomer, selected from trimethylolpropane trimethacrylate, propoxylation trimethylolpropane trimethacrylate, Ji Wusi Alcohol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, two Six acrylate of pentaerythrite, polyethyleneglycol diacrylate, polypropyleneglycol diacrylate, bis- propylene of Ethoxylated bisphenol A Acid esters, propoxylated bisphenol diacrylate, glycerin tripropionate.

5. dry film photoresist layered product according to claim 1, which is characterized in that the photoinitiator is 2,4,5- tri- virtues The derivative of base imidazoles dimer or 2,4,5- triarylimidazoles dimers.

6. dry film photoresist layered product according to claim 1, which is characterized in that the photoinitiator is by initiator aid It is mixed according to arbitrary ratio with the derivative of 2,4,5- triarylimidazoles dimer or 2,4,5- triarylimidazoles dimers；Institute Initiator aid is stated by aromatic ketone, quinone, benzoin compound, benzil derivatives, acridine derivatives, N- phenyl amino second Acid derivative, coumarin series compounds, one or more in oxazole based compound are according to arbitrary than mixing composition.

7. dry film photoresist layered product according to claim 1, which is characterized in that the additive is by dyestuff, light quality Agent, plasticizer, pigment, filler, antifoaming agent, fire retardant, stabilizer, levelling agent, stripping accelerating agent, antioxidant, fragrance, imaging It is one or more according to arbitrary proportioning mixing composition in agent, thermal cross-linking agent.